Navigation On Topic Complete Directory About Us Add-site Link to Us MerchantStore Shopping	Advertisement 500 Electronic - General Resources 10 European R+D Project Consortia Coordinate Efforts in Silicon Photonics Under the umbrella of the European Silicon Photonics Cluster, 10 European R+D project consortia coordinate their efforts in silicon photonics. Imec is involved in 7 of these consortia, which consist of research institutes, universities, and companies. The goal of the cluster is to build a unique photonics value chain, facilitating the transfer of knowledge and technology and strengthening Europe’s electronics industry. The cluster’s projects aim at introducing silicon photonics in innovative products. View Source August 19, 2010 Provides Information 24M Technologies Launches New Venture to Commercialize Next-Generation Energy Storage 24M Technologies launched today as a new venture focused on commercializing next-generation energy storage systems based on technology out of A123 Systems, a developer and manufacturer of advanced Nanophosphate lithium ion batteries and systems, and Massachusetts Institute of Technology (MIT). View Source August 17, 2010 Provides Information A ADA Technologies Awarded $70K Contract for Lithium-Ion Battery Research ADA Technologies, Inc. received a $70,000 contract from the U.S. Army to conduct research to further the development of advanced Lithium-ion (Li-ion) batteries for military applications. View Source July 20, 2010 Provides Information Adding a bit of graphene to battery materials could dramatically cut the time it takes to recharge electronics New battery materials developed by the Department of Energy's Pacific Northwest National Laboratory and Vorbeck Materials Corp. of Jessup, Md., could enable electric vehicles, power tools and even cell phones to recharge in minutes rather than hours. View Source July 14, 2010 Provides Information Advanced 28nm Chip Technology Development to be Discussed at GTC 2010 GLOBALFOUNDRIES today announced the lineup of keynote speakers for GTC 2010, the company’s inaugural Global Technology Conference. View Source August 5, 2010 Provides Information Advancement of Tiny MEMS Sensors Tiny sensors known as accelerometers are everywhere. The near-weightless technology can measure the impact of a dangerous tackle on a football player's helmet, control the flow of highway and runway traffic, analyze a golf pro's swing, orient the next generation of smart phones, and keeping fighter jets and missiles on target. View Source August 11, 2010 Provides Information Aehr Test Receives Follow-On Orders for WaferPak Contactors Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received approximately $2 million in follow-on orders for multiple FOX™-1 WaferPak contactors from a leading manufacturer of semiconductor memory devices. View Source August 6, 2010 Provides Information Air Products Signs Long-Term Supply Contract in Support of Samsung Austin's 300nm Semiconductor Manufacturing Air Products has announced it has been awarded two major contracts in support of Samsung Austin Semiconductor's expansion of its 300 mm semiconductor manufacturing facility in Austin, Tex. View Source July 26, 2010 Provides Information Air Products Unveils New Etching Gas for MEMS Market Air Products today announced the addition of xenon difluoride to its portfolio of electronic materials. XeF2 is used as an etching gas, primarily in the Micro Electro Mechanical Systems (MEMS) market. XeF2 provides manufacturers with a high selectivity to silicon versus SiO2 and other materials. View Source July 28, 2010 Provides Information AIXTRON Receives Multiple Order for MOCVD Tools from Chinese LED Manufacturer AIXTRON AG announced today a substantial multiple order for additional MOCVD tools from Yangzhou Longyao, a LED manufacturing company in Yangzhou, PR China. Yangzhou Longyao is a subsidiary of Rainbow Optoelectronics Material Shanghai Co. Ltd., China, a long time customer of AIXTRON MOCVD equipment. View Source August 12, 2010 Provides Information AIXTRON Receives Multiple Tool Order from Sanan OptoElectronics AIXTRON AG today announced a multiple tool order from Sanan OptoElectronics Co. Ltd., headquartered in Xiamen, China. The Sanan order for multiple CRIUS 31x2 inch tools was placed at the end of 2009. The local AIXTRON support team has successfully commissioned the new HB GaN LED growth reactors at Sanan’s new purpose-built facility in Tianjin in the first two quarters of 2010. View Source July 1, 2010 Provides Information AIXTRON Receives New Order for Six CRIUS II Deposition Systems from Hangzhou Silan Microelectronics AIXTRON AG announced today a new order for six CRIUS II 55x2-inch configuration deposition systems from Hangzhou Silan Microelectronics Co., Ltd., 'SILAN'. View Source July 6, 2010 Provides Information AIXTRON Receives Repeat Order From Philips Lumileds AIXTRON AG announced today that in the second quarter Philips Lumileds Lighting Company, a world leading manufacturer of high-power light emitting diodes (LEDs) and a solid-state lighting industry pioneer, has placed a repeat order for multiple AIX 2800G4 HT MOCVD reactors which will be used for the production of its LUXEON power LEDs. View Source August 17, 2010 Provides Information Aixtron to Form Hub of New INCT-DISSE Materials Project at University of Rio De Janeiro AIXTRON AG announced today a new order for one AIX 200, 1x2 inch configuration deposition system from the Pontificial Catholic University of Rio de Janeiro, Brazil. The new system will be delivered and installed at the Semiconductor Laboratory (LabSem) of the University. View Source August 19, 2010 Provides Information AIXTRON's Next Generation MOCVD Tools to Fill Sanan's Wuhu Fab AIXTRON AG today announced that it has signed a contract with Sanan Optoelectronics Co. Ltd., on the supply of a double digit number of multiple CRIUSR® II and AIX G5 MOCVD systems. The AIXTRON new generation MOCVD systems will be delivered between the fourth quarter of 2010 and the first quarter of 2011 and installed at Sanan's new manufacturing facilities in Wuhu, Anhui, China. View Source August 4, 2010 Provides Information Alchimer Secures Funding from Panasonic to Commercialize Nanoscale Deposition Technology Panasonic recognizes the potential of Alchimer's groundbreaking technology for depositing nanometric films used in IC interconnects and 3D through-silicon vias. Its investment arm, Pansonic Venture Group, recently invested in Alchimer. Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias, semiconductor interconnects, and other electronic applications, announced today that Panasonic Corporation has become an equity investor in the company. View Source July 13, 2010 Provides Information Altairnano Launches Application Kit to Increase Adoption of Its Advanced Lithium-Titanate Battery Technology Altair Nanotechnologies, Inc. (Altairnano), today announced the release of its Application Kit designed to give original equipment manufacturers (OEMs) the ability to apply its advanced lithium-titanate battery systems in a test environment simulating real-world operating conditions. View Source August 19, 2010 Provides Information Altairnano Unveils New Application Kit Targeting Original Equipment Manufacturers Altair Nanotechnologies, Inc., today announced the release of its Application Kit designed to give original equipment manufacturers the ability to apply its advanced lithium-titanate battery systems in a test environment simulating real-world operating conditions. View Source August 20, 2010 Provides Information Amazon.com 100 of the best selling electronic devices on the market to date. View Source   Provides Products Amazon: Kindle 3 is the Fastest-Selling Kindle Ever The new, sleeker Kindle may be a relatively minor upgrade compared to its predecessor, but it's making an impact where it counts the most: sales. View Source August 25, 2010 Provides Information American Digital Analog is dead. Do all of your home recording digitally, and let A.D. show you how. View Source   Provides Products Applied Materials Celebrates 20-Year Success of Endura System with New Innovations for Cutting-Edge Chip Designs Applied Materials, Inc. today celebrates the 20th year of its Applied Endura® platform, the most successful metallization system in the history of the semiconductor industry. Endura systems revolutionized semiconductor metallization by delivering breakthrough technologies and levels of reliability, serviceability and flexibility that far surpassed existing capabilities. The vast majority of microchips made in the last 20 years have been created using one of the over 4,500 Endura systems that have shipped across the globe to over 100 customers. View Source July 12, 2010 Provides Information Applied Materials Enables Advanced Microchip Designs with Breakthrough Flowable CVD Technology Applied Materials, Inc. today announced its breakthrough Applied Producer® Eterna™ FCVD™ (Flowable CVD) system, the first and only film deposition technology capable of electrically isolating the densely-packed transistors in 20nm-and-below memory and logic chip designs with a high-quality dielectric film. View Source August 24, 2010 Provides Information Applied Materials’ Endura System Marks 20 Years of Achievement Applied Materials, Inc. today celebrates the 20th year of its Applied Endura® platform, the most successful metallization system in the history of the semiconductor industry. View Source July 13, 2010 Provides Information Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via (TSV) technology for high-volume manufacturing. Seen as a critical technology for producing the world's future mobile devices, TSV structures connect multiple layers of stacked integrated circuits or chips (3D-ICs) to deliver a higher performance, more functional, smaller form factor package that consumes less power. View Source July 12, 2010 Provides Information Applied Materials Sees Record Adoption of New AdvantEdge Silicon Etch Technology Applied Materials, Inc. today unveiled its new Applied Centura® AdvantEdge® Mesa® system for creating nano-scale circuit features with angstrom-level precision in next-generation DRAM, Flash and Logic devices. As a result of this critical breakthrough in silicon etch technology, Applied has experienced very rapid demand for the AdvantEdge Mesa system. View Source July 12, 2010 Provides Information Applied Materials to Highlight Innovations for Enabling Future Electronic Devices Applied Materials, Inc. will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions at the Semicon West 2010, Intersolar North America and ASMC (Advanced Semiconductor Manufacturing Conference) events in San Francisco this week. View Source July 13, 2010 Provides Information Arima Selects Veeco MOCVD Systems to Support Production Ramp Veeco Instruments Inc. announced today that Arima Optoelectronics Corporation (AOC), a world-leading manufacturer of LED epitaxial wafers and chips headquartered in Taiwan, purchased multiple TurboDisc® K465i Gallium Nitride (GaN) and E475 Arsenic Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) Systems during the recently completed second quarter. View Source July 19, 2010 Provides Information ARM And TSMC Enter Strategic Agreement to Optimize TSMC's Most Advanced 28nm and 20nm Processes ARM and Taiwan Semiconductor Manufacturing Company, Ltd. today jointly announced a long-term agreement that provides TSMC with access to a broad range of ARM processors and enables the development of ARM physical IP across TSMC technology nodes. This agreement supports the companies' mutual customers to achieve optimized Systems-On-Chip (SoC) based on ARM processors and covers a wide range of process nodes extending down to 20nm. View Source July 20, 2010 Provides Information Asian Integrated Device Maker Orders Camtek’s Wafer Inspection Systems Camtek Ltd., announced today that it received follow-on order for multiple wafer inspection systems from a major Asian IDM. The systems will be installed during the third and fourth quarters of 2010. View Source August 19, 2010 Provides Information ATDF, UT Join Forces to Advance Nanoelectronic Technology in Texas ATDF, a wholly owned subsidiary of SEMATECH, and The University of Texas at Austin (UT), have joined forces to create the Advanced Processing and Prototyping Center (AP2C), a highly specialized R&D program designed to speed leading-edge nanoelectronic technology to the marketplace. View Source May 17, 2010 Provides Information Auto Calibration of MEMS Sensors Promises Next to Perfectly Precise Sensors In two papers presented at the meeting of the Society of Experimental Mechanics in Indianapolis and at the Nanotech 2010 Conference and Expo in Anaheim, California, Purdue University scientists detail a new mechanism that allows for precise automatic calibration of micro electromechanical systems (MEMS). View Source August 13, 2010 Provides Information B BATT program awards more than $8 million for innovative research projects on lithium battery anodes The Batteries for Advanced Transportation Technologies (BATT) Program has announced the funding of eight R&D projects on lithium battery anodes. BATT is funded by the Department of Energy's Office of Vehicle Technologies and is managed by the Lawrence Berkeley National Laboratory as part of its Carbon Cycle 2.0 initiative. View Source August 6, 2010 Provides Information Bayer MaterialScience Joins Holst Centre Flexible Electronics Research Bayer MaterialScience AG, one of the world's largest producers of polymers and high-performance plastics, and Holst Centre, an open-innovation initiative by research organizations IMEC (Belgium) and TNO (The Netherlands), have now announced their partnership in the field of flexible electronics. By joining the Holst Centre eco-system, Bayer exchanges its own expertise with the existing network of academic and industrial partners. View Source July 13, 2010 Provides Information Better displays ahead by vertically stacking electrowetting devices Sleek design and ease of use are just two of the main reasons consumers are increasingly attracted to tablets and e-readers. And these devices are only going to get better -- display technology improvements are on the way. Several e-reader products on the market today use electrophoretic displays, in which each pixel consists of microscopic capsules that contain black and white particles moving in opposite directions under the influence of an electric field. View Source August 10, 2010 Provides Information Boston Micromachines Honored for Development of MEMS-Based Instrument Boston Micromachines Corporation, a leading provider of MEMS-based deformable mirror (DM) products for adaptive optics systems, announced today that a collaboration with Lawrence Livermore National Laboratory, the University of California, Davis, and the Indiana University School of Optometry has received a 2010 R&D 100 award for the development of a MEMS-based Adaptive Optics Optical Coherence Tomography (AO-OCT) instrument. View Source July 19, 2010 Provides Information Breakthrough in Developing Climbing Robot A Stanford mechanical engineer is using the biology of a gecko's sticky foot to create a robot that climbs. In the same way the small reptile can scale a wall of slick glass, the Stickybot can climb smooth surfaces with feet modeled on the intricate design of gecko toes. View Source August 27, 2010 Provides Information Brian Toohey Takes Office as President of the Semiconductor Industry Association Brian C. Toohey took office today as president of the Semiconductor Industry Association (SIA). Toohey, 42, succeeds George Scalise, who has led the association since 1997. SIA is the voice of the U.S. semiconductor industry, America's number-one export industry over the past five years. View Source July 19, 2010 Provides Information BroadLight Announces the Launch of the 3rd Generation 40nm GPON Fiber Access Processor Family BroadLight, the leading supplier of fiber access processors, has announced the release of its 3rd Generation GPON Processor family. View Source August 3, 2010 Provides Information BroadPak Joins SOI (Silicon-On-Insulator) Industry Consortium The SOI Industry Consortium, aimed at accelerating silicon-on-insulator (SOI) innovation across broad markets, announced today that BroadPak has joined the worldwide organization. BroadPak is a premier provider of semiconductor package design and development services. The addition of BroadPak, with its unique silicon-package co-design methodology, expands opportunities for SOI chip developers to reduce product cost and improve chip and system performance without impacting chip development schedules. View Source May 6, 2010 Provides Information Brochure: Piezo Technology Made Affordable PI (Physik Instrumente) L.P – a leading manufacturer of piezo ceramic actuators and precision motion-control equipment for semiconductor, bio-medical and nanotechnology applications – has released a new brochure on Lever Amplified Piezo Flexure Actuators. View Source July 5, 2010 Provides Information Buried silver nanoparticles improve organic transistors Out of sight is not out of mind for a group of Hong Kong researchers who have demonstrated that burying a layer of silver nanoparticles improves the performance of their organic electronic devices without requiring complex processing. View Source August 10, 2010 Provides Information Buy Rite Electronics Online Source for consumer electronics. View Source   Provides Products C Cadence and IBM Team to Develop Faster, Higher Quality Systems-on-Chips Cadence Design Systems, Inc., the global leader in EDA360, today announced a joint development agreement with IBM to create high-performance integration-optimized IP that will help customers deliver leading-edge designs while reducing the risk and time associated with integrating complex SoC Designs. View Source May 24, 2010 Provides Information Cadence QRC Extraction Adopted by STMicroelectronics for 40nm Analog/Mixed-Signal Design Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that STMicroelectronics, a global leader in integrated circuits for communications, consumer, computer, automotive and industrial applications, has standardized on Cadence® QRC Extraction for their 40-nanometer custom/analog designs. A key component of the Cadence digital and analog/mixed signal design flow, QRC Extraction enables faster turnaround time, scalability through its multi-core backplane, increased accuracy to silicon and capabilities to address the needs for advanced layout parasitic extraction in leading-edge technology node design. View Source July 15, 2010 Provides Information Cambridge NanoTech and CIS Announce Advanced Material Research Collaboration Cambridge NanoTech, the world leader in Atomic Layer Deposition (ALD) science and equipment, today announced that they have partnered with Stanford University's Center for Integrated Systems (CIS), a partnership between academia and industry that supports leading edge research into semiconductor and advanced electronics. In addition, Stanford University is now outfitted with five Cambridge NanoTech ALD systems. View Source June 15, 2010 Provides Information CAMM Accepts CHA's Web Coater and Helps to Commercialize Flexible, Printed Electronics Binghamton University and The Flex Tech Alliance, a public/private partnership chartered with developing the flexible electronics and displays industry supply chain, today announced that the CHA Industries Web Coater has been accepted at the Center for Advanced Microelectronics Manufacturing (CAMM). View Source May 5, 2010 Provides Information Camtek Enters Agreement with IBM to Advance 3D Semiconductor Packaging Solutions Camtek Ltd., announced today that it has entered into a joint development agreement with IBM Corporation and will be joining a new industry alliance aimed at optimizing systems and processes for next-generation three-dimensional semiconductor packaging. Camtek has a significant role in providing advanced optical inspection and metrology R&D expertise for the new development program. View Source June 9, 2010 Provides Information Camtek Receives Order for Multiple Wafer Inspection Systems Camtek Ltd. announced today that it received follow-on orders for three wafer inspection systems from a major IDM (Integrated Device Maker) and chipmaker. The three systems will be installed during the third quarter of 2010. View Source July 22, 2010 Provides Information Carbon nanotubes as transistor material ETH Zurich researchers have built a transistor whose crucial element is a carbon nano-tube, suspended between two contacts, with outstanding electronic properties. A novel fabrication approach allowed the scientists to construct a transistor with no gate hysteresis. This opens up new ways to manufacture nano-sensors and components that consume particularly little energy. View Source July 21, 2010 Provides Information Carbon nanotubes turn glass fibers into multifunctional sensors Glass fibers are a widely used reinforcing agent for many materials, from polymers to concrete. The most prominent glass fiber composite is fiberglass, a glass-reinforced plastic. The performance of the glass fiber composite over time depends on the durability of the polymer matrix and the fiber fracture behavior of the material. View Source June 30, 2010 Provides Information Carl Zeiss Introduces Correlative Light and Electron Microscopy Solution for Life Sciences Carl Zeiss today introduced a unique hardware/software interface to connect light and scanning electron microscopes for correlative microscopy in the life sciences. The "Shuttle & Find" interface enables users to recall regions of interest in fixed specimens in an electron microscope, which were previously identified in a light microscope and vice versa. View Source August 26, 2010 Provides Information Carl Zeiss Offers Online Promotions - Discounts on Stereomicroscopy and Converting to 3D Imaging Carl Zeiss, a leading provider of microscopy solutions for a variety of research, clinical and industrial applications, recently announced two exciting online promotions. These special web promotions are now being extended through to August 31, 2010. These promotions include a price reduction on Zeiss's top-rated stereomicroscopy instrument and a 5 percent discount for conversion of certain existing models of Zeiss research microscopes into a 3D imaging workstation. View Source June 23, 2010 Provides Information Cascade Announces New Features for On-Wafer Measurements Cascade Microtech, Inc. today announced two new probe station features that allow semiconductor manufacturers to perform on-wafer measurements and collect data over a wide range of temperatures, reducing time inefficiencies and increasing productivity. View Source August 6, 2010 Provides Information CE.org As technology breakthroughs occur with accelerating frequency, so do questions of public policy, standards development, product marketing and training, which no single company-or even a small coalition of companies-can address on its own. View Source   Provides Information CEA-Leti and Nokia Research Center Develop Ultra-Wide Band Radio Front-end Circuit for Remotely Powered Memory Tag CEA-Leti and Nokia Research Center (NRC) have developed an RF front-end circuit that allows very high data rate content exchange between a reader - typically a mobile phone - and a memory tag. This circuit is currently used in the Nokia Explore and Share research prototype. View Source May 27, 2010 Provides Information CEA-Leti Building Europe's First 300mm R&D Line Dedicated to 3D-Integration Applications CEA-Leti today announced that it is has opened a complete 300mm fab extension dedicated to 3D-integration applications. Final equipment installations will continue through to the end of this year with an inauguration event planned in January, 2011. View Source July 12, 2010 Provides Information Centaur Designed New 65-nm Nano 3000 Processors Using Cadence Router Cadence Design Systems, Inc., the global leader in EDA360, today announced that VIA Technology's microprocessor subsidiary, Centaur Technology, achieved significant quality and time-to-market benefits by using the Cadence® Virtuoso® Space-Based Router on its latest set of processors. View Source May 4, 2010 Provides Information CERAM's New White Paper Highlights the Benefits of Surface Characterisation in the Semiconductor Industry CERAM, a global expert in materials testing, analysis and consultancy, has published a new white paper outlining the advantages of employing a range of modern surface characterisation techniques to obtain quantitative chemical and physical information on the structure and composition of semiconductor materials. View Source July 5, 2010 Provides Information CHAD Develops Tooling Options to Handle Smaller Sapphire Wafers CHAD Industries announced today that it has developed wafer-handling capabilities for Sapphire wafers used in the LED market. View Source August 4, 2010 Provides Information CHAD Industries, Veeco to Showcase Automated Wafer Inspection Solutions CHAD Industries announced today that it will exhibit automated LED wafer handling capabilities at the Semicon-Taiwan trade show next month. View Source August 20, 2010 Provides Information Cheap Sales Mall Cheap Sales for Wholesale, Cheap Sales for Customers, Why pay Retail-Buy Wholesale Cheap Sales for retailers, Big Deals way below dealer cost and change daily, Special Cheap Sales. View Source   Provides Products Cheaper substrates made of oxide materials Imagine building cheaper electronics on a variety of substrates -- materials like plastic, paper, or fabric. Researchers at Taiwan's National Chiao Tung University have made a discovery that opens this door, allowing them to build electronic components like diodes on many different substrates. They describe their findings in the journal Applied Physics Letters, published by the American Institute of Physics. View Source July 27, 2010 Provides Information Chemists, engineers fabricate the fastest graphene transistor to date Graphene, a one-atom-thick layer of graphitic carbon, has great potential to make electronic devices such as radios, computers and phones faster and smaller. But its unique properties have also led to difficulties in integrating the material into such devices. View Source September 3, 2010 Provides Information Chip Makers Adopt ASML's Holistic Lithography to Continue Moore's Law ASML Holding NV today at SEMICON West announces broad customer adoption of holistic lithography products which optimize semiconductor scanner performance and provide a faster start to chip production. 100% of ASML's leading-edge scanners are now sold with one or more holistic lithography components. Semiconductor manufacturers face increasingly smaller margins of error as they shrink chip features. Holistic lithography provides a way to shrink within these margins to continue Moore's Law. View Source July 13, 2010 Provides Information China's Yangzhou Zhongke Orders Two More AIXTRON MOCVD Systems for High Brightness LED Production AIXTRON AG today announced a new order for two CRIUS® 31x2-inch configuration deposition systems from Yangzhou Zhongke Semiconductor Lighting Center Co. Ltd. View Source June 2, 2010 Provides Information Clean room at Fondazione Bruno Kessler expands by 40% Every year it produces over one million microchips and hi-tech electronic devices at the request of the Italian Space Agency for space research projects and of CERN in Geneva for major physics experiments as well as by private firms for the production of innovative solar panels, for the creation of sensors for environmental monitoring and for the improvement of industrial manufacturing. View Source May 3, 2010 Provides Information CNano Launches Carbon Nanotube Based Conductive Paste Products for Lithium Ion Battery Applications CNano Technology Limited announced that it officially launched carbon nanotube based super conductive paste products for Lithium ion battery applications, and also introduced the products into the Japanese market. View Source June 9, 2010 Provides Information Cold atoms image microwave fields Microwaves are an essential part of modern communication technology. Mobile phones and laptops, for example, are equipped with integrated microwave circuits for wireless communication. Sophisticated techniques for measurement and characterization of microwave fields are an essential tool for the development of such circuits. View Source August 3, 2010 Provides Information Collaboration at SEMATECH's Resist Center to Demonstrate EUV Materials and Resists for 22nm and Beyond SEMATECH, a global consortium of chipmakers, and AZ Electronic Materials, the global supplier of electronic materials to the semiconductor and flat panel display industries, announced today that AZ Electronic Materials has joined SEMATECH's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. View Source June 2, 2010 Provides Information Collaboration at UAlbany Nanotechnology College to provide cost-effective semiconductor materials for 22nm nodes SEMATECH, a global consortium of chipmakers, and JSR Corporation, an advanced materials supplier to chip-makers and others, and its U.S. operation, JSR Micro, Inc. announced today that it has become the newest member of SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. View Source May 11, 2010 Provides Information Collaboration With Semiconductor Company Huali Gives imec China a Jump Start Imec today officially established imec China in the Zhangjiang High-tech Park in Shanghai. Imec China kicked off with the signing of a joint development project on advanced chip process technology with the semiconductor company Huali. View Source May 25, 2010 Provides Information Communication through chemistry: 'Fuses' convey information for hours We currently transmit information electronically; in the future we will most likely use photons. However, these are not the only alternatives. Information can also be transmitted by means of chemical reactions. George M. Whitesides and his colleagues at Harvard University in Cambridge (Massachusetts, USA) have now developed a concept that allows transmission of alphanumeric information in the form of light pulses with no electricity: the "infofuse". View Source June 21, 2010 Provides Information Comprehensive Analysis of Metal Oxide Nanopowders Market Globally Research and Markets has announced the addition of the "The World Market for Metal Oxide Nanopowders" report to their offering. View Source June 15, 2010 Provides Information Computer Scientists Secure NSF Grant for Developing Nano-Scale Technologies As semiconductor manufacturers build ever smaller components, circuits and chips at the nano scale become less reliable and more expensive to produce. View Source August 20, 2010 Provides Information Computer Simulation Shows Nanoscale Defects in Silicon Add a small quantity of the right chemical to a material being squeezed or stretched, and the results can be dramatic. View Source August 16, 2010 Provides Information Copper nanowires enable bendable displays and solar cells A team of Duke University chemists has perfected a simple way to make tiny copper nanowires in quantity. The cheap conductors are small enough to be transparent, making them ideal for thin-film solar cells, flat-screen TVs and computers, and flexible displays. View Source June 1, 2010 Provides Information Creating light sources for nanochips "One of the most important goals in the optics community is to create and manipulate light on chip," Yinan Zhang tells PhysOrg.com. "This is especially important when it comes to improving the performance of semiconductor lasers with increasingly small device size. This device improvement, owing to recent developments in nanotechnology, will enable a high integration capacity of photonic devices in the future. This could take place in a fashion similar to what has happened to the semiconductor electronic industry." View Source August 25, 2010 Provides Information Creative Chips’ 180-nm CMOS Controller Designed Using Synopsys' Galaxy Solution Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Creative Chips, a mixed-signal semiconductor IC provider, has taped out its most complex mixed-signal chip to date using Synopsys' Galaxy™ Implementation Platform. View Source August 6, 2010 Provides Information Crossing Automation Receives First Order for ExpressConnect Integrated Atmospheric and Vacuum Wafer-level Automation System Crossing Automation, Inc., a leading supplier of efficient, cost-effective front-end and back-end automation solutions and engineering services to high volume semiconductor equipment manufacturers, today announced that it has received an order for its ExpressConnect™ integrated automation platform. The system includes Crossing's Spartan™ equipment front end module (EFEM), Shuttle-Lock™, Load-Lock, SEC controller and AltaStream's integration software. View Source July 13, 2010 Provides Information CVD Equipment Enters Exclusive Distribution Partnership with Graphene Laboratories CVD Equipment Corporation, announced today the signing of an exclusive Distribution Agreement with Graphene Laboratories, Inc. for Chemical Vapor Deposited (CVD) Graphene products. View Source May 27, 2010 Provides Information D 'Dark silicon' to improve smartphone battery life A new smartphone chip prototype under development at the University of California, San Diego will improve smartphone efficiency by making use of "dark silicon" - the underused transistors in modern microprocessors. On August 23, UC San Diego computer scientists presented GreenDroid, the new smartphone chip prototype at the HotChips symposium in Palo Alto, CA. View Source September 1, 2010 Provides Information DEK Wafer Level Process Expertise on Show at Semicon West 2010 Demonstrating its extensive knowledge base for today's demanding back-end wafer level processes, DEK's presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK's established and emerging cost-effective Wafer Level Packaging (WLP) applications. View Source June 21, 2010 Provides Information Digi-Key, STMicroelectronics Announce Design Contest for Engineering Students Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry's broadest selection of electronic components available for immediate shipment, and STMicroelectronics, a leading supplier of microelectromechanical systems (MEMS) for consumer and portable applications, today announced an exciting design contest for engineering students based on ST's iNEMO multi-sensor inertial measurement unit (IMU). View Source July 27, 2010 Provides Information Discera Announces Availability of Low Power CMOS Oscillators for MEMS Industry Discera, Inc., the leading provider of semiconductor-based oscillator technology announced the production availability of the DSC1001 low power and the DSC8001 low power programmable PureSilicon families of CMOS oscillators. View Source August 17, 2010 Provides Information DNA could be backbone of next generation logic chips In a single day, a solitary grad student at a lab bench can produce more simple logic circuits than the world's entire output of silicon chips in a month. View Source May 11, 2010 Provides Information DNA Electronics and Ion Torrent Sign License Agreement DNA Electronics Ltd., an innovator of semiconductor solutions for healthcare, announced today that it has signed a non-exclusive, worldwide license agreement to provide Ion Torrent, the semiconductor sequencing company, access to DNA Electronics' intellectual property. No further details about the agreement were disclosed. View Source August 3, 2010 Provides Information DOE Researchers Take Major Stride Towards Creating Room-Temperature Superconductors The bright green energy future that surely awaits us exists in concept, but as we all know there are key pieces of technology that we still haven't quite figured out, like higher-capacity battery tech or better biofuel processing methods. Similarly, one of the key technology gaps hampering the U.S. energy grid is a lack of understanding regarding superconductors -- materials that can carry electricity with no energy loss. Now, DOE scientists may have cracked a critical part of the superconductor mystery, opening the door to a grid that can carry electrical current over great distances without drastic energy loss. View Source July 15, 2010 Provides Information DOE's National Renewable Energy Laboratory (NREL) seeks design tools for better car batteries The U.S. Department of Energy's (DOE) National Renewable Energy Laboratory (NREL) is seeking proposals to create computer models to help build and improve electric drive vehicle (EDV) batteries. View Source August 25, 2010 Provides Information Dolomite Introduces New Range of Droplet Generation Systems Dolomite, a world leader in microfluidic design and manufacture, has introduced the Micro Droplet Systems which enable rapid advances in droplet microfluidics and allow users to produce more than 10,000 monodispersed droplets per second. Built around Dolomite's industry leading microfluidic pumps, connectors and chips, the Micro Droplet Systems benefit a wide range of applications including compartmentalised chemistry, high throughput experimentation and the formation of monodispersed emulsions or beads. View Source July 12, 2010 Provides Information Dongbu HiTek Launches BD180LV Process at 0.18-micron Node Featuring Industry's Lowest Reported Rsp Dongbu HiTek today announced the addition of the BD180LV process to its portfolio of best-in-class BCDMOS process technologies. Ideal for designing highly integrated chips at the 0.18-micron node, the new mixed-signal process optimizes nLDMOS transistors with the industry’s lowest Rsp (specific on-resistance) while accommodating a broad 7V-to-30V operating voltage range with outstanding reliability characteristics. View Source May 26, 2010 Provides Information Drive giants plan next gen tech Chip fabs aren’t the only costly factories: next gen disks - which look to include self-assembling nanotech and frikkin’ lasers - is going to be so expensive to develop that drive vendors have agreed to work together to bring it to market. Good for them - and good for us. View Source August 30, 2010 Provides Information DuPont Launches Energain Separators for High-Performance Lithium Ion Batteries To reduce the use of fossil fuels and meet the growing demand for hybrid and electric vehicles, DuPont has introduced the first nanofiber-based polymeric battery separator that boosts the performance and safety of lithium ion batteries. View Source August 4, 2010 Provides Information DuPont's New Nanofiber-Based Separator Enhances Performance of Li-Ion Batteries To reduce the use of fossil fuels and to meet the growing demand for hybrid and electric vehicles, DuPont has introduced the first nanofiber-based polymeric battery separator that boosts the performance and safety of lithium ion batteries. View Source August 4, 2010 Provides Information E E Ink and Chilin are Building Low-power Electronic Paper Displays Suited for Industrial Applications E Ink® Corporation, the leading developer and producer of electronic paper display technology, and Chilin Technology Corporation, a leading manufacturer of vertically integrated flat panel displays, announced a partnership today to bring low-power industrial and other specialized electrophoretic displays to the marketplace. The cooperation between the two companies enables solutions that are highly integrated, easy to use and install, and tailored to unique customer environments. View Source May 24, 2010 Provides Information E Ink Announces Next Generation Display Platform E Ink® Corporation, the leading developer and marketer of electronic paper display technology, today announced the Q2 release of its next generation display technology, Pearl. With Pearl, E Ink expands the capabilities of reflective displays, bringing electronic paper performance to the next level. With the whitest reflective displays in the industry, and a contrast ratio now approximately 50 percent greater than today's products, text on Pearl "pops" from the page, enabling a reading experience most similar to reading text on printed paper. View Source July 1, 2010 Provides Information E Ink, Chilin Join to Offer Electronic Paper Displays for Industrial and Specialized Sectors E Ink™ Corporation, the leading developer and producer of electronic paper display technology, and Chilin Technology Corporation, a leading manufacturer of vertically integrated flat panel displays, announced a partnership today to bring low-power industrial and other specialized electrophoretic displays to the marketplace. The cooperation between the two companies enables solutions that are highly integrated, easy to use and install, and tailored to unique customer environments. View Source May 26, 2010 Provides Information EcoloCap Reaches Agreement with Indian Business Group for Nano Battery Technology EcoloCap Solutions Inc., an integrated network of environmentally-focused technology companies utilizing nanotechnology to develop efficient alternative energy solutions, today announced that Michael Siegel President and CEO of Ecolocap Solutions, Inc. on a week-long visit to India has reached an agreement in principle with Ajay Singh, managing director of Spice Jet. View Source July 30, 2010 Provides Information Electrical Detection of Plasmonic Waves Using Ultra-Compact Structure via Nanocavity Light can force the electrons at the surface of a metal to collectively oscillate. Coupling these oscillations with photons-creating 'surface plasmon polaritons' or SPPs-could lead to intriguing applications in communications, information processing and sensing since SPPs oscillate at very high frequencies that enable, potentially, the transfer of large volumes of data. View Source May 26, 2010 Provides Information Electron spin in silicon will lead to revolutionary quantum chips A silicon-based nanoscale system which aims to harness the ‘spin’ of electrons to boost the processing power of future computer systems is being developed by researchers at the University of Southampton, jointly with the University of Cambridge, the NTT Basic Research Laboratories and the Hitachi Cambridge Laboratory. View Source May 26, 2010 Provides Information Electronic Firms to Present at IFA 2010 Event in Hong Kong Hong Kong is one of the world’s most important marketplaces for electronics. At IFA, from September 3rd to 8th, 55 companies from the metropolis will attend the trade fair to present their latest developments. View Source September 2, 2010 Provides Information Electronics from a printer - of electronic radio tags and lighting wallpapers Glucose meters and the appropriate test strips for diabetics are expensive. This however might change, since scientists at the Institute of Printing Science and Technology (IDD) at TU Darmstadt are working on a sensor making the electronic devices considerably cheaper. The new sensor is not based on silicon as conducting material, but on plastics. View Source September 3, 2010 Provides Information Electronics Industry Praises HP’s Inertial Sensing Technology HP’s ultrasensitive inertial sensing technology has won three prestigious electronics industry awards: the Design News Golden Mousetrap – Sensor category, the EDN Innovation Award – Accelerometer category and the Most Promising New Technology award at the EE Times ACE Awards. View Source May 10, 2010 Provides Information Elucidation of bandgap factors for graphene nanoelectronics The National Institute for Materials Science succeeded in elucidating the bandbap characteristics of graphene, which is key to realizing electronic devices using graphene, this being the thinnest high conductivity thin film (atomic film) on earth. View Source September 6, 2010 Provides Information Elpida Collaborates with PTI, UMC to Advance 28nm 3D IC Integration Technologies Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation ("UMC"), today announced their entry into a 3-way cooperation to advance 3D IC integration technologies for advanced processes including 28 nanometer (nm). This collaboration will leverage the strengths of Elpida's DRAM, PTI's assembly, and UMC's foundry logic technologies to develop a total 3D IC Logic+DRAM integration solution. View Source June 21, 2010 Provides Information EMC Announces Sale of Electro-Chemical Residue Sensor for Semiconductor Manufacturing After more than seven years of commercial development and testing, Tucson-based Environmental Metrology Corporation (EMC) is putting up for sale its breakthrough electro-chemical residue sensor (ECRS) for semiconductor manufacturing, along with associated intellectual property that includes three issued patents and another that is pending. View Source May 11, 2010 Provides Information EnerG2 Commences Construction of Manufacturing Plant for Nano-Engineered High-Performance Carbon Electrode Material EnerG2, an innovative seven-year-old company focused on introducing advanced nano-structured materials for next-generation energy storage, today announced the groundbreaking of the world's first facility dedicated to the commercial-scale production of synthetic high-performance carbon electrode material. This material is the most important ingredient in ultracapacitor energy storage devices, which are used in electric and hybrid vehicles. View Source August 11, 2010 Provides Information eSilicon Expands in Asia Through Acquisition of Silicon Design Solutions eSilicon Corporation, the largest independent semiconductor Value Chain Producer (VCP), today announced the completion of its asset acquisition of Silicon Design Solutions (SDS), a privately held company supplying niche semiconductor memory intellectual property (IP) and design services to manufacturers and designers of cutting-edge SoCs. View Source May 27, 2010 Provides Information European €26m project to develop next generation nanotransistor chips The University of Glasgow is playing a key role in a €26M (£23m) European project called MODERN looking at how to design the next generation computer chips – using variable and unreliable nanotransistors. View Source June 10, 2010 Provides Information European Commission grants autonomy to ENIAC nanoelectronics initiative The European Commission has granted autonomy to the ENIAC Joint Undertaking, a body created by the EU's Council of Ministers to bring together European research in nanoelectronics. This is a major step forward because it marks the real beginning of a balanced and innovative public-private partnership in which industry, Member States and the Commission aim for industrial excellence and a significant impact on the economy. View Source May 7, 2010 Provides Information European cooperation ensures global leadership in microelectronics Cooperation between semiconductor manufacturers, materials and equipment suppliers, and researchers has ensured that the European microelectronics industry can continue to maintain its global position in consumer electronics product design and manufacture. Development of innovative higher performance but less power hungry chips is a particular benefit for mobile phone and multimedia equipment producers. View Source July 15, 2010 Provides Information European superconducting quantum information processor Quantum physics is entering the computer age thanks to the work of a dedicated band of European researchers. View Source July 8, 2010 Provides Information EV Group and A*STAR Institute of Microelectronics Enters into Two-Year Cooperation Agreement EV Group (EVG), a supplier of wafer bonding equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies. 3D IC offers more flexibility in the designs. View Source July 8, 2010 Provides Information EV Group Capitalizes on MEMS Market Leadership EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA). View Source July 14, 2010 Provides Information EV Group, IME Partnership to Enhance 3D IC Development in Wafer Bonding EV Group (EVG), a supplier of wafer bonding equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies. View Source July 9, 2010 Provides Information EV Group Introduces New EVG610 Mask and Bond Aligner Optimized for Greater Cost and Process Flexibility EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility. View Source July 6, 2010 Provides Information EV Group to Share Key Developments and Highlights at SEMICON West EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA). The tools will be employed at Nano Fab – UTA's Nanotechnology Research and Teaching Facility, which is funded by the National Science Foundation's Major Research Instrumentation Program – for a wide range of MEMS-related as well as photonics and optoelectronics research. View Source July 14, 2010 Provides Information EUV mask cleaning program on track towards EUV mass manufacturing Imec today reports promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial in achieving high chip manufacturing yield. View Source July 13, 2010 Provides Information EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. View Source May 31, 2010 Provides Information EVO HD: The Latest Innovation From Carl Zeiss in the Conventional SEM Market Segment Today, Carl Zeiss introduces EVO® HD, its latest innovation in the conventional Scanning Electron Microscopy (C-SEM) market segment. Delivering much higher resolution at low acceleration voltages compared to present conventional SEM, the EVO® HD introduces High Definition to electron microscopy. View Source July 14, 2010 Provides Information Eyelit's Award-winning Integrated Manufacturing Execution Software and SYSTEMA's Equipment Integration Suite Selected by CEA-Leti Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, semiconductor, and photovoltaic (solar) industries, announced today that CEA-Leti, the French nanoelectronics Research & Development plant, has purchased Eyelit's manufacturing software suite —including Eyelit MES, SPC, Asset Management, Quality Management and SYSTEMA's Equipment Integration Suite— to support semiconductor and MEMS production in its facilities in Grenoble, France. View Source July 6, 2010 Provides Information F FCI Signs Licensing Agreement for Polymer Collar Technology FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to facilitate the industry's ease in adopting the use of Polymer Collar™ technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices. View Source August 17, 2010 Provides Information Few atomic layers of graphene reveal unique thermal properties Professor Alexander Balandin and a team of UC Riverside researchers, including Chun Ning Lau, an associate professor of physics, have taken another step toward new technology that could keep laptops and other electronic devices from overheating. View Source May 10, 2010 Provides Information First lasing below 4.5 nanometres at DESY's free-electron laser For the first time, FLASH produced laser light with a wavelength of 4.45 nanometres; thus, DESY's free-electron laser for soft X-ray light considerably beat its previous record of 6.5 nanometres. At the same time, the peak intensity of single light pulses nearly doubled, with 0.3 millijoule. Prior to this, there was a five-month machine upgrade, above all with a significant improvement of the superconducting linear accelerator. View Source June 16, 2010 Provides Information FlexTech Alliance announces dates for 2011 Flexible Electronics and Displays conference The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, today announced the dates for its 10th annual Flexible Electronics and Displays Conference, to be held in Phoenix, Ariz., February 7-10, 2011. As part of the special 10th anniversary celebration, the conference will highlight the progress of commercialization of flexible electronics and displays over the last ten years and where the industry is headed in the next ten years. Additionally, the conference is expanding to address global technical and business issues, advancements impacting the flexible electronics field, and areas where displays are a key driver. View Source July 28, 2010 Provides Information FlexTech Alliance to Develop Foldable Display for Nyx Illuminated Clothing The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, today announced a contract award to Nyx Illuminated Clothing Company to develop a foldable display constructed from a panel of multiple e-paper screens. View Source August 27, 2010 Provides Information Florida State University Selects Optomec Aerosol Jet Solution to Print Next Generation Embedded Sensors Optomec announced today that Florida State University (FSU) has purchased an Aerosol Jet deposition system. The system, which is installed at FSU's Materials Research Building, will be used by researchers at the High-Performance Materials Institute (HPMI) for the development of multifunctional composites incorporating printed sensors. FSU plans to use these embedded sensors for damage and environmental change detection, structural health monitoring, energy harvesting and more. View Source August 11, 2010 Provides Information Fluidigm Introduces World's First Reusable Bio-Chip Architecture Fluidigm Corporation today announced it has developed the world's first reusable bio-chip architecture for the commercial market. These reusable integrated fluidic circuits (IFCs) will dramatically lower SNP genotyping costs and are designed to support accelerated sample throughput, while maintaining data quality of 99.75 percent or greater accuracy and 99 percent or greater call rates. View Source June 8, 2010 Provides Information FMA Unveils MB86L10A Transceiver Developed Using 90nm CMOS Technology Fujitsu Microelectronics America, Inc. (FMA) today introduced the industry's first transceiver that supports 3GPP LTE/WCDMA/EGPRS wireless phones. View Source June 5, 2010 Provides Information Fractals Make Better Superconductors Superconductivity, where a material conducts electricity at very low temperature with no resistance, and therefore transmission wastes virtually no energy, has applications ranging from medical scanners to maglev trains. Until now, scientists have focused on atomic-scale phenomena to explain this mysterious property of some special compounds. View Source August 12, 2010 Provides Information Fraunhofer ISIT Selects Rudolph Technologies for MEMS Inspection Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing. The system will be installed this summer in the state-of-the-art 200 mm MEMS pilot production line at ISIT. View Source July 12, 2010 Provides Information Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. View Source May 31, 2010 Provides Information Fraunhofer POLO Announces Roll-to-Roll Pilot Production of Transparent Barrier Films Researchers from the Fraunhofer Polymer Surfaces Alliance POLO (Fraunhofer POLO) have developed highly efficient barrier films suitable for roll-to-roll production and that are now being produced on a pilot plant scale. View Source June 8, 2010 Provides Information Freescale Introduces New ColdFire+ Microcontrollers Developed Using 90nm TFS Flash Technology Freescale Semiconductor is reinforcing its leadership in 32-bit microcontrollers (MCUs) with the announcement of 40 new ColdFire+ (plus) devices, taking its proven ColdFire portfolio to new heights. Built from 90 nanometer (nm) Thin Film Storage (TFS) flash technology with FlexMemory, ColdFire+ MCUs promise to be one of the most integrated, cost-effective, small-package 32-bit MCUs on the market. View Source June 9, 2010 Provides Information Frequency comb system detects gas impurities to aid semiconductor manufacturing Purity of ingredients is a constant concern for the semiconductor industry, because a mere trace of contaminants can damage or ruin tiny devices. In a step toward solving a long-standing problem in semiconductor manufacturing, scientists at JILA and collaborators have used their unique version of a "fine-toothed comb" to detect minute traces of contaminant molecules in the arsine gas used to make a variety of photonics devices. View Source August 4, 2010 Provides Information FSI to Ship ORION Single Wafer Processing System to Asia's Leading Foundry FSI International, Inc., a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that it has received an order for its ORION single wafer processing system from a second major semiconductor foundry based in Asia. View Source June 25, 2010 Provides Information Fujitsu Adopts Cadence Encounter Conformal ECO Designer Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Fujitsu Limited has adopted the Cadence® Encounter® Conformal® ECO Designer to cut costs and reduce design time in its engineering change order (ECO) implementation flow. The technology giant recently deployed the Cadence technology to tape out a network-control large-scale integration design of 40 million gates at a 65-nanometer process. View Source July 22, 2010 Provides Information Fujitsu Deploys Cadence’s Technology for Logic Design at 65-nm Process Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Fujitsu Limited has adopted the Cadence® Encounter® Conformal® ECO Designer to cut costs and reduce design time in its engineering change order implementation flow. View Source July 23, 2010 Provides Information Fund Awarded to Customize GigOptix's Thin Film Polymer on Silicon Modulators GigOptix, a leading supplier of electronic and electro-optic semiconductor products for optical communications systems, today announced that it has secured a grant for $200,000 in research and development funds to customize the Company’s proprietary LX8400 40Gb/s Thin Film Polymer on Silicon Mach Zehnder modulator for use in an ongoing Government Supercomputing program. View Source August 4, 2010 Provides Information G Gadolinium Oxide Nanocrystals for Future Flash Memory Designs Future flash memory could be faster and store more data without changing its basic design by using a clever nanocrystal material proposed by scientists at Taiwan's Chang Gung University, who describe a new logical element made with the rare earth material gadolinium in the journal APPLIED PHYSICS LETTERS, which is published by the American Institute of Physics. View Source August 25, 2010 Provides Information GBP 2.5M Funding to Commercialize Breakthrough Carbon Nanotube Interconnection Process for Next-generation Semiconductors Surrey NanoSystems has secured second round funding of £2.5 million (~US$4.2m) from Octopus Ventures, IP Group, The University of Surrey and other investors. The capital will help to commercialize an innovative low-temperature growth process for carbon nanotubes, targeted for use as an interconnection technology in semiconductor devices. View Source September 2, 2010 Provides Information GE Explores Hydrophobic Nano-Engineered Surfaces to Develop Smart NanoBattery mPhase Technologies, Inc. today announced that it has noted, with enthusiasm, the recent announcement by General Electric that as part of its push into high-tech products that it will explore hydrophobic nano-engineered surfaces to improve the performance of other industrial products. View Source August 30, 2010 Provides Information Generation and evolution of metal nanoparticles during utrashort LASER ablation and plasmon excitation of gold nanoparticles The ultrashort laser ablation of solid materials is basis of different modern and advanced scientific and technological areas as fabrication of metal and semiconductor nanoparticles, deposition of nanostructures and their embedding in optical films, or deposition on their surfaces in order to alter exciting properties or development of new. View Source June 4, 2010 Provides Information Georgia Tech Scientists Develop New Class of Devices Using Zinc Oxide Nanowires Researchers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires. View Source September 2, 2010 Provides Information GGI International; manufacturers of membrane switches & graphic overlays GGI International is the technology leaders in membrane switch & graphic overlay solutions! ISO 9001:2000 certified, exclusive Canadian licensee of Duraswitch Technologies; PushGate, thiNcoder RT and MagnaMouse. View Source   Provides Products Global Market Study on Printed Electronics Industry Research and Markets has announced the addition of the "The Worldwide Printed Electronics Market - 2010 Edition" report to their offering. View Source May 17, 2010 Provides Information Global Merchant Imports Select responsible products that draw upon an unlimited energy source -- the sun. You'd be surprised at the variety of products available: lights, watches, radios and more. View Source   Provides Products Global Research Report on Silicon-on-Insulator Wafer Market The Global Silicon-on-Insulator (SOI) Market report sizes and analyzes the global markets for SOI wafers types and applications over the period 2010-2015. The report studies the major market drivers, restraints, and opportunities for the global SOI market. View Source August 24, 2010 Provides Information Global Semiconductor Alliance Supports Europe Start-Ups and Key Enabling Technologies The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces it is launching an awareness campaign for Europe to encourage the EU Commission, regional governments, universities, research organizations, industry and private equity firms to collaboratively provide the investment and infrastructure support that is vital to the ability of small- to medium-sized enterprises to bring sustainable innovative semiconductor product concepts to market. View Source July 13, 2010 Provides Information GLOBALFOUNDRIES Announces Keynote Speakers for Global Technology Conference GLOBALFOUNDRIES today announced the lineup of keynote speakers for GTC 2010, the company's inaugural Global Technology Conference. At the September 1 event, senior executives from AMD and STMicroelectronics—two of the world's leading semiconductor product companies—will offer their perspectives on the changing dynamics of chip design and manufacturing as the industry moves to the 32/28nm technology node and beyond. View Source August 5, 2010 Provides Information GLOBALFOUNDRIES Expands Worldwide Manufacturing Capacity GLOBALFOUNDRIES announced plans to expand its global semiconductor manufacturing operations with a series of new projects across its 300mm operations designed to support expected increases in both near-term and long-term customer demand. These projects consist of two major new initiatives: View Source June 1, 2010 Provides Information GLOBALFOUNDRIES Introduces Qualification Vehicle Based on 28nm Technology At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES announced it has taped-out a qualification vehicle based on the ARM® Cortex™-A9 dual processor, an industry first on 28nm High-K Metal Gate technology. View Source September 2, 2010 Provides Information GLOBALFOUNDRIES Launches Global Partner Ecosystem to Drive Industry Collaboration At next week's Design Automation Conference (DAC), GLOBALFOUNDRIES will unveil a new platform to spur innovation in semiconductor manufacturing and help deliver unparalleled service to chip designers. Called GLOBALSOLUTIONS, the new ecosystem combines the company's internal resources with a broad spectrum of partners to efficiently enable the fastest time-to-volume for foundry customers. View Source June 10, 2010 Provides Information GLOBALFOUNDRIES Showcases Industry’s First Open-Access 28nm AMS Production Design Flow Development Kit At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES showcased the industry’s first open-access 28nm Analog/Mixed-Signal (AMS) production design flow development kit. The company is making the flow available to customers as a platform to build upon proven foundry methodologies and enable successful design. GLOBALFOUNDRIES has teamed with Cadence Design Systems to deliver this AMS production design flow. View Source September 1, 2010 Provides Information GLOBALFOUNDRIES to Bring New 90nm Flash Memory Technology to Market At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES and Freescale Semiconductor announced plans to bring a new class of thin film storage (TFS) flash memory products to market on 90nm technology. View Source September 2, 2010 Provides Information Gold-Linked Quantum Dots Enhance Photoluminescence By linking individual semiconductor quantum dots with gold nanoparticles, scientists at the U.S. Department of Energy’s (DOE) Brookhaven National Laboratory have demonstrated the ability to enhance the intensity of light emitted by individual quantum dots by up to 20 times. View Source July 27, 2010 Provides Information Graphene exhibits bizarre new behavior well-suited to electronic devices Graphene, a sheet of pure carbon heralded as a possible replacement for silicon-based semiconductors, has been found to have a unique and amazing property that could make it even more suitable for future electronic devices. View Source July 29, 2010 Provides Information Graphene Innovator, Vorbeck Materials, Announces New Product for Flexographic Printing Applications Vorbeck Materials Corp., the world's leading producer of graphene-based materials and manufacturer of the world's first commercial graphene-based product, Vor-ink conductive inks, announces a new conductive ink formulation for flexographic printing, Vor-ink Flexo. View Source June 9, 2010 Provides Information Graphene studies by different optical, AFM and spectroscopy techniques Combination of Atomic Force Microscopy (AFM), Raman / Fluorescence / Rayleigh microscopy and Scanning Near-Field Optical Microscopy (SNOM) provides unique opportunities for Graphene investigation. Different AFM techniques allow one to study mechanical, electrical, magnetic and even elastic properties of Graphene flakes. View Source June 2, 2010 Provides Information Graphene under strain creates gigantic pseudo-magnetic fields Graphene, the extraordinary form of carbon that consists of a single layer of carbon atoms, has produced another in a long list of experimental surprises. In the current issue of the journal Science, a multi-institutional team of researchers headed by Michael Crommie, a faculty senior scientist in the Materials Sciences Division at the U.S. Department of Energy's Lawrence Berkeley National Laboratory and a professor of physics at the University of California at Berkeley, reports the creation of pseudo-magnetic fields far stronger than the strongest magnetic fields ever sustained in a laboratory – just by putting the right kind of strain onto a patch of graphene. View Source July 29, 2010 Provides Information Graphene’s Superior Thermal Properties Manage Heat in Electronics Professor Alexander Balandin and a team of UC Riverside researchers, including Chun Ning Lau, an associate professor of physics, have taken another step toward new technology that could keep laptops and other electronic devices from overheating. View Source May 11, 2010 Provides Information Go Electronic offers a wide selection of professional and consumer electronics at great prices. View Source   Provides Products H Hello Direct We are the leading online resource for telecommunications products, information, and service. View Source   Provides Products Henkel Launches Wafer Backside Coating Technology for Stacked Die Packages Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards). View Source August 2, 2010 Provides Information High light-extraction efficiency from high-refractive-index semiconductors Researchers at AIST succeeded in extracting light from a semiconductor into air with the highest efficiency. For this purpose, ridges were fabricated on a semiconductor surface, and then, the fabricated ridges were coated with a silicon dioxide (SiO2) layer. The mechanism of the light-extraction with high efficiency was also clarified. View Source May 11, 2010 Provides Information Hong Kong PolyU researchers break new ground in nanotechnology A pioneering study by researchers of The Hong Kong Polytechnic University (PolyU) has shown that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors which are commonly used in consumer electronics. View Source August 26, 2010 Provides Information Hong Kong researchers break new ground in nanotechnology A pioneering study by researchers of The Hong Kong Polytechnic University (PolyU) has shown that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors which are commonly used in consumer electronics. View Source August 30, 2010 Provides Information I IBM Announces New Collaboration to Develop Advanced 28nm Chips IBM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) said today that the four companies are collaborating to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance. View Source June 23, 2010 Provides Information IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics IBM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and STMicroelectronics said today that the four companies are collaborating to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance. View Source June 23, 2010 Provides Information IBM Ships World's Fastest Microprocessor Based on its 45nm SOI Technology IBM has announced details of the world's fastest computer chip -- the microprocessor in a new version of the IBM mainframe that begins shipping to customers on Sept. 10. View Source September 2, 2010 Provides Information IC Design and Technology conference provides opportunity to exchange breakthrough ideas CEA-Leti, a co-sponsor with IEEE France Section of the 2010 IEEE International Conference on IC Design and Technology, said today the June 2-4 event will provide an opportunity for the traditionally separated design and process-technology communities to share ideas on product development and manufacturing. View Source May 11, 2010 Provides Information Imec and ASML Demonstrate Potential of 193nm Immersion Lithography With Freeform Illumination Imec and ASML collaborated to qualify ASML's Tachyon Source Mask Optimization and programmable illuminator system FlexRay™, proving its potential with the demonstration of a 22nm SRAM memory cell. In October 2010, the ASML XT:1900i lithography scanner at imec will be equipped with FlexRay™, enabling imec to step ahead and further explore the ultimate frontiers of immersion lithography. View Source July 13, 2010 Provides Information Imec and DELTA Partner to Provide Comprehensive ASIC Solutions Imec, certified TSMC Value Chain Aggregator (VCA), and DELTA Microelectronics, a leading provider of ASIC services, have concluded a cooperation agreement to provide customers in Europe, the Middle East and Africa (EMEA) with comprehensive TSMC-based turnkey and partial turnkey ASIC services. View Source May 18, 2010 Provides Information Imec and TSMC Announces Extension of Europractice IC Service Imec, a world-leading nanoelectronics research center, and TSMC, the world-leading semiconductor foundry, today announced the extension of imec's Europractice IC service with the offering of TSMC's 40 nanometer technologies. Subsequent to the close collaboration between imec and TSMC on advanced technology research and development, both companies will offer TSMC's CybershuttleTM Multi-Project Wafer (MPW) platform for IC prototyping and production services to European companies and academia. View Source June 4, 2010 Provides Information Imec Establishes Metrology Method for Optimizing Etch Rate Uniformity in Transformer Coupled Plasma Reactor Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes use of PVx2 sensor wafers. For ion-assisted etch processes, the use of this PVx2-based method for ERU tuning results in lot-turn time savings of up to 80% compared to conventional etch rate uniformity tests. View Source August 19, 2010 Provides Information Imec Officially Establishes imec China Imec today officially established imec China in the Zhangjiang High-tech Park in Shanghai. Imec China kicked off with the signing of a joint development project on advanced chip process technology with the semiconductor company Huali. View Source May 25, 2010 Provides Information Imec participates in European Silicon Photonics Cluster Under the umbrella of the European Silicon Photonics Cluster, 10 European R&D project consortia coordinate their efforts in silicon photonics. Imec is involved in 7 of these consortia, which consist of research institutes, universities, and companies. The goal of the cluster is to build a unique photonics value chain, facilitating the transfer of knowledge and technology and strengthening Europe's electronics industry. The cluster's projects aim at introducing silicon photonics in innovative products. View Source August 19, 2010 Provides Information Imec reports breakthrough in narrow pitch interconnects Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach. View Source July 13, 2010 Provides Information Imec Researchers Examine Gate Oxide Trapping Using a new technique, researchers from imec, TU Vienna, and Infineon have shown that both electron and hole capture and emission times in SiO2 and HfO2 dielectrics are strongly thermally activated. The new technique, Time Dependent Defect Spectroscopy (TDDS), can be used to study the capture and emission times of single oxide defects over a very wide time range. This knowledge will help to better understand the time variability of future deeply scaled devices, as well as the operation of charge-storage memories. View Source August 19, 2010 Provides Information Imec Welcomes New Research Partners To Its GaN Research Program Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This multi-partner R&D program focuses on the development of GaN-on-Si (gallium nitride-on-silicon) process and equipment technologies for manufacturing solid state lighting (e.g. LEDs) and next-generation power electronics components on 8-inch Si wafers. View Source July 13, 2010 Provides Information Imec's Tandem Organic Solar Cells Offer Path to Higher Efficiencies Imec has fabricated tandem organic solar cells with peak conversion efficiencies of 5.15%. This was achieved by stacking two different planar heterojunction devices, each with a high open-circuit voltage (Voc). View Source August 19, 2010 Provides Information Industry Leaders Expect EUV Lithography for Semiconductor Manufacturing in 2014 At SEMATECH’s Litho Forum, May 10-12, semiconductor business leaders and technology experts gained valuable insight on the industry’s perceptions about and intentions for lithography development. View Source May 24, 2010 Provides Information Infinite Power Solutions Raises $20M to Advance Thin-Film Energy Storage Devices Infinite Power Solutions, Inc. (IPS) has announced that it has successfully completed its series C round of financing—raising $20 million. In response to growing customer demand, the new capital will be used to expand the company's manufacturing capacity, accelerate the build out of its global sales channels and further support advanced research and development of its eco-friendly, THINERGY® solid-state rechargeable energy storage devices. View Source August 18, 2010 Provides Information Innofidei’s 65nm Low-Power SoC Achieves First-Pass Silicon Success with Cadence’s Solution Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Innofidei Inc., a leading mobile chipset provider based in Beijing, China, has successfully taped out the industry’s first long-term evolution time division duplex (LTE-TDD, or TD-LTE) baseband chip supporting a bandwidth of 20MHz for the next-generation TD-CDMA wireless communications protocol. View Source June 22, 2010 Provides Information Innolume Begins Sampling of LD-12xx-Series of Quantum Dot Lasers Innolume, the leading provider of Quantum Dot (QD) diode lasers covering the 1064 nm to 1320 nm spectrum, today announced that it has begun sampling the LD-12xx-series laser platform, a new generation of pump laser that is based on the company’s proprietary Quantum Dot epitaxial technology. View Source July 22, 2010 Provides Information Innovative electromagnetic probe device receives U.S. patent United States Patent Office has issued a patent to Dr. Mark DeCoster, associate professor of biomedical engineering at Louisiana Tech University, for his invention of an "Electromagnetic Probe Device" – an innovative technology developed at Louisiana Tech's Institute for Micromanufacturing. View Source August 4, 2010 Provides Information Intel International Science and Engineering Fair Starts Today Top High School Scientists from Around the World Compete for More than $4 million in Prizes, Including Gordon E. Moore Award View Source May 10, 2010 Provides Information Intel’s intelligent vending machine knows your gender and age, suggests a product to suit Intel doesn’t just manufacture processors for servers, PC, laptops, and netbooks. It has a wide range of other tech sector interests, one of which is vending machines. Through its Japanese outlet Intel K.K. the chip giant is working on the next-generation of vending machine, and the focus seems to be intelligent product suggestions. View Source May 13, 2010 Provides Information IntelliSense Purchases ClassOne’s MEMS Equipment for New Chinese Fab MEMS design and development company IntelliSense today announced that it has purchased the bulk of its semiconductor process equipment for its new fab in Nanjing, China, from refurbished equipment supplier ClassOne Equipment. The alliance went so well that the two companies have formed a strategic partnership to continue the relationship. View Source June 23, 2010 Provides Information International EUVL Workshop Highlights Advantages and Challenges of EUV Lithography Extreme ultraviolet lithography (EUVL) is the semiconductor industry's best bet for extending Moore's Law and its inherent advantages make it an increasingly preferable choice for next-generation patterning, ranking technologists agreed at the 2010 International Workshop on EUV Lithography. View Source June 29, 2010 Provides Information Investigation of Fano resonance in plasmonic nanostructures and metamaterials promises new applications Nanostructures with Fano resonance fabricated from plasmonic materials and metamaterials could give rise to a range of applications such as label-free chemical and bioanalysis probes that are adaptable to high-throughput applications, electronics-free sensor for sensing physical parameter changes such as temperature or pressure. View Source August 27, 2010 Provides Information IQE’s Subsidiary Secures Two Nanocolumn Technology Patents IQE plc, the leading global supplier of advanced semiconductor epitaxial wafer products and wafer services to the semiconductor industry, is pleased to announce that NanoGaN Limited, a wholly owned subsidiary of IQE, has been granted two separate patents in relation to its nanocolumn technology for the production of advanced blue and green lasers and LEDs. View Source August 6, 2010 Provides Information ISO 14001 Certification Awarded to Thin-Wafer Handling System Provider Mechatronic At the end of June, Mechatronic Systemtechnik, provider of thin-wafer handling systems, was successfully certified in accordance with environment standard ISO 14001. View Source August 2, 2010 Provides Information J Japanese-German micro/nanotechnology forum at the Micromachine/MEMS exhibition in Tokyo In co-operation with the German Asia-pacific Business Association, IVAM Microtechnology Network launches the third Japanese-German Micro/Nano forum within the framework of the Exhibition Micro Machine/MEMS in Tokyo, one of the most important Japanese exhibitions in the field of micro- and nanotechnology. View Source July 23, 2010 Provides Information Jim's Best Deals Name brand electronics. TV's, Computers, Home Audio. View Source   Provides Products Jordan Valley Semiconductors Announces a New Metrology Tool for SiGe, Si:C and Strained Silicon Jordan Valley Semiconductors Ltd. (JVS), a leading provider of X-ray-based semiconductor in-line metrology tools, announced today the launch of its new JVX7200™, which targets the challenging SiGe in-line process monitoring. View Source July 14, 2010 Provides Information John Wiley’s New Book on Quantum Wells, Wires, and Dots Research and Markets has announced the addition of John Wiley and Sons Ltd's new book "Quantum Wells, Wires and Dots: Theoretical and Computational Physics of Semiconductor Nanostructures, 3rd Edition" to their offering. View Source July 15, 2010 Provides Information JSR's Collaboration with SEMATECH Helps to Drive Nanoelectronics Innovations SEMATECH, a global consortium of chipmakers, and JSR Corporation, an advanced materials supplier to chip-makers and others, and its U.S. operation, JSR Micro, Inc. announced today that it has become the newest member of SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. View Source May 12, 2010 Provides Information K Key advance in understanding 'pseudogap' phase in high-Tc superconductors Scientists have been trying for some 20 years to understand why the low temperature at which copper-oxide superconductors carry current with no resistance can't be increased to be closer to room temperature. Recently, scientists have focused on trying to understand and control an electronic phase called the "pseudogap" phase, which is non-superconducting and is observed at a temperature above the superconducting phase. View Source July 14, 2010 Provides Information Key puzzle in brittle-to-ductile transition in silicon resolved Why does silicon, which usually shatters catastrophically like glass when fractured, suddenly change and show ductile fracture like metals when the temperature is increased? As Markus J Buehler, the Esther and Harold E. Edgerton Associate Professor in MIT's Department of Civil and Environmental Engineering, explains to Nanowerk, "the development of atomistic-level understanding of crack-tip events in silicon with increasing temperature have been hindered partly due to the lack of atomistic models that enable the simulation of sufficiently large systems to accurately describe the fracture processes at a range of temperatures." View Source June 22, 2010 Provides Information Kilopass’ New 4 Mb Non-Volatile Memory IP Now Avaliable for 40nm Processes Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced Gusto, the industry’s first and only 4 megabit (Mb) one-time programmable (OTP) NVM IP. Gusto is the only NVM IP large enough to store the firmware and boot code traditionally stored in external serial-flash and EEPROM chips. View Source June 4, 2010 Provides Information KLA-Tencor Unveils New Wafer Defect Review Tool and Reticle Inspector Today KLA-Tencor Corporation®, the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, introduced the TeraFab™HT reticle inspector and eDR™-5210S wafer defect review tool. View Source July 13, 2010 Provides Information Kopin Announces Multi-Year Order of AIXTRON MOCVD Systems to Support Growing Demand for Wireless Devices Kopin® Corporation, the world’s leading producer of hetero-junction bipolar transistors (HBT) for smart phones and other mobile devices and the largest U.S. manufacturer of micro-displays for consumer, industrial and military applications, today announced that Kopin and AIXTRON AG have completed a multi-year purchase and supply agreement for additional AIXTRON high-volume metal organic chemical vapor deposition (MOCVD) systems. View Source May 11, 2010 Provides Information L Lantiq Unveils New 65nm Chipset for Network Equipment Vendors Lantiq, a leading supplier of broadband access and home networking technologies, today introduced its latest generation 65nm chipset for design of carrier linecards supporting the global VDSL2 and ADSL/2/2+ standards. View Source August 23, 2010 Provides Information Large Purchase Order for Multiple CRIUS II and AIX G5 Planetary Reactor Systems AIXTRON AG today announced that it has signed a contract with Sanan Optoelectronics Co. Ltd., on the supply of a double digit number of multiple CRIUS® II and AIX G5 MOCVD systems. View Source August 4, 2010 Provides Information Lasertec lasercut smt stencils Fantastic quality smt stencils, wave solder pallets and tooling along with solder paste and adhesive. View Source   Provides Products Latest Synopsys IC Compiler Delivers More Speed, 28/32 Nanometer Production Support Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of IC Compiler 2010.03, a physical implementation solution delivering up to 2.5X faster performance on multicorner/multimode (MCMM) designs, and enhanced In-Design technology for faster design closure. View Source May 6, 2010 Provides Information Leading Korean DRAM Manufacturer Orders QXP 8300 ALD Product from AIXTRON AIXTRON AG today announced shipment of its next generation QXP 8300 ALD product to a leading Korean DRAM manufacturer. The tool will be fully operational at the customer site by the end of Q2 2010. View Source June 15, 2010 Provides Information Leading Players Present at 2010 Symposium on Optoelectronic Materials and Devices On July 12 and 13, 2010, experts from across the solar photovoltaics, infrared (IR) photovoltaics and light emitting diode (LED) disciplines met to review and discuss recent progress and future trends in the rapidly advancing fields of photonic materials and devices at the 2010 International Symposium on Optoelectronic Materials and Devices. View Source July 23, 2010 Provides Information Leading Semiconductor Executives Join Speaker Lineup at SEMATECH’s Lithography Conference With the aim of bringing together visionary leadership to garner the support of industry stakeholders on next-generation lithography technologies, SEMATECH announced today that Gary Patton, vice president, of IBM Semiconductor Research and Development Center, and Suresh Venkatesan, vice president, Alliance Technology Development of GLOBALFOUNDRIES, have joined the slate of industry speakers at SEMATECH’s Litho Forum. View Source May 3, 2010 Provides Information Leica Microsystems and Axeda Take Top Honors at Connected World Conference Leica Microsystems received a gold M2M Value Chain award with Axeda Corporation honored as its enabler at the annual Connected World Conference. Announced last week, the awards highlight the critical elements of the machine-to-machine (M2M) value chain that create a winning solution for the end customer. The companies were honored for the Leica RemoteCare smart services program. View Source June 25, 2010 Provides Information Leti will present its latest research findings in maskless lithography, FDSOI and 3D integration during Semicon West At Semicon West, Leti will highlight some of its latest research findings and key programs for the semiconductor industry, including maskless lithography, FDSOI and 3D integration. The abstracts below summarize Leti's recent work in these areas. View Source July 1, 2010 Provides Information LFoundry Purchases Atmel’s Wafer Fabrication Facility in France Atmel® Corporation, a leader in microcontroller and touch solutions, today announced that it has completed the previously announced sale of Atmel's wafer fabrication operation located in Rousset, France to LFoundry GmbH. View Source June 23, 2010 Provides Information Light-control glass using nanoparticles with a gel electrolyte Researchers at the Nanotechnology Research Institute at the National Institute of Advanced Industrial Science and Technology (AIST), in collaboration with Yamagata University, have succeeded in producing gel electrolytes for use in a light-control glass device using nanoparticles of Prussian blue-type complexes. The light-control glass device is based on the electrochromism phenomenon, and its color can be controlled between blue and transparent states by application of an electric current. View Source May 20, 2010 Provides Information Liquid crystals light way to better data storage As cell phones and computers continue to shrink, many companies are seeking better ways to store hundreds of gigabytes of data in small, low-power devices. View Source June 22, 2010 Provides Information Lithium Batteries Can Deliver High Power Using Carbon Nanotube-Based Electrodes Batteries might gain a boost in power capacity as a result of a new finding from researchers at MIT. They found that using carbon nanotubes for one of the battery's electrodes produced a significant increase — up to tenfold — in the amount of power it could deliver from a given weight of material, compared to a conventional lithium-ion battery. View Source June 21, 2010 Provides Information Location-based security is ensured by using quantum mechanics A research group led by computer scientists at the UCLA Henry Samueli School of Engineering and Applied Science has proved that cryptography — the practice and study of hiding information — that is based solely on physical location is possible by using quantum mechanics. View Source July 27, 2010 Provides Information LOPE-C 2010: Powering the next wave organic and printed electronics In its second year on the international stage, LOPE-C 2010 (Large-area, Organic and Printed Electronics Convention) has successfully positioned itself as the central market place of a newly emerging basic industry, serving as the meeting platform of its industrial, scientific, engineering, investor and end-user communities. View Source July 8, 2010 Provides Information LORD Executives to Present at International Symposium on Microelectronics LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries - has announced that Andrew Kintz, Manager, Open Technology Innovation, and Candice Brannen, Senior Scientist, will present white papers at the 43rd International Symposium on Microelectronics. View Source August 12, 2010 Provides Information M Macronix Paper on 3D NAND Flash Chosen for 2010 VLSI Technology Symposium Macronix International Co., Ltd., a leading provider of non-volatile memory semiconductor solutions, today announced its research results that provide a successful path to the most scalable and most efficient 3D NAND Flash using its patented BE- SONOS charge-trapping technology and 3D decoding architecture. View Source June 18, 2010 Provides Information Magma Announces Quartz iPOP Initiative to Enable Use in 65nm Processes Magma® Design Automation Inc., a provider of chip design software, today launched Quartz iPOP, the "improved Productivity, Operability and Performance" initiative to facilitate designers' adoption of the Quartz™ DRC and Quartz LVS software for designs targeted at 65 nanometers (nm) and below. Magma's Quartz products, the first truly scalable physical verification solutions, handle larger designs and provide turnaround time up to an order of magnitude faster than traditional solutions – without sacrificing accuracy or requiring additional hardware. View Source August 26, 2010 Provides Information Magma Design Automation Joins Si2's Design for Manufacturability Coalition The Silicon Integration Initiative (Si2) announced today that Magma® Design Automation, a provider of chip design software, is the latest member of Si2's Design for Manufacturability Coalition (DFMC). Magma joins other key players in the semiconductor supply chain, including Cadence Design Systems, IBM Corporation, Intel Corporation, Mentor Graphics, STARC, Synopsys, Tela Innovations and Texas Instruments, as DFMC members. View Source August 24, 2010 Provides Information Magma, GLOBALFOUNDRIES and Virage Logic Deliver Reference Flow for GLOBALFOUNDRIES 65-Nanometer Low-Power Process Magma® Design Automation, GLOBALFOUNDRIES and Virage Logic, today announced the availability of a proven, Unified Power Format (UPF)-compliant RTL-to-GDSII reference flow. This automated, comprehensive solution streamlines the design and manufacture of ICs that incorporate Virage Logic's intellectual property (IP) and are manufactured in GLOBALFOUNDRIES' 65LPe 65-nanometer (nm) low-power process technology. View Source June 16, 2010 Provides Information Magnetic fields can turn highly conductive carbon nanotubes into semiconductors Metallic carbon nanotubes show great promise for applications from microelectronics to power lines because of their ballistic transmission of electrons. But who knew magnets could stop those electrons in their tracks? View Source July 8, 2010 Provides Information Major Chipmaker Orders Three Wafer Inspection Systems from Camtek Camtek Ltd., announced today that it received follow-on orders for three wafer inspection systems from a major IDM and chipmaker. View Source July 23, 2010 Provides Information Material Scientists Use Nanoplates to Test Lithium Manganese Phosphate Batteries A little wax and soap can help build electrodes for cheaper lithium ion batteries, according to a study in August 11 issue of Nano Letters. The one-step method will allow battery developers to explore lower-priced alternatives to the lithium ion-metal oxide batteries currently on the market. View Source August 13, 2010 Provides Information Meijo University Orders AIXTRON CCS MOCVD System for GaN-based UV And White LEDs AIXTRON AG today announced a new order for one Close Coupled Showerhead® GaN based LED MOCVD system from Meijo University, in Nagoya, an established AIXTRON customer in Japan. The order was received earlier this year and the system will be delivered in the fourth quarter of 2010 in a 3x2-inch wafer configuration. View Source July 27, 2010 Provides Information MEMS Patents Purchased by Acacia’s Subsidiary Acacia Research Corporation announced today that a subsidiary has acquired MEMS patents from a leading research institute. View Source June 18, 2010 Provides Information MEMSIC Unveils VG800 MEMS-Based Vertical Gyro MEMSIC, Inc., a leading innovator of MEMS sensors and systems solutions, today announced its next-generation family of high-performance MEMS inertial systems. The VG800 vertical gyro is the first release in this new series of low-drift IMU products that challenge the price and accuracy of existing FOG-based IMUs. View Source August 25, 2010 Provides Information Mentor Graphics Supports TSMC's New 28nm AMS Reference Flow Mentor Graphics Corporation today announced corporate-wide support for TSMC's new Analog/Mixed-Signal Reference Flow 1.0, including analog IC simulation, physical and electrical verification, high-accuracy extraction and design for manufacturing. View Source June 18, 2010 Provides Information Mentor Supports TSMC in 28nm Test Chip Development Mentor Graphics Corporation today announced that its Calibre® Design-to-Silicon solutions were key elements in the successful development of TSMC's 28nm Product Qualification Vehicle, a major milestone in the TSMC process development. View Source August 10, 2010 Provides Information Methode's Inkjet Printable Conductive Ink Allows Printing of Circuits on Polyester with No Secondary Curing Methode Development Company, a business unit of Methode Electronics, Inc., announces that its conductive inkjet printable ink can now print circuits directly onto treated polyesters. The ink, formulated for thermal and piezo inkjet systems, makes it possible for engineers to print working electrical circuits, right from their desktops – facilitating product development, prototyping, and manufacturing processes. With this technology, scale-up for high volume manufacturing can be easily achieved. View Source June 23, 2010 Provides Information Metryx Sees Increased Adoption of Mass Metrology for 300 mm Metryx, Limited, announced that over the past six months it has seen a sharp recovery in business, with multiple Mentor mass metrology system orders received, including both new and repeat business. These orders represent customers who are expanding the use of Metryx' mass metrology systems in their production lines and initial implementations of the technology in new applications. Significantly, the orders come from companies based around the world, including the US, Europe and Asia. View Source July 12, 2010 Provides Information Micro- and nanotechnologies in the spotlight: expert discussion at the 16th annual World Micromachine Summit Last week the international micro- and nanotechnology community met in Dortmund, Germany on the occasion of the 16th international Micromachine Summit. The summit is an annual conference, which shows a snapshot of industrial, scientific and political micro and nano activities worldwide. View Source May 7, 2010 Provides Information Micro- and nanotechnology atlas of Germany Micro- and nanotechnology are key technologies that generate unique advanced and novel products, which are applied all over the world in many industries, like medical technology, mechanical engineering, production, the automotive industry or consumer electronics. In spite of the current economic crisis, micro and nano products are still reaching double-digit growth rates, for instance micro sensors for boom markets like green technologies and consumer electronics. View Source May 17, 2010 Provides Information Micro-electromechanical systems accurately align optical components on a silicon microchip All optics research requires precise alignment of optical components to ensure that light passes efficiently from one element to the next. At the micro-scale, however, the process is much more delicate and complicated. Now, an alignment mechanism integrated onto a silicon chip to allow quick and cheap optical optimization has been demonstrated by Qingxin Zhang and co-workers from the A*STAR Institute of Microelectronics in Singapore. View Source May 12, 2010 Provides Information Microfluidics Expands Partnership with Particle Sciences to Include Continuous Crystallization Capabilities Microfluidics, the exclusive global provider of Microfluidizer® high shear fluid processors, and Particle Sciences Inc. (PSI) , an integrated provider of drug development services, have expanded their partnership to include bottom-up nanoparticle creation and continuous manufacturing via High-Shear Microfluidics Reaction Technology™ (MRT). View Source July 8, 2010 Provides Information MicroProbe Tackles Mobile Consumer IC Wafer Test Challenges With New MEMS-Based Multi-DUT, Ultra-Fine-Pitch Probe Card MicroProbe, Inc., a leading supplier of wafer test technology to the global semiconductor industry, today introduced the MEMS-based Mx-FinePitch (Mx-FP) product. This new class of probe card tackles the ultra-fine-pitch testing needs of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs. Built for multi-DUT (Devices under Test) testing in high-volume production environments, the product requires no probe positioning adjustments throughout its lifetime. View Source July 12, 2010 Provides Information Microrobots showcase their skills at competition Make room, Bender, Rosie and R2D2! Your newest mechanical colleagues are a few steps closer to reality, thanks to lessons learned during two robotics events hosted by the National Institute of Standards and Technology (NIST) at the recent IEEE International Conference on Robotics and Automation (ICRA) in Anchorage, Alaska. The events—the Virtual Manufacturing Automation Competition (VMAC) and the Mobile Microrobotics Challenge (MMC)—were designed to prove the viability of advanced technologies for robotic automation of manufacturing and microrobotics. View Source May 26, 2010 Provides Information Microwave Transistor Laser Drives Modification of Current Law While the laws of physics weren't made to be broken, sometimes they need revision. A major current law has been rewritten thanks to the three-port transistor laser, developed by Milton Feng and Nick Holonyak Jr. at the University of Illinois. View Source May 13, 2010 Provides Information Milestone confirms light beams can replace electronic signals for future computers Intel Corporation has announced an important advance in the quest to use light beams to replace the use of electrons to carry data in and around computers. The company has developed a research prototype representing the world's first silicon-based optical data connection with integrated lasers. The link can move data over longer distances and many times faster than today's copper technology; up to 50 gigabits of data per second. View Source July 29, 2010 Provides Information MIT Researchers Explore Ways to Develop Thermopower Wave Devices Based on Carbon Nanotubes MIT researchers are exploring a new technology funded by the Air Force Office of Scientific Research, and the National Science Foundation, which they call a thermopower wave, that may convert chemical energy to fuel cells for micro-machines, sensors and emergency communication beacons. View Source May 4, 2010 Provides Information Mitsubishi Electric to Increase Wafer Production Capacity for Power Devices Mitsubishi Electric Corporation announced today it plans to invest 6.5 billion yen to expand its wafer production capacity for power devices by approximately 2.5 times that of the previous fiscal year. The expansion, to be conducted in several stages, will be completed by April 2011. View Source July 15, 2010 Provides Information MPEC Mobile Personal Entertainment Centre View Source   Provides Products mPhase Technologies to Speak at Nanotechnology Symposium at Stevens Institute of Technology on July 26th mPhase Technologies, Inc. today announced that it has been invited to give a technical presentation on smart surfaces and the Smart NanoBattery implementation at a technical symposium hosted at Stevens Institute of Technology in Hoboken, New Jersey on July 26, 2010. The symposium will highlight research and development advances that incorporate micro- and nanoscale structures and mechanical electrical microsystems (MEMS) designs. View Source July 21, 2010 Provides Information MunEDA's WiCkeD Solution Chosen for TSMC’s 65nm RF RDK 2.0 MunEDA's tool suite WiCkeD(TM) has been validated for TSMC’s RF Reference Design Kit (RDK) 2.0 as part of the TSMC Open Innovation Platform(TM). WiCkeD covers a wide range of topic in interactive and automatic specification-driven custom circuit design, including design centering, circuit sizing for performance and yield, performance analysis, statistical circuit analysis. View Source June 23, 2010 Provides Information MyBoneYard The simle, safe and smart way to recycle electronics! View Source   Provides a Service N Nano-C Introduces New Fullerene Derivative for Organic Photovoltaic Applications Nano-C, Inc. is pleased to announce the availability of a new fullerene derivative, Indene C60 Mono Adduct ("ICMA"). ICMA's use in Organic Photovoltaic devices was described in "Indene-C60 Bis adduct: A New Acceptor for High-Performance Polymer Solar Cells," J. Am. Chem. Soc., 2010, 132 (4), pp 1377–1382. View Source June 1, 2010 Provides Information Nanolithography: One-shot spots Demand for ever-smaller electronic devices, whether are for information storage, high-definition displays or sensor arrays, is driving demand for nanofabrication techniques that can define ever-smaller features on circuit boards — on scales smaller than micrometers, or even nanometers, in diameter. View Source September 1, 2010 Provides Information Nanometrics to Present at RBC Technology Conference Nanometrics Incorporated, a leading provider of advanced process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics, today announced that Dr. Timothy Stultz, President and CEO, will present at the RBC Capital Markets Technology, Media and Communications Conference in New York, NY on Thursday, June 10, 2010 at 9:00 a.m. EDT. View Source May 27, 2010 Provides Information Nanoparticles boost generator performance Siemens is searching for insulators that will make generators more efficient. The electrical energy in generators is generated in copper bars insulated against high electrical voltages with thick layers of plastic. New materials would enable a thinner design for these insulators, freeing up space for thicker bars in which ultimately more energy could be generated. View Source July 16, 2010 Provides Information Nanoparticles increase intensity of quantum dots' glow By linking individual semiconductor quantum dots with gold nanoparticles, scientists at the U.S. Department of Energy's (DOE) Brookhaven National Laboratory have demonstrated the ability to enhance the intensity of light emitted by individual quantum dots by up to 20 times. The precision method for making the light-emitting particle clusters — published online July 26, 2010 in the journal ChemComm — will greatly advance scientists' ability to study and modify the optical properties of quantum dots, and could eventually lead to improved solar energy conversion devices, light-controlled electronics, and biosensors. View Source July 26, 2010 Provides Information Nano 'pin art': Novel arrays are step toward mass production of nanowires Researchers at the National Institute of Standards and Technology (NIST) have cultivated many thousands of nanocrystals in what looks like a pinscreen or "pin art" on silicon, a step toward reliable mass production of semiconductor nanowires for millionths-of-a-meter-scale devices such as sensors and lasers. View Source July 22, 2010 Provides Information Nanoplas Installs Multiple HDRF Tools at Tronics' Facilities Nanoplas, a leading global supplier of HDRF® Plasma Processing Equipment for MEMS, 3D Semiconductors and III-V compounds, today announced that it has installed multiple tools in the two MEMS manufacturing sites of Tronics, a global leading manufacturer of integrated custom MEMS components, located in Grenoble, France and Dallas, Texas, U.S.A. View Source May 12, 2010 Provides Information Nanoribbons for graphene transistors for tomorrow's nanoelectronics In the recent issue of Nature, scientists from Empa and the Max Planck Institute for Polymer Research report how they have managed for the first time to grow graphene ribbons that are just a few nanometres wide using a simple surface-based chemical method. View Source July 21, 2010 Provides Information Nanostructuring Helps to Advance Displays In a step toward more efficient, smaller and higher-definition display screens, a University of Michigan professor has developed a new type of color filter made of nano-thin sheets of metal with precisely spaced gratings. View Source August 26, 2010 Provides Information Nanosphere clusters form building blocks for a new class of optical circuits Imagine creating novel devices with amazing and exotic optical properties not found in Nature—by simply evaporating a droplet of particles on a surface. View Source May 28, 2010 Provides Information Nanosys and Samsung Enter Alliance to Accelerate Commercial Applications of Nanomaterials for the Electronics and Solar Markets Nanosys, Inc., an advanced materials architect, and Samsung Electronics Co., Ltd., a global leader in semiconductor, telecommunication, and digital technologies, today announced a strategic alliance and licensing arrangement to accelerate the development of commercial applications of nano-architected materials for the electronics and thin film solar markets. Under the terms of the deal, Samsung Electronics will contribute funding and resources to co-develop products using Nanosys technologies, in addition to $15 million equity investment from the affiliated Samsung Venture Investment Corporation. View Source August 10, 2010 Provides Information Nanosys Establishes New Korean Subsidiary to Support Asian Customer Base Nanosys, Inc., an advanced materials architect, today announced the opening of a new subsidiary, Nanosys Korea, Inc. with facilities in Gyeonggi-do, Korea. The company named former LG Electronics vice president Dr. Jong-Uk Bu as president of Nanosys Korea, Inc., which will support its growing Korean and Asian customer base. View Source September 3, 2010 Provides Information Nanotech yields major advance in heat transfer, cooling technologies Researchers at Oregon State University and the Pacific Northwest National Laboratory have discovered a new way to apply nanostructure coatings to make heat transfer far more efficient, with important potential applications to high tech devices as well as the conventional heating and cooling industry. View Source June 9, 2010 Provides Information Nanotechnology Professor Awarded Business and Innovation Medal at the IoP Sir Michael Pepper at London Centre for Nanotechnology has been awarded a Gold Medal of the Institute of Physics for Business and Innovation. The citation reads: For translating advances in semiconductor physics into the commercial arena, including key roles in founding Toshiba Research Europe, Cambridge Laboratory, and TeraView Ltd. View Source July 6, 2010 Provides Information Nanotechnology researchers build transistor with just seven atoms Scientists have literally taken a leap into a new era of computing power by making the world's smallest precision-built transistor - a "quantum dot" of just seven atoms in a single silicon crystal. Despite its incredibly tiny size - a mere four billionths of a metre long - the quantum dot is a functioning electronic device, the world's first created deliberately by placing individual atoms. View Source May 24, 2010 Provides Information Nanotechnology Researchers Discover New and More Efficient Way to Encode Quantum Information within Silicon A team of scientists based at the London Centre for Nanotechnology and the National High Magnetic Field Lab (NHMFL) in Florida has discovered a new and more efficient way to encode quantum information within silicon. View Source August 16, 2010 Provides Information Nemotek Technologie is the Newest Wafer-Level Fab in the Mediterranean Nemotek Technologie, a manufacturer of customized Wafer-Level Cameras (WLCs), today announced that it is the newest wafer-level fab in the Mediterranean. Nemotek leverages its existing relationships with European partners and suppliers to produce and ship world-class, wafer-level optic (WLO), wafer-level camera (WLC) and wafer-level packaging (WLP) solutions to global customers. Based on its positioning, Nemotek, with its partners, can respond to growing demands for advanced micro cameras in various applications including mobile phones, notebooks, medical diagnostics such as endoscopy, automotive and consumer electronic devices. View Source June 15, 2010 Provides Information Nanotubes pass acid test Rice University scientists have found the "ultimate" solvent for all kinds of carbon nanotubes (CNTs), a breakthrough that brings the creation of a highly conductive quantum nanowire ever closer. View Source July 14, 2010 Provides Information Nanowick at heart of new system to cool 'power electronics' Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips. View Source July 22, 2010 Provides Information Nanowires for the electronics and optoelectronics of the future Organic semiconductors are very promising candidates as starting materials for the manufacture of cheap, large area and flexible electronic components such as transistors, diodes and sensors on a scale ranging from micro to nano. A condition for success in achieving this goal is the ability to join components together with electrically conducting links – in other words, to create an electronic circuit. Empa scientists have developed a new method which allows them to create simple networks of organic nanowires. View Source June 23, 2010 Provides Information NASA funds nanomaterials for high energy lithium-ion batteries NanoEngineers at the University of California, San Diego are designing new types of lithium-ion (Li-ion) batteries that could be used in a variety of NASA space exploration projects – and in a wide range of transportation and consumer applications. NEI Corporation and UC San Diego recently won a Phase II Small Business Technology Transfer contract from NASA to develop and implement high energy density cathode materials for lithium batteries. View Source August 26, 2010 Provides Information NCKU Team Honored for Semiconductor Transistor-Type Hydrogen Sensor NCKU Microelectronics and Chemical Engineering students, led by Department of Electrical Engineering and Institute of Microelectronics Prof. Wen-Chau Liu and Department of Chemical Engineering Prof. Huey-Ing Chen, have won a gold medal at the 38th International Exhibition of Inventions of Geneva with their Semiconductor Transistor-Type Hydrogen Sensor. View Source May 6, 2010 Provides Information NetLogic Microsystems and TSMC Collaborate on 28nm Process Technology NetLogic Microsystems, Inc., a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, and Taiwan Semiconductor Manufacturing Company, today announced an extension of their long-standing collaboration to include TSMC’s NEXSYS™ 28HP (28nm high performance) semiconductor process node for NetLogic Microsystems’ next-generation knowledge-based processors, multi-core processors and 10/40/100Gigabit PHY. View Source May 3, 2010 Provides Information New Advanced Cooling Technology for Electronics Uses Carbon Nanotubes Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips. View Source July 23, 2010 Provides Information New, Affordable Mask and Bond Aligner from EV EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility. View Source July 7, 2010 Provides Information New Aleris 8330 Metrology Tool Measures Non-Critical Film Thickness at 32nm Node Today KLA-Tencor Corporation, the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, introduced the latest addition to the Aleris family of film metrology tools. View Source August 5, 2010 Provides Information New Approach to Apply Nanostructure Coatings for High Tech Devices Researchers at Oregon State University and the Pacific Northwest National Laboratory have discovered a new way to apply nanostructure coatings to make heat transfer far more efficient, with important potential applications to high tech devices as well as the conventional heating and cooling industry. View Source August 23, 2010 Provides Information New Automated Device Controls the Position of Single Quantum Dot Quantum dots may be small. But they usually don’t let anyone push them around. Now, however, JQI Fellow Edo Waks and colleagues have devised a self-adjusting remote-control system that can place a dot 6 nanometers long to within 45 nm of any desired location. View Source May 24, 2010 Provides Information New DDR300 NIR Inspection System Enables Efficient Chip Production McBain Systems has announced the first sale of its new DDR300 NIR (near infrared) Inspection System to one of the world’s largest semiconductor chip manufacturers. Installed in a fab in Kulim, Malaysia, the new Defect Detection and Review (DDR) station is being used to check for subsurface cracks and other defects that are hidden beneath layers of silicon and other semiconductor materials. View Source June 15, 2010 Provides Information New findings about the activity of graphene oxide sheets at interfaces Graphite oxide sheet, now being named graphene oxide – a compound of carbon, oxygen, and hydrogen obtained by treating graphite with strong oxidizers – has attracted substantial interest as a possible intermediate for the manufacture of graphene. It has been largely viewed as hydrophilic – having a strong affinity for water illustrated by its excellent colloidal stability in water. View Source May 26, 2010 Provides Information New graphene-based electronics could take a page out of the silicon electronics book An organic molecule that has been found to be effective in making silicon-based electronics may be viable for building electronics on sheets of carbon only a single molecule thick. Researchers at the Max Plank Institute for Metals Research in Stuttgart report the advance in a paper appearing online in the journal Physical Review B on June 1. View Source June 1, 2010 Provides Information New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates. View Source May 12, 2010 Provides Information New IC Compiler 2010.03 from Synopsys Offers Production Support for 28nm, 32nm Designs Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of IC Compiler 2010.03, a physical implementation solution delivering up to 2.5X faster performance on multicorner/multimode (MCMM) designs, and enhanced In-Design technology for faster design closure. View Source May 6, 2010 Provides Information New Images Provide Hints to Superconductivity in Pnictides New images of iron-based superconductors are providing telltale clues to the origin of superconductivity in a class of ceramic materials known as pnictides. View Source May 18, 2010 Provides Information New Light Source from Cymer Enables Chipmakers to Boost Wafer Output Cymer, Inc., the market's leading developer of light sources used to pattern advanced semiconductor chips, announced today the introduction of the ELS(TM) 7010x, the world's first field-selectable 30 to 50 watt (W) Krypton Fluoride (KrF) light source. View Source July 15, 2010 Provides Information New Market Research Report on Nano-Enabled Batteries Nano-enabled (or nanostructured) batteries are an advanced generation of lithium-ion (Li-ion) batteries and battery systems. View Source August 12, 2010 Provides Information New material may reveal inner workings of high-temperature superconductors Measurements taken at the National Institute of Standards and Technology (NIST) may help physicists develop a clearer understanding of high-temperature superconductors, whose behavior remains in many ways mysterious decades after their discovery. View Source August 31, 2010 Provides Information New materials for see-through electronics Tyndall National Institute and Umicore have signed a licence deal after the joint development of a novel material for transparent electronics. View Source May 10, 2010 Provides Information New metamaterial device may lead to see-through cameras and scanners Devices that can mimic Superman's X-ray vision and see through clothing, walls or human flesh are the stuff of comic book fantasy, but a group of scientists at Boston University (BU) has taken a step toward making such futuristic devices a reality. View Source May 6, 2010 Provides Information New Method to Control Phase of Ultrashort Laser Pulse Lasers can now generate light pulses down to 100 attoseconds thereby enabling real-time measurements on ultrashort time scales that are inaccessible by any other methods. View Source May 12, 2010 Provides Information New Method to Synthesize Organic Nanowires Organic semiconductors are very promising candidates as starting materials for the manufacture of cheap, large area and flexible electronic components such as transistors, diodes and sensors on a scale ranging from micro to nano. A condition for success in achieving this goal is the ability to join components together with electrically conducting links – in other words, to create an electronic circuit. Empa scientists have developed a new method which allows them to create simple networks of organic nanowires. View Source June 23, 2010 Provides Information New Microelectronics Advertising Campaign for QA Professionals Microelectronics have changed the lives of people around the globe in countless ways. View Source August 19, 2010 Provides Information New ML Series Amplifier from Aerotech for Micropositioning Applications Latest from Aerotech is a new digital servo amplifier with a linear power stage for ultra-high resolution brushed or brushless linear and rotary motion control systems. View Source August 23, 2010 Provides Information New nanoscale electrical phenomenon discovered At the scale of the very small, physics can get peculiar. A University of Michigan biomedical engineering professor has discovered a new instance of such a nanoscale phenomenon—one that could lead to faster, less expensive portable diagnostic devices and push back frontiers in building micro-mechanical and "lab on a chip" devices. View Source May 18, 2010 Provides Information New OLETs emit light more efficiently than equivalent OLEDs Already, organic light-emitting diodes (OLEDs) are becoming commercialized for light display applications due to their advantages such as low fabrication costs and large-area emission. But OLEDs also have intrinsic efficiency limitations due to their structure, which might limit their future development in terms of brightness. Now, a team of researchers has found that another organic semiconductor-based device, the organic light-emitting transistor (OLET), can dramatically increase the efficiency of OLEDs since OLETs have the structure of a transistor rather than a diode. In their recent study, the researchers have created OLETs that are 10 times more efficient than any previously reported OLET, as well as more than twice as efficient as an optimized OLED made with the same materials. View Source May 31, 2010 Provides Information New Optical Effect Solves Major Hurdle in Spin-Based Electronics Using powerful lasers, Hui Zhao, assistant professor of physics and astronomy at the University of Kansas, and graduate student Lalani Werake have discovered a new way to recognize currents of spinning electrons within a semiconductor. View Source August 25, 2010 Provides Information New process for creating monolayers of gold nanoparticles holds promise for nanoelectronics Researchers at Rensselaer Polytechnic Institute have developed a new, ultra-simple method for making layers of gold that measure only billionths of a meter thick. The process, which requires no sophisticated equipment and works on nearly any surface including silicon wafers, could have important implications for nanoelectronics and semiconductor manufacturing. View Source June 16, 2010 Provides Information New Process to Synthesize Nanostructured Polymer Arrays Tomorrow's television and computer screens could be brighter, clearer and more energy-efficient as a result of a process developed by a team of researchers from Canada and the Department of Energy's Oak Ridge National Laboratory. View Source July 20, 2010 Provides Information New Research Stimulates Development of Quantum Computing Based on Semiconductors A team of scientists at UC Santa Barbara that helped pioneer research into the quantum properties of a small defect found in diamonds has now used cutting-edge computational techniques to produce a road map for studying defects in alternative materials. View Source May 3, 2010 Provides Information New Report Shows That Nanogen’s Hair Fibres Offer Better Performance Early indications from an unpublished report support performance claims made by Nanogen with scientific data. Nanofibres are microscopic keratin fibres that attach to hair using an electrostatic charge. Other companies produce hair fibres, but Nanogen’s Nanofibres are always reviewed favourably, and are commonly thought to be superior in quality and in effectiveness. The new report will corroborate this public opinion with quantitative data showing Nanogen’s hair fibres perform better in several key areas. View Source May 10, 2010 Provides Information New Silicon-Validated Solution Developed for SoC Designs at 28nm and Beyond GLOBALFOUNDRIES today announced the availability of a new silicon-validated solution to help customers accelerate time-to-volume for complex SoC designs at 28nm and beyond. Called DRC+, the technique goes beyond standard Design Rule Checking (DRC) and uses two-dimensional shape-based pattern-matching to enable a 100-fold speed improvement in identifying complex manufacturing issues without sacrificing accuracy. View Source June 16, 2010 Provides Information New SiANA Analog IP Portfolio Ideal for TSMC’s 40, 65, and 90-nm Process Nodes Virage Logic Corporation, the semiconductor industry's trusted IP partner, today announced the expansion of its broad semiconductor IP product portfolio with the introduction of SiANA, a new offering of silicon-proven analog IP components essential for building multimedia consumer electronics devices. View Source July 27, 2010 Provides Information New Smaller Flash AVR Microcontroller Package Launched by Atmel Atmel® Corporation, a leader in microcontroller and touch solutions, today announced production availability for the world's smallest flash AVR® microcontroller package. View Source May 17, 2010 Provides Information New smart materials process promises to revolutionize manufacturing of products A new "smart materials" process - Multiple Memory Material Technology - developed by University of Waterloo engineering researchers promises to revolutionize the manufacture of diverse products such as medical devices, microelectromechanical systems (MEMS), printers, hard drives, automotive components, valves and actuators. View Source September 1, 2010 Provides Information New study shows silver nanoparticles mitigate cell damage caused by ethanol The cover story of the most recent edition of the Journal of the American Chemical Society (JACS) describes how nanoparticles formed by very small numbers of silver atoms can protect against the cell damage caused by ethanol. The study was led by researchers from the University of Barcelona (Spain) and conducted in conjunction with the Magnetism and Nanotechnology laboratory of the University of Santiago de Compostela. View Source May 26, 2010 Provides Information New Technique May Help Develop Optical Data-Processing Chips Powerful new microscopes able to resolve DNA molecules with visible light, superfast computers that use light rather than electronic signals to process information, and Harry Potteresque invisibility cloaks are just some of the many thrilling promises of transformation optics. View Source July 7, 2010 Provides Information New Technologies Boost Microscopy Market Growth in Latin America The Medical Device practice at MarketsandMarkets is pleased to announce a new report titled Microscopy - Advanced Technologies in Latin America (2010 - 2015). View Source June 23, 2010 Provides Information New Ultra High Power 520nm LED from Prizmatix Prizmatix Ltd recently released a new Fiber Coupled Ultra High Power LED-520nm (in addition to previously announced Ultra High Power Fiber Coupled LED-420nm); it provides almost x10 increase of power in comparison with similar High Power LED devices. View Source September 6, 2010 Provides Information New Way to Produce Copper Nanowires in Larger Scale A team of Duke University chemists has perfected a simple way to make tiny copper nanowires in quantity. The cheap conductors are small enough to be transparent, making them ideal for thin-film solar cells, flat-screen TVs and computers, and flexible displays. View Source June 2, 2010 Provides Information New Way to Utilize Gallium Arsenide Nanodevice at Terahertz Speeds Physicists in the United States and Germany have discovered a way to use a gallium arsenide nanodevice as a signal processor at "terahertz" speeds, the first time it's been used for this purpose and an important step forward in the new world of optical communication and computing. View Source July 20, 2010 Provides Information New White Paper on Surface Analysis Techniques of Semiconductor Materials Stoke-on-Trent (UK), CERAM, a global expert in materials testing, analysis and consultancy, has published a new white paper outlining the advantages of employing a range of modern surface characterisation techniques to obtain quantitative chemical and physical information on the structure and composition of semiconductor materials. View Source July 6, 2010 Provides Information New Vertically Optimized Nanometer Design Platform for Advanced Device Production Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys, Inc today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices. View Source June 15, 2010 Provides Information NEXX to Deliver Sputter Tool to Wafer Bumping Facility in China NEXX Systems– a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat sputter tool order for an Apollo physical vapor deposition system to an emerging leader in flip chip manufacturing at their wafer bumping facility in China. View Source July 15, 2010 Provides Information NEXX to Deliver Wafer Level Packaging Technologies to Unisem NEXX Systems – a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat, multi-product order for an Apollo physical vapor deposition system and Stratus electrochemical deposition system to Unisem Advanced Technologies (UAT), a wafer bumping facility in Malaysia. View Source July 1, 2010 Provides Information NN-Labs New Qshift Coral Technology Enables Compromise-Free High Quality, High Efficiency LED Lighting NN-Labs is pleased to announce the immediate availability of materials based on NNCrystal's Qshift Coral technology following the recent successfully completed review by the U.S. Environmental Protection Agency (EPA). Qshift Coral comprises specially engineered colloidal nanocrystals (quantum dots) to finely tune light such that the color of the light can be precisely controlled. Specifically, Qshift Coral technology makes lighting warmer and of higher quality, while reducing energy consumption for the same Lumen output compared with traditional phosphor-based warm white lighting. View Source June 16, 2010 Provides Information NNCrystal and Acuity Brands Sign Definitive Supply Agreement NNCrystal US Corporation today announced that they have signed a definitive supply agreement with Acuity Brands Lighting, Inc. to provide NNCrystal’s Qshift technology for use in Acuity Brands Lighting’s leading light-emitting diode (LED) lighting products. View Source May 12, 2010 Provides Information NNCrystal US Corporation Announces Definitive Supply Agreement with Acuity Brands Lighting NNCrystal US Corporation today announced that they have signed a definitive supply agreement with Acuity Brands Lighting, Inc. to provide NNCrystal’s Qshift technology for use in Acuity Brands Lighting’s leading light-emitting diode (LED) lighting products. View Source May 11, 2010 Provides Information Nova Introduces Fourth Generation NovaMARS Optical CD Application Development Solution Nova Measuring Instruments Ltd. provider of leading edge stand-alone metrology and the market leader of integrated metrology solutions to the semiconductor process control market, today introduced its fourth generation NovaMARS optical CD application development solution. View Source July 19, 2010 Provides Information Novel buckypaper device converts light into electricity Previous studies have revealed that single-walled carbon nanotubes (SWCNTs) strongly absorb light, especially in the near-infrared (NIR) region, and convert it into heat. There even has been a report that fluffy SWCNTs can burst into flames when exposed to a camera flash, which means the local temperature has reached 600-700°C. View Source July 29, 2010 Provides Information Novel electrical confinement method fabricates uniform quantum dots based on quantum well Quantum dots have been receiving extensive attention from researchers because they can be widely used for basic physics study, quantum computing, biological imaging, nanoelectronics, and photonics applications. View Source July 30, 2010 Provides Information Novel Electricity Generating System Based on Nanocomponents Plants are good at doing what scientists and engineers have been struggling to do for decades: converting sunlight into stored energy, and doing so reliably day after day, year after year. Now some MIT scientists have succeeded in mimicking a key aspect of that process. View Source September 6, 2010 Provides Information Novel storage materials of the future will be made out of magnetic films Christian Stamm and his colleagues at the Helmholtz-Zentrum Berlin für Materialien und Energie (HZB) can look back on six years of pioneering work at the synchrotron BESSY II. They have set up a unique experiment on so-called femtoslicing, and are now publishing a result obtained in collaboration with an external user group. Together with their colleagues from Strasbourg, they report in the upcoming issue of Nature how fast the magnetism of a material can be influenced. View Source May 26, 2010 Provides Information Novel Technique for Characterization of Monolayer Segregation Scientists at the University of Nantes (France) have recently developed a novel technique to detect and quantify grain boundary segregations using wavelength dispersive X-ray spectroscopy (WDS). View Source June 1, 2010 Provides Information Novelda AS to Exhibit Nanoscale Impulse Radar at EXPO 2010 in Shanghai Novelda AS, a fabless semiconductor company specializing in nanoscale wireless low-power technology for impulse radar, has been invited by the Norwegian government and Innovation Norway to exhibit at the prestigious EXPO 2010, taking place in Shanghai, China in September 2010. View Source September 2, 2010 Provides Information Novellus Develops Innovative Ultra-Thin Film for 3Xnm Technology Node and Beyond Novellus Systems announced today that it has developed an innovative DirectFill CVD tungsten nitride (WN) liner-barrier film that replaces the conventional physical vapor deposition (PVD) Ti liner and metallo-organic chemical vapor deposition (MOCVD) TiN barrier film stack used for the tungsten via to copper interconnect application in advanced memory devices. View Source May 7, 2010 Provides Information Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications Novellus Systems has announced that it has developed conformal film deposition (CFD) technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology addresses sub-32nm requirements for front-end-of-line (FEOL) applications such as gate liners and spacers, shallow trench isolation high-k metal gate (HKMG) liners, and spacers used for double patterning applications. View Source August 17, 2010 Provides Information NSCore Announces Its OTP-IP Exceeded 55 Million Pieces Threshold NSCore, Inc., a leading provider of non-volatile memory intellectual property, has announced that the cumulative shipment equipped with its PermSRAM® non-volatile memory IP has exceeded the 55 million pieces threshold. With its reliable programming, 10+ year lifetime, and read voltages down to 1.0V, PermSRAM® has proven to be a technology leader in the one time programmable (OTP) NVM marketplace. View Source August 6, 2010 Provides Information NSF funds expedition into software for efficient computing in the age of nanoscale devices As semiconductor manufacturers build ever smaller components, circuits and chips at the nano scale become less reliable and more expensive to produce. The variability in their behavior from device to device and over their lifetimes – due to manufacturing, aging-related wear-out, and varying operating environments – is largely ignored by today's mainstream computer systems. View Source September 2, 2010 Provides Information NXP and Applied Materials Sign Comprehensive Service Contract Applied Materials, Inc. today announced that it has signed a comprehensive, five-year contract to service all Applied Materials chip production equipment at NXP Semiconductor's facility in Nijmegen, Holland. Through its flexible Applied Performance Service program, Applied will provide NXP with committed system uptime for over 70 Applied Materials systems in NXP's 8-inch wafer facility, at a low, predictable cost that scales with factory loading – a key ingredient for success in the current business climate. View Source July 13, 2010 Provides Information O Observation of atomic processes identifies how fullerenes push their way under graphene surfaces Fullerene and graphene, two forms of carbon only recently discovered, have been stimulating the imaginations of researchers ever since their discovery (fullerene in 1970, graphene in 2004). With graphene especially, researchers see a chance for a new chapter in electronics, since this semiconductor material could one day replace the long-standing key element silicon. For this to happen, it would have to be possible to dope graphene – which is a single-atom layer of graphite – with foreign atoms. And in such a way that the important structural properties of graphene remain intact. View Source July 13, 2010 Provides Information One more step on the path to quantum computers Researchers around the world are working on the development of quantum computers that will be vastly superior to present-day computers. Here, the strong coupling of quantum bits with light quanta plays a pivotal role. Professor Rudolf Gross, a physicist at the Technische Universitaet Muenchen (TUM), and his team of researchers have now realized an extremely strong interaction between light and matter that may represent a first step in this direction. View Source July 30, 2010 Provides Information OptimalTest to Provide STMicroelectronics with Advanced Adaptive Test Solutions for Enhanced Test Operations OptimalTest, a leader in Advanced Adaptive Test® and enterprise-wide test management and optimization software for the semiconductor industry, has entered into a licensing agreement with STMicroelectronics to provide solutions for test floor monitoring and control, including early detection of issues, for the semiconductor company’s distributed test operations. View Source May 24, 2010 Provides Information Organic nanoelectronics a step closer Although they could revolutionize a wide range of high-tech products such as computer displays or solar cells, organic materials do not have the same ordered chemical composition as inorganic materials, preventing scientists from using them to their full potential. But an international team of researchers led by McGill's Dr. Dmitrii Perepichka and the Institut national de la recherche scientifique's Dr. Federico Rosei have published research that shows how to solve this decades-old conundrum. The team has effectively discovered a way to order the molecules in the PEDOT, the single most industrially important conducting polymer. View Source June 15, 2010 Provides Information Organic nanowires open up possibilities for nanoelectronics Swiss and German materials scientists have created simple networks of organic nanowires for future electronic and optoelectronic components. The successful approach synthesises the complex and incredibly thin nanowire structures, and joins them to electrically conducting links (essentially creating an electronic circuit). View Source July 12, 2010 Provides Information Osram's New Chip Platform Increases LED Efficiency By 30% Developers at OSRAM Opto Semiconductors have succeeded in increasing the efficiency of red thin-film LEDs by 30% – a new record. The latest generation of thin-film chips benefit from an optimized chip platform which has potential for further improvements. This boost in efficiency is opening up new LED applications in general illumination, in projection and in the industrial sector. View Source July 26, 2010 Provides Information Overlooked element could be part of dream team for quantum computing A team of scientists based at the London Centre for Nanotechnology and the National High Magnetic Field Lab (NHMFL) in Florida has discovered a new and more efficient way to encode quantum information within silicon. View Source August 16, 2010 Provides Information Oxford Instruments Launches PlasmaPro NGP80 Next Generation Plasma System A leader in tools for etch, deposition and growth, Oxford Instruments has just launched its PlasmaPro NGP80 system. View Source June 2, 2010 Provides Information Oxford Instruments Signs Research Collaboration Agreement with University of Southampton Oxford Instruments and the School of Electronics and Computer Science (ECS) at the University of Southampton, are delighted to announce that they have just signed a research-based collaboration agreement. View Source July 29, 2010 Provides Information P Pall Introduces New Membrane Technology for Semiconductor Fabrication Pall Corporation today announced a next-generation, highly asymmetric membrane technology for semiconductor fabrication that advances wet chemical filtration performance to a level of 10 nanometers and reduces energy costs. The new Pall Ultipleat® SP DR series filter cartridge will be unveiled at SEMICON West 2010, the flagship annual event for the global microelectronics industry, taking place in San Francisco from July 13-15, booth 1721. View Source July 8, 2010 Provides Information Pall’s Water Reclaim System Named Finalist for Sustainable Technologies Award Pall Corporation, a global leader in filtration, separation and purification, today announced that its Pall Aria water reclaim system has been selected as a finalist for SEMICON West’s Sustainable Technologies Award. View Source July 9, 2010 Provides Information Palomar Will Be Showcasing Wafer Scale Optical Sub-Assemblies Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging, and experts in precision wire bonding, complex hybrid packaging, and high accuracy die bonding systems, announced today that it will exhibit at the MicroElectronics Packaging and Test Engineering Council (MEPTEC) Symposium held in San Jose, May 20, 2010. View Source May 20, 2010 Provides Information Paradigm Shift in Information and Communication Technology Researchers forecast "paradigm shift in information and communication technology" View Source May 26, 2010 Provides Information Philips Launches New LED Emitters Based on Thin Film Flip Chip Technology Philips Lumileds announced the release of two new LUXEON Rebel LEDs with correlated color temperatures (CCTs) of 2700K and 3000K that expand the company’s portfolio for indoor illumination applications in hotels, shops, restaurants, and homes. The new emitters use the latest thin film flip chip (TFFC) and proprietary Lumiramic phosphor technologies. View Source June 4, 2010 Provides Information PhotoAlley is the premier photographic site on the web. It is built around three key activity centers including Commerce, Articles, and Galleries. View Source   Provides Products Photonic Crystal Fiber Set to Revolutionize Performance of Fiber-Optic Devices The thin glass threads of conventional optical fibers underpin our information-driven society, moving data in the form of light pulses at breakneck speeds around the globe. Now, a new type of optical fiber, called photonic crystal fiber (PCF), is set to revolutionize the performance of fiber-optic devices. PCF contains a periodic arrangement of small air holes that can manipulate the behavior of photons, enabling control over the transmission of light in ways never seen before. View Source May 26, 2010 Provides Information Physicists Explore Magnetic Properties of Carbon Nanotubes Metallic carbon nanotubes show great promise for applications from microelectronics to power lines because of their ballistic transmission of electrons. But who knew magnets could stop those electrons in their tracks? View Source July 9, 2010 Provides Information Plastics-based electronics Light-emitting or energy-converting, intelligent and flexible: customers are eagerly awaiting the products of the future, prototypes of which will be on show during K 2010, the world's leading plastics and rubber trade fair, to be held in Düsseldorf from 27 October to 3 November. View Source July 28, 2010 Provides Information Polymer carpets - a new class of nanomaterials for NEMS and MEMS Unlike most biological membranes, polymeric, nanometer-thin membranes are very stable and can withstand considerable pressure. This is an essential requirements for separation processes such as in water purification and desalination. Because their mechanical stability can be combined with flexibility and chemical functionality, polymer nanomembranes are also intensely researchers as materials for actuators and microsensors. View Source September 2, 2010 Provides Information Polymer synthesis could aid future electronics Tomorrow's television and computer screens could be brighter, clearer and more energy-efficient as a result of a process developed by a team of researchers from Canada and the Department of Energy's Oak Ridge National Laboratory. View Source July 19, 2010 Provides Information Prediction of intrinsic magnetism at silicon surfaces could lead to single-spin magnetoelectronics The integration of single-spin magnetoelectronics into standard silicon technology may soon be possible, if experiments confirm a new theoretical prediction by physicists at the Naval Research Laboratory (NRL) and the University of Wisconsin-Madison. The researchers predict that a family of well-known silicon surfaces, stabilized by small amounts of gold atoms, is intrinsically magnetic despite having no magnetic elements. None of these surfaces has yet been investigated experimentally for magnetism, but the new predictions are already supported indirectly by existing data. The complete findings of the study are published in the August 24, 2010, issue of the journal Nature Communications. View Source August 26, 2010 Provides Information Promising perspectives for mass production of graphene-based nanoelectronics Before the superior electronic properties of graphene can be utilized in industrial products, researchers must find a way that allows the mass production of graphene-based devices. New work by a European research team now demonstrates the feasibility of graphene synthesis on commercially available cubic SiC/Si substrates of >300 mm in diameter, which result in graphene flakes electronically decoupled from the substrate. View Source June 18, 2010 Provides Information Purdue's Supercomputers Help Design Advanced Nanoscale Electronics What may look like a shipping container dropped off a freight train onto a lot near the Purdue power plant is really a new home for the university's Steele supercomputing cluster. View Source September 3, 2010 Provides Information Pyxis Router Selected for TSMC 28nm Analog/Mixed-Signal Reference Flow Pyxis Technology, Inc., the company innovating software solutions for the physical design and routing of custom integrated circuits (ICs), announced today that its NexusRoute-HPC (high performance custom) router has been selected for use in the TSMC 28nm Analog and Mixed-Signal (AMS) Reference Flow 1.0. View Source June 15, 2010 Provides Information Q QD Vision Acquires Motorola Patent Portfolio Covering the Use of Quantum Dots in Display and Lighting Applications QD Vision, developer of Quantum Light™ nanotechnology-based products for solid state lighting and displays, today announced it has purchased from Motorola a patent portfolio pertaining to the use of quantum dot technology in display and lighting products. View Source May 24, 2010 Provides Information Qualcomm and SEMATECH to Collaborate on Key Roadmap Challenges SEMATECH, a global consortium of the world's leading chip manufacturers, and Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, today announced that Qualcomm has entered into a collaborative agreement with SEMATECH to advance CMOS scaling and assess new technologies. View Source June 15, 2010 Provides Information Qualcomm Announces Investment in Wafer-Based Optical Products Manufacturer Anteryon, the world leader in wafer-based, miniature optical module production for mobile phone cameras and laser projection, and Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, today announced Qualcomm's strategic investment in Anteryon as part of its European investment fund. View Source June 7, 2010 Provides Information Queen's University in Canada Selects Linkam Temperature Stages to Characterize Ferroelectric Liquid Crystals Market leaders in temperature controlled microscopy, Linkam Scientific Instruments, have been used as temperature stage suppliers to Queen's University in Canada for ten years to study the properties of ferroelectric liquid crystals. View Source August 10, 2010 Provides Information QuickCap NX from Magma Passes UMC Qualification Process Magma® Design Automation, a provider of chip design software, today announced that United Microelectronics Corporation has qualified QuickCap® NX as a reference parasitic extraction tool for 40- and 65-nanometer process technology. View Source June 16, 2010 Provides Information R Radio Shack Personal radios, wireless telephones, batteries, gadgets, adapters, wires and plugs sit alongside computer equipment and stereo components on their shelves. Convenient online ordering also available. View Source   Provides Products RASIRC Supports Fraunhofer to Develop 300mm High-K Films RASIRC®, the steam purification company, is aiding Fraunhofer Center Nanoelectronic Technologies (CNT) in its search to develop new 300mm High-K films using Atomic Layer Deposition (ALD). View Source July 12, 2010 Provides Information Raytheon BBN Technologies Achieves Quantum Information Breakthrough Raytheon Company's BBN Technologies has achieved a major advance in quantum information technology with the coupling of light and superconductors. View Source June 22, 2010 Provides Information Redefining electrical current law with the transistor laser While the laws of physics weren’t made to be broken, sometimes they need revision. A major current law has been rewritten thanks to the three-port transistor laser, developed by Milton Feng and Nick Holonyak Jr. at the University of Illinois. View Source May 12, 2010 Provides Information Research on Light Scattering Through Semiconductor Nanowires Progress on controlling the growth and doping of semiconductor nanowires makes these structures promising building blocks for nanoelectronics and nanophotonics. View Source September 6, 2010 Provides Information Research partnership to develop silicon nanoelectronic circuits inspired by the brain The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced a collaborative partnership with Stanford University to develop silicon nanowire based circuits that are inspired by the brain. The quest to come up with an artificial system organised like the biological nervous system promises to drive the future of humanoid robots and pave the way for a generation of supercomputers that can perform highly complex decision-making for gaming and defense technologies. View Source July 21, 2010 Provides Information Researchers control collective spin states electrically at room temperature Processing large amounts of information in today's electronics requires large amounts of power, which results in heating. Heat can ruin modern electronics by potentially damaging the stuff that makes them work--the ever smaller and denser structures in a computer's "brain," the microprocessor that incorporates all of its logic functions. View Source August 18, 2010 Provides Information Researchers develop 120nm III-V high-electron-mobility transistors with cut-offs above 100 GHz Researchers based in China have developed 120nm III-V high-electron-mobility transistors (HEMTs) with millimeter-wave broadband and satellite communication applications in mind [Huang Jie et al, J. Semicond., vol31, p074008, 2010]. The current-gain cut-off frequency (fT) was 141GHz and the maximum power gain cut-off was (fmax) 120GHz. View Source August 4, 2010 Provides Information Researchers Develop New Transparent Conductive Oxides Using Quantum Mechanics European researchers have combined computer modelling of quantum mechanics and precision fabrication processes to create novel transparent conductive oxides made to order for a wide range of scientific and consumer applications. View Source August 27, 2010 Provides Information Researchers develop unique method to improve testing for small delay defects in semiconductors Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, the National Science Foundation (NSF) and researchers from the University of Connecticut (UConn) and Duke University have found a new way to significantly improve the screening of small delay defects (SDDs) commonly found in semiconductors. View Source July 20, 2010 Provides Information Researchers Devise New Magnetic Recording Medium Made Up of Tiny Nanospheres A new magnetic recording medium made up of tiny nanospheres has been devised by European researchers. The technology may lead to hard disks able to store more than a thousand billion bits of information in a square inch. View Source June 15, 2010 Provides Information Researchers discover how loops develop in graphene Nanoscale simulations and theoretical research performed at the Department of Energy's Oak Ridge National Laboratory are bringing scientists closer to realizing graphene's potential in electronic applications. View Source August 23, 2010 Provides Information Researchers discover new properties of world's thinnest material Graphene oxide, a single-atomic-layered material made by reacting graphite powders with strong oxidizing agents, has attracted a lot of interest from scientists because of its ability to easily convert to graphene — a hotly studied material that scientists believe could be used to produce low-cost carbon-based transparent and flexible electronics. View Source June 14, 2010 Provides Information Researchers print field-effect transistors with carbon nanotube-infused ink Rice University researchers have discovered thin films of nanotubes created with ink-jet printers offer a new way to make field-effect transistors (FET), the basic element in integrated circuits. View Source May 25, 2010 Provides Information Researchers simplify process to make nanowires Surface tension isn't a very powerful force, but it matters for small things — water bugs, paint, and, it turns out, nanowires. View Source July 21, 2010 Provides Information Researchers 'stretch' a lackluster material into a possible electronics revolution It's the Clark Kent of oxide compounds, and – on its own – it is pretty boring. But slice europium titanate nanometers thin and physically stretch it, and it then takes on super hero-like properties that could revolutionize electronics, according to new Cornell research. (Nature, Aug. 19, 2010.) View Source August 18, 2010 Provides Information Researchers Study Carbon Nanotube Application to Build Electronic Components The silicon transistors in your computer may be replaced in ten years by transistors based on carbon nanotubes. This is what scientists at the University of Gothenburg are hoping – they have developed a method to control the nanotubes during production. View Source May 31, 2010 Provides Information Researchers Study Mechanism of Atmospheric Pressure Plasma Jets Because they are portable and easy to operate at ambient temperatures, cold atmospheric pressure plasma jets (APPJs) should find innovative applications in biomedicine, materials science and fabrication industries. Research reported in the Journal of Applied Physics investigates an APPJ that extends from the ground electrode of a circuit. View Source August 25, 2010 Provides Information Researchers Turn Classic Children's Toy Into Tiny Motor Researchers at the University of Texas at Austin have miniaturized a children's toy into a tiny motor that could one day power medical devices or harvest solar energy. The device, called a radiometer, is based on a classical light-powered, rotating vane most often seen in mall novelty stores. But this radiometer is the world's smallest, with blades as thick as a human hair and a diameter about that of an eyeglass screw. View Source June 30, 2010 Provides Information Riley Solutions Inc. Selected for Competitive Role in DARPA Nano-Enhanced Armored Vehicle Challenge 2010 A new hybrid armor will undergo the most demanding and stringent testing by the Defense Advanced Research Program Agency (DARPA) in Ballston, VA in the fall of 2010. After passing selection, this armor will be able to provide U.S. military and law enforcement personnel serving at home or around the world with a better, lighter, and more cost effective protective solution than has ever been deployed before. View Source July 21, 2010 Provides Information Rudolph Technologies Buys Certain Assets of Yield Dynamics Software Business Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, reported today it has acquired selected assets of the Yield Dynamics software business from MKS Instruments. View Source August 12, 2010 Provides Information Rudolph’s NSX System Chosen for MEMS Processing by Fraunhofer ISIT Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing. The system will be installed this summer in the state-of-the-art 200 mm MEMS pilot production line at ISIT. View Source July 13, 2010 Provides Information S Samsung commissions semiconductor safety study Samsung Electronics said Thursday it has commissioned an independent health and safety review of its semiconductor factories in South Korea after employee illnesses and deaths raised fears of cancer risks. View Source July 15, 2010 Provides Information Sandwiching Nanoparticle Layer Can Boost Performance of Organic Transistors A pioneering study by researchers of The Hong Kong Polytechnic University (PolyU) has shown that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors which are commonly used in consumer electronics. View Source August 27, 2010 Provides Information Scientists Discover New Properties of Graphene Oxide Graphene oxide, a single-atomic-layered material made by reacting graphite powders with strong oxidizing agents, has attracted a lot of interest from scientists because of its ability to easily convert to graphene — a hotly studied material that scientists believe could be used to produce low-cost carbon-based transparent and flexible electronics. View Source June 15, 2010 Provides Information Scientists discover proton diode Biophysicists in Bochum have discovered a diode for protons: just like the electronic component determines the direction of flow of electric current, the "proton diode" ensures that protons can only pass through a cell membrane in one direction. Water molecules play an important role here as active components of the diode. View Source September 2, 2010 Provides Information Scientists Makes Microwave Fields Visible Using Clouds Of Ultracold Atoms Microwaves are an essential part of modern communication technology. Mobile phones and laptops, for example, are equipped with integrated microwave circuits for wireless communication. View Source August 13, 2010 Provides Information Scientists use a genetic light source to measure brain signals Electrical currents are invisible to the naked eye - at least they are when they flow through metal cables. In nerve cells, however, scientists are able to make electrical signals visible. Working with fellow experts from Switzerland and Japan, scientists from the Max Planck Institute for Medical Research in Heidelberg successfully used a specialized fluorescent protein to visualize electrical activity in neurons of living mice. View Source May 4, 2010 Provides Information Scientists Use Microscopy Technique to Study Electron Pairing Mechanism A research team at RIKEN, Japan’s flagship research organisation has experimentally determined the mechanism underlying the formation of electron pairs in iron-based high-temperature superconductors. The landmark finding, reported in the April 23rd issue of Science, establishes a key role for magnetism in superconductivity. View Source July 12, 2010 Provides Information Scientists Use Organic Electronics to Regulate Nerve Cells The breakthrough is based on an ion transistor of plastic that can transport ions and charged biomolecules and thereby address and regulate cells. View Source May 24, 2010 Provides Information Scientists Use Scanning Tunneling Microscope to Study Rotaxane Molecular Machines In the development of future molecular devices, new display technologies, and "artificial muscles" in nanoelectromechanical devices, functional molecules are likely to play a primary role. View Source July 7, 2010 Provides Information Self-Calibrating Micro Machines For Hyper-Accurate Sensors on Chips Micro electromechanical systems–or MEMS–hold a lot of promise for the future of high tech, but they also have their drawbacks, namely that they aren’t very precise. That’s because at such small scales there are no standards by which to measure very small forces or distances. But a team of Purdue researchers has developed a way for MEMS to self-calibrate, potentially opening the door to a variety of super-precise sensors and instruments used in everything from medicine to engineering to defense. View Source August 10, 2010 Provides Information SEMATECH and Carl Zeiss Demonstrate Mask Pattern Alignment and Registration to Enable Double Patterning Lithography SEMATECH and the Semiconductor Metrology Systems (SMS) division from Carl Zeiss announced today that Zeiss' next-generation photomask registration and overlay metrology system has successfully passed a key development milestone. The jointly developed system – called PROVE™ - demonstrated the measurement capability for advanced photomasks for the 32 nm node and below. In a series of test runs, the key specifications -- 0.5 nm repeatability and 1.0 nm accuracy in image placement, registration and overlay measurement -- were verified. View Source July 29, 2010 Provides Information SEMATECH and Dai Nippon Printing Collaborate to Accelerate Commercialization of Advanced Mask Lithography Technology SEMATECH, a global consortium of the world's leading chip manufacturers, today announced that it has entered into a partnership to accelerate commercialization of advanced mask lithography technology with Dai Nippon Printing Co., Ltd. (DNP), a leading producer of semiconductor photomasks. SEMATECH and DNP will collaborate at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany on methods for improving mask cleaning processes to reduce overall mask cost of ownership (CoO) and accelerate commercial manufacturing readiness. View Source August 24, 2010 Provides Information SEMATECH and Lasertec Partner at UAlbany NanoCollege to Develop TSV Solutions for Chip-Stacking Applications Lasertec Corporation of Japan has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing. View Source July 7, 2010 Provides Information SEMATECH Completes Fully Integrated 300mm Line for Via-Mid 3D ICs at UAlbany NanoCollege In another step towards driving the maturity of 3D IC integration, SEMATECH's 3D Interconnect program announced today the completion of its 300mm 3D IC pilot line, operating at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex. Dedicated to via-mid 3D applications, SEMATECH's development and exploratory platform includes all processes and test vehicles necessary to demonstrate the viability of the via-mid technology in conjunction with advanced CMOS. View Source August 30, 2010 Provides Information SEMATECH Makes Important Advances in Power and Performance Features for Next-Generation IC Devices SEMATECH engineers reported on materials and device structures that will define next generation CMOS and non-CMOS technologies at the 2010 Symposia on VLSI Technology and Circuits, June 15-18, at the Hilton Hawaiian Village in Honolulu, Hawaii. View Source June 23, 2010 Provides Information SEMI Honors Leading Innovations in Microelectronics Industry Jordan Valley Semiconductors and Nikon Corporation, Inc. are the winners of the prestigious “SEMICON Best of West” award. These awards, given today at the SEMICON West 2010 exhibition, are given based on the products’ financial impact on the industry, engineering or scientific achievement, and/or societal impact. View Source July 16, 2010 Provides Information Semiconductor Research Corporation creates industry and university collaboration for energy research Semiconductor Research Corporation, the world's leading university-research consortium for semiconductors and related technologies, today announced it has established a $5 million industry-university partnership devoted to bringing clean, reliable and efficient energy systems and technologies to the marketplace. Founding industry members include ABB, Applied Materials, Bosch, First Solar, IBM, Nexans and Tokyo Electron. View Source July 13, 2010 Provides Information Semiconductor transistor-type hydrogen sensor wins gold medal at Geneva Inventions Exhibition National Cheng Kung University (NCKU) Microelectronics and Chemical Engineering students, led by Department of Electrical Engineering and Institute of Microelectronics Prof. Wen-Chau Liu and Department of Chemical Engineering Prof. Huey-Ing Chen, have won a gold medal at the 38th International Exhibition of Inventions of Geneva with their Semiconductor Transistor-Type Hydrogen Sensor. View Source May 5, 2010 Provides Information Shaken and stirred: New partnership to create 'self-charging' batteries from ambient vibration To serve a world bent on gaining autonomous power for wireless sensors, MicroGen Systems LLC, of Ithaca and Cornell University's Energy Materials Center (emc2) have signed a memorandum of understanding to develop "self-charging" batteries – that use background shaking and stirring for their energy source. View Source July 20, 2010 Provides Information Shortage of Sapphire Wafers Affect LED Market Expansion The fast-growing market for high-brightness LEDs in LCD TVs will be restricted by a shortage of key semiconductor materials in the second half of 2010, as predicted by Strategy Analytics, in its report, “Materials Shortage to Restrict Rampant LED Market.” View Source May 19, 2010 Provides Information SILAN Orders Six AIXTRON New Generation CRIUS II Systems for GaN UHB-LED Boost AIXTRON AG announced today a new order for six CRIUS® II 55x2-inch configuration deposition systems from Hangzhou Silan Microelectronics Co., Ltd., 'SILAN'. The Hangzhou, PR China based company, placed the order in the second quarter of 2010 and will take delivery of the systems over the fourth quarter 2010 to first quarter 2011 period. The systems will be used for the volume production of GaN ultra-high brightness (UHB) blue/green LEDs. The local AIXTRON support team will commission the new reactors at the company's facility in Hangzhou, China. View Source July 6, 2010 Provides Information Silicon breakthrough brings quantum computer one step closer The remarkable ability of an electron to exist in two places at once has been controlled in the most common electronic material – silicon - for the first time. The research findings - published in Nature by a UK-Dutch team from the University of Surrey, UCL (University College) London, Heriot-Watt University in Edinburgh, and the FOM Institute for Plasma Physics near Utrecht - marks a significant step towards the making of an affordable "quantum computer". View Source June 23, 2010 Provides Information Silicon Carbide - An Up-and-Coming Semiconductor Material Silicon carbide is an up-and-coming semiconductor material. In a thesis project, the qualities of the crystals and the epitaxial layers underwent precise analysis. Another project combines the advantages of crystalline thin-film solar cells with a back contact structure. View Source May 19, 2010 Provides Information Silicon Chips to Enter World of High Speed Optical Processing Physicists at the University of Sydney have brought silicon chips closer to performing all-optical computing and information processing that could overcome the speed limitations intrinsic to electronics, with the first report published of an on-chip all-optical temporal integrator in Nature Communications today. View Source June 17, 2010 Provides Information Silicon nanowires: Pressure sensors get a boost In piezoresistive materials, mechanical stress influences the movement of charge available for conduction. The application of pressure to such materials translates into an easily measurable change in conductivity, making piezoresistives ideal for use in pressure and flow sensors. Chee Chung Wong and co-workers from the A*STAR Institute of Microelectronics and Nanyang Technological University in Singapore have now demonstrated a method to increase the piezoresistive sensitivity of silicon nanowires using an applied electric field ("Electrically Controlled Giant Piezoresistance in Silicon Nanowires"). View Source August 4, 2010 Provides Information Silicon oxide nanoelectronics circuits break barrier Rice University scientists have created the first two-terminal memory chips that use only silicon, one of the most common substances on the planet, in a way that should be easily adaptable to nanoelectronic manufacturing techniques and promises to extend the limits of miniaturization subject to Moore's Law. Last year, researchers in the lab of Rice Professor James Tour showed how electrical current could repeatedly break and reconnect 10-nanometer strips of graphite, a form of carbon, to create a robust, reliable memory "bit." At the time, they didn't fully understand why it worked so well. View Source August 31, 2010 Provides Information Siltronic Evaluates AltaSight SL300 Wafer Inspection System's Capabilities Siltronic AG, one of the leading suppliers of silicon wafers, is evaluating an AltaSight SL300 inspection system from Altatech Semiconductor S.A. to verify the tool's capabilities for use in wafer manufacturing. View Source June 29, 2010 Provides Information SIMTech Procures AIXTRON 6-inch Black Magic Tool for Novel CNT Components Research AIXTRON AG today announced the order for a Black Magic Nanomaterial deposition system to the Singapore Institute of Manufacturing Technology (SIMTech). The 6-inch wafer system has been installed and commissioned in the Materials Joining Laboratory by AIXTRON’s local support team. View Source May 25, 2010 Provides Information Single-Machine Massively Accelerates Analog/RF Block Characterization with Nanometer SPICE Accuracy Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced the AFS Multi-Core Parallel operating mode (AFS MCP). AFS MCP automatically runs corners, sweeps, and Monte Carlo iterations in parallel on separate cores on up to 8-core shared-memory systems. The result is 25x to more than 50x higher performance than traditional SPICE on single-core systems with identical accuracy and no use model changes. View Source May 25, 2010 Provides Information SiTime Expects Shipments of MEMS-Based Timing Products to Exceed 20 Million Units in May 2010 SiTime Corporation, the industry leader in MEMS-based analog semiconductor solutions, today announced that cumulative shipments of its MEMS First™ CMOS oscillators and clock generators are expected to exceed 20 Million Units in May 2010. View Source May 4, 2010 Provides Information 'Smart' sand: grain-sized nanotechnology electronic noses are on the horizon Imagine a device the size of – and nearly as cheap as – a grain of sand which is capable of analyzing the environment around it, recognize its chemical composition, and report it to a monitoring system. This is the concept of nanotechnology-based electronic noses (e-nose) – miniature electronic devices which mimic the olfactory systems of mammals and insects and which will lead to better, cheaper and smaller sensor devices. View Source July 28, 2010 Provides Information Smartkem Wins Gold at Inaugural Best of British Innovation Award at Venturefest 2010 SmartKem Ltd, the developer of novel materials and processes that create high resolution microelectronic components directly onto thin flexible materials, today announced that it has been awarded gold at the Venturefest 2010 Best of British Innovation Award. This prestigious award recognises SmartKem as one of the year's most exciting technology businesses for its innovative new printed electronics solution. View Source June 25, 2010 Provides Information Small wires make big connections for microelectronics University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics. View Source July 16, 2010 Provides Information SMIC 65nm Technology Successfully Moves to Volume Production Semiconductor Manufacturing International Corporation ("SMIC"), a world leading semiconductor foundry and the most advanced in Mainland China, announced today that its Low Leakage 65-nanometer (nm) technology, implemented at SMIC's 300mm facility in Beijing, has successfully moved to Volume Production Stage. The 65-nm accumulative wafer shipment has achieved over 10,000 pieces since its mass production began in Q3 2009. View Source August 3, 2010 Provides Information SMIC and Virage Logic Extend Partnership to 40nm LL Process Technology Virage Logic Corporation and Semiconductor Manufacturing International Corporation, the leading foundry in China, today announced the extension of their longstanding partnership to the 40-nanometer (nm) low-leakage (LL) process technology. View Source July 23, 2010 Provides Information SMIC, Virage to Provide Complete IP Solution for 65nm Manufacturing Virage Logic Corporation, the semiconductor industry's trusted IP partner, and Semiconductor Manufacturing International Corporation, the leading foundry in China, today announced the expansion of their longstanding partnership to include the 65-nanometer (nm) low-leakage (LL) process technology. View Source May 24, 2010 Provides Information Software for efficient computing in the age of nanoscale devices As semiconductor manufacturers build ever smaller components, circuits and chips at the nano scale become less reliable and more expensive to produce. The variability in their behavior from device to device and over their lifetimes – due to manufacturing, aging-related wear-out, and varying operating environments – is largely ignored by today's mainstream computer systems. View Source August 19, 2010 Provides Information Solar, infrared and light emitting diode experts met in Chicago to discuss advances in photonic materials and devices On July 12 and 13, 2010, experts from across the solar photovoltaics, infrared (IR) photovoltaics and light emitting diode (LED) disciplines met to review and discuss recent progress and future trends in the rapidly advancing fields of photonic materials and devices at the 2010 International Symposium on Optoelectronic Materials and Devices. View Source July 22, 2010 Provides Information Soochow University Procures AIXTRON Black Magic Tool for Nanoelectronics, Sensing and Energy Research AIXTRON AG today announced an order for one Black Magic deposition system in a 4-inch wafer configuration from Soochow University's Functional Nano & Soft Materials Laboratory (FUNSOM) in Suzhou, Jiangsu, China. The order was received in the first quarter of 2010 and after the system´s delivery and installment in the current quarter, the Black Magic will be used for the controlled growth of carbon nanotubes and silicon nanowires. View Source August 31, 2010 Provides Information Spintronics breakthrough holds promise for next-generation computers Using powerful lasers, Hui Zhao, assistant professor of physics and astronomy at the University of Kansas, and graduate student Lalani Werake have discovered a new way to recognize currents of spinning electrons within a semiconductor. View Source August 24, 2010 Provides Information Spintronics, New Substitute for Microelectronics Researchers at Ohio State University have demonstrated the first plastic computer memory device that utilizes the spin of electrons to read and write data. View Source August 10, 2010 Provides Information SPTS to Supply 300mm Technology to New Fraunhofer ASSID Center SPP Process Technology Systems (SPTS), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, has announced that it has received an order for a Pegasus DSi Deep Silicon etch system supported on the Omega fxP cluster platform, for 3D-IC through silicon via (TSV) application from Fraunhofer IZM, to be installed at All Silicon System Integration Dresden (ASSID). View Source June 1, 2010 Provides Information STMicroelectronics' Newest 3-Axis Accelerometer: Stingy with Power, Spendthrift with Features STMicroelectronics, a leading supplier of MEMS for consumer and portable applications, has extended its motion-sensor portfolio with a 3-axis digital-output accelerometer that combines a drastically reduced power consumption – more than 90% lower than available solutions on the market - with miniature footprint and enhanced functionality. View Source May 26, 2010 Provides Information STMicroelectronics Selects Cadence QRC Extraction for 40nm Technology Design Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that STMicroelectronics, a global leader in integrated circuits for communications, consumer, computer, automotive and industrial applications, has standardized on Cadence® QRC Extraction for their 40-nanometer custom/analog designs. View Source July 16, 2010 Provides Information Stretchy and conductive nanotechnology composite for robot skin and strain sensors Electrically conductive composite materials capable of substantial elastic stretch and bending – conductive rubbers – is an industrially important field. The composites are needed for such applications as smart clothing, flexible displays, stretchable circuits, strain gauges, implantable devices, high-stroke microelectromechanical systems (MEMS), and actuators. View Source May 21, 2010 Provides Information Stripes offer clues to superconductivity New images of iron-based superconductors are providing telltale clues to the origin of superconductivity in a class of ceramic materials known as pnictides. The images reveal that electrons responsible for the superconducting currents in some pnictides tend to flow primarily along the boundaries between the crystal grains that make up the superconductors. View Source May 17, 2010 Provides Information Students Gain Knowledge in Nanotechnology Through ASL’s Internship Program Dozens of students gained valuable experience in nanotechnology and energy research labs this summer through an internship program at the Advanced Studies Laboratories ( ASL ), a collaborative partnership led by UC Santa Cruz and NASA Ames Research Center. View Source August 26, 2010 Provides Information Study measures single-molecule machines in action In the development of future molecular devices, new display technologies, and "artificial muscles" in nanoelectromechanical devices, functional molecules are likely to play a primary role. View Source July 6, 2010 Provides Information Study of electron orbits in multilayer graphene finds unexpected energy gaps Researchers have taken one more step toward understanding the unique and often unexpected properties of graphene, a two-dimensional carbon material that has attracted interest because of its potential applications in future generations of electronic devices. In the Aug. 8 advance online edition of the journal Nature Physics, researchers from the Georgia Institute of Technology and the National Institute of Standards and Technology (NIST) describe for the first time how the orbits of electrons are distributed spatially by magnetic fields applied to layers of epitaxial graphene. View Source August 10, 2010 Provides Information Study on Trends and Opportunities in Printed Electronics Market Research and Markets has announced the addition of the "Opportunities Analysis For Printed Electronics 2009-2015 And Beyond" report to their offering. View Source August 6, 2010 Provides Information Successful Extraction of Light from Semiconductors with the Highest Efficiency Wang XueLun, Near-Field Nano-Engineering Group, Nanotechnology Research Institute, the National Institute of Advanced Industrial Science and Technology, succeeded in extracting light from a semiconductor into air with the highest efficiency. View Source May 11, 2010 Provides Information SUSS MicroTec Launches MaskTrack Pro Bake/Develop for Next Generation Lithography Today, HamaTech APE GmbH & Co. KG, a wholly owned subsidiary of SÜSS MicroTec AG, introduced the latest addition to its Next Generation Lithography line of mask integrity platforms, the MaskTrack Pro Bake/Develop (BD). The product addresses the challenges of mask manufacturing of advanced 193i Optical Immersion and Extreme Ultraviolet Lithography (EUVL). View Source July 13, 2010 Provides Information SUSS MicroTec Tackles the LED Market with Dedicated Lithography System SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, today introduced the next generation of its MA100e mask aligner, a dedicated lithography solution for manufacturing high-brightness light emitting diodes (HB-LEDs). Based on SUSS MicroTec's production proven mask aligner design the automatic MA100e Gen2 processes wafers up to 4 inches and enables an industry leading throughput of 145 wafers per hour with reduced cycle times. View Source June 8, 2010 Provides Information Synopsys’ 40nm DesignWare MIPI M-PHY IP Now Available for Mobile Devices Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced immediate availability of the DesignWare® MIPI M-PHY® IP for next-generation high-speed interfaces based on the newly ratified MIPI® Alliance M-PHY specification. View Source August 25, 2010 Provides Information Synopsys and GLOBALFOUNDRIES to Develop DesignWare Interface PHY IP for 28-nanometer Technologies Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor technology and manufacturing services, today announced an agreement to develop the Synopsys DesignWare® SuperSpeed USB (3.0), USB 2.0, HDMI 1.4 Tx and Rx, DDR3/2, PCI Express® 2.0 and 1.1, SATA 1.5/3 Gbps and 6 Gbps, and XAUI PHY IP for GLOBALFOUNDRIES' 28-nanometer (nm) "Gate First" High-k Metal Gate (HKMG) process technologies. View Source August 5, 2010 Provides Information Synopsys Delivers Comprehensive Design Enablement for TSMC 28-nm Process Technology with Reference Flow 11.0 Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it is delivering comprehensive design enablement for TSMC's 28-nanometer (nm) process technology with TSMC Reference Flow 11.0. New features of the flow include solutions for system-level design and verification, added capabilities for 28-nm design, including In-Design physical verification, and support for thru-silicon via (TSV) technology for 3D IC design. Through Reference Flow 11.0, Synopsys tools and IP enable enhanced productivity, lower power, higher yield and increased performance and integration. View Source June 10, 2010 Provides Information Synopsys Introduces Galaxy Characterization Solution Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced its Galaxy Characterization Solution. View Source June 18, 2010 Provides Information Synopsys Launches Rapid3D Technology for Sub-45nm Custom IC Designers Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today unveiled Rapid3D technology, a new 3D fast field solver engine fully integrated into Synopsys' StarRC™ Custom parasitic extraction solution. View Source June 17, 2010 Provides Information Synopsys Supports HKMG 32, 28-nm Technology by Offering Optimized Design Environment Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced it is delivering an optimized, pre-validated design environment for the Common Platform alliance (CPA) 32/28-nanometer(nm) high-k metal gate (HKMG) technology based on Synopsys' Lynx Design System. View Source June 17, 2010 Provides Information T Tango Systems Becomes Member of IME’s MEMS Consortium Tango Systems, Inc., a leading manufacturer of high-performance PVD systems, has joined the Micro-Electro-Mechanical-Systems (MEMS) Consortium launched by The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), on April 8th 2010. View Source May 13, 2010 Provides Information Team finds new parallel between cold gases and 'hot' superconductors Scientists at JILA, working with Italian theorists, have discovered another notable similarity between ultracold atomic gases and high-temperature superconductors, suggesting there may be a relatively simple shared explanation for equivalent behaviors of the two very different systems. View Source July 7, 2010 Provides Information Technology Advancement in Printed Electronics Industry A European collaboration which is being led by a researcher at DCU will revolutionize the way blood tests, such as cholesterol, are performed. Dr. Tony Killard at the Biomedical Diagnostics Institute is developing a cholesterol test using the emerging technology of printed electronics. View Source August 16, 2010 Provides Information Technology Leaders and Innovators Selects Berkeley Design Automation Analog FastSPICE Platform Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that Technology Leaders & Innovators (TLi), a leading fabless developer of display semiconductor products, has selected the AFS Platform for full-circuit verification and device noise analysis of its complex mixed-signal ICs for display applications. View Source June 23, 2010 Provides Information Tegal Receives Order for Tegal 200 SE Silicon DRIE Process Tool From Leading MEMS Research Center Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for a Tegal 200 SE™ DRIE tool from a leading Asia Pacific-based Research and Development institution investigating MEMS and associated technologies. The Tegal 200 SE DRIE tool will be shipped and installed at the customer's site later this calendar year. View Source June 29, 2010 Provides Information Tegal Receives Repeat Order for Tegal 4200 SE Cluster Tool Silicon DRIE Process Module Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for an additional Tegal 4200 SE™ DRIE cluster tool process module from a leading EU-based supplier of MEMS and Power IC devices. The Tegal 4200 SE DRIE process module will be shipped and installed at the customer's site in the next fiscal quarter, and will add to the customer's overall production capacity for high volume manufacturing of MEMS and Power IC devices. View Source June 8, 2010 Provides Information Tegal Receives Silicon DRIE Tool Order from Uppsala University Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for a Tegal 110 S/DE DRIE tool from Uppsala University. The Tegal 110 S/DE DRIE tool will be installed in the Uppsala University Ångström Microstructure Laboratory, located in Uppsala, Sweden. The Ångström Laboratory constitutes one of Europe’s most advanced laboratories for materials science, and is the largest university clean room in the Nordic countries. View Source May 18, 2010 Provides Information Texas Instruments Purchases Two Wafer Fabs in Japan Texas Instruments Incorporated has completed its acquisition of two wafer fabs and equipment in Aizu-Wakamatsu, Japan, cost-effectively increasing the company's production capacity. The facility was previously operated by Spansion Japan Limited (SJL) and was acquired under a court-approved plan of reorganization. View Source September 2, 2010 Provides Information Tektronix Announces 130 nm SiGe Technology Application in Future Oscilloscopes Tektronix, Inc., the world's leading manufacturer of oscilloscopes, today announced that its next-generation, scalable, performance oscilloscope platform will make broad use of IBM 8HP silicon germanium (SiGe) technology. View Source August 10, 2010 Provides Information The Challenge of Wiring Thousands of Tiny Nanosensors Akram S. Sadek, a Caltech graduate student in the Computation & Neural Systems program, has an article in Nanowerk describing his research team's work in developing a method to connect thousands of neural nanosensors to each other and to an outside controller. The problem is that by using conventional wiring methods to link large numbers of very small components, the size of the wiring itself grows out of control. View Source May 7, 2010 Provides Information The perfect nanocube: Precise control of size, shape and composition With growing interest in using nanoparticles for everything from antibacterial socks to medical imaging to electronic devices, the need to understand the environmental, health and safety risks of these particles also grows. Researchers at the National Institute of Standards and Technology have developed a simple process for producing nanocrystals that will enable studies of certain physical and chemical properties that affect how nanoparticles interact with the world around them. View Source September 1, 2010 Provides Information Thermoelectrics: Unearthing hidden 'talent' Thermoelectric materials convert temperature gradients to electric voltage and vice versa by causing charge carriers to diffuse from hot to cold parts of the material. They are used to power spacecraft, harness waste heat from sources including industrial plants and cars, generate electricity from solar heat, and provide low-cost cooling in consumer products. Good thermoelectric materials are normally semiconductors with implanted impurities, and their performance usually does not vary with the orientation of their crystal axes with respect to the temperature gradient. View Source September 1, 2010 Provides Information Thomas Swan Scales up Nanotube Production Thomas Swan & Co. Ltd. has announced a major step forward in its nanomaterials manufacturing capability with the commissioning of a new, state-of-the-art single-wall carbon nanotube plant at its Consett facility in the UK. The new plant began commercial production in late May and the company has announced that the installation of a second identical plant will be completed by the end of 2010. View Source June 10, 2010 Provides Information Three-Dimensional Imaging of Sub-Nano Pore Structures Moore's law marches on: In the quest for faster and cheaper computers, scientists have imaged pore structures in insulation material at sub-nanometer scale for the first time. Understanding these structures could substantially enhance computer performance and power usage of integrated circuits, say Semiconductor Research Corporation (SRC) and Cornell University scientists. View Source June 8, 2010 Provides Information TI to Acquire Two Wafer Fabs in Japan Texas Instruments Incorporated said today it will purchase two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan. The assets currently are operated by Spansion Japan Limited and are being acquired under a court-approved plan of reorganization. View Source July 15, 2010 Provides Information Tiny Optical Circuits Operating at High Speeds Ridges of silicon can trap and guide light on dimensions as small as just a few hundred nanometers. But the way light behaves in these structures is dependent on its polarization. This effect limits the potential of the technology for a number of applications. A polarization rotator that can help to correct this has now been integrated into a waveguide, which is no more than 400 nanometers across, by Jing Zhang and co-workers at the A*STAR Institute of Microelectronics in Singapore. View Source June 9, 2010 Provides Information Titanium dioxide powers light-driven micro- and nanomotors For nanotechnology researchers, movement at the nanoscale is a challenging problem and there is much to be learned from nature's motor systems. There are various approaches to creating self-propelled micro- and nanosized motors and one promising approach rests on catalytic conversion of chemical to mechanical energy – a process that is ubiquitous in biology, powering such important and diverse processes as cell division, skeletal muscle movement, protein synthesis, and transport of cargo within cells. View Source June 2, 2010 Provides Information Toshiba Develop Breakthrough Technology for Nanowire Transistor Toshiba Corporation today announced that it has developed a breakthrough technology for a nanowire transistor, a major candidate for a 3D structure transistor for system LSI in the 16nm generation and beyond. View Source June 15, 2010 Provides Information TowerJazz Selects Magma's Titan Software for 180-nm Technologies Magma® Design Automation, a provider of chip design software, today announced TowerJazz, the global specialty foundry leader, has qualified the Titan™ Mixed-Signal Design Platform for TowerJazz's Power Management Analog/Mixed-Signal Reference Flow and process design kits for its 180-nanometer technologies. View Source August 25, 2010 Provides Information TSMC Adopts Synopsys Tools and IP for 28-nm Process Technology Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it is delivering comprehensive design enablement for TSMC's 28-nanometer (nm) process technology with TSMC Reference Flow 11.0. View Source June 10, 2010 Provides Information TSMC Deploys Laker System to Save Time for IC Design Teams SpringSoft, Inc., a global supplier of specialized IC design software, today announced that the Laker™ Custom Layout Automation System has been deployed by TSMC for mixed-signal, memory, and I/O design applications. The Laker software provides a consistent, proven implementation flow that supports the custom design requirements of TSMC across a broad range of applications. View Source June 1, 2010 Provides Information TSMC Employs Berkeley’s Analog FastSPICE Platform in Nanometer AMS Reference Flow Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that the Taiwan Semiconductor Manufacturing Company (TSMC) has incorporated the AFS Platform in the Analog Mixed Signal (AMS) Reference Flow 1.0 for device noise analysis. View Source July 1, 2010 Provides Information TSMC Qualifies Magma's Titan Platform to Support 40-nm iPDKs Magma Design Automation Inc., a provider of chip design software, today announced that TSMC has qualified Magma's Titan™ mixed-signal platform to support the interoperability and accuracy requirements of the TSMC 40-nanometer (nm) Interoperable Process Design Kit (iPDK). View Source May 18, 2010 Provides Information TSMC Selects Quartz DRC to Validate 28-nm Product Qualification Vehicle Test Chip Magma® Design Automation Inc., a provider of chip design software, announced today that TSMC used Quartz™ DRC for physical verification of its 28-nanometer (nm) product qualification vehicle (PQV) test chip. View Source August 6, 2010 Provides Information TSMC Unveils New Slim Library Targeting 65nm LP Process Taiwan Semiconductor Manufacturing Company, Ltd. today introduced the first Slim Library that reduces system-on-chip (SoC) routed logic block area by 15 percent compared to blocks routed through current standard cell libraries. View Source June 18, 2010 Provides Information Turning down the noise in graphene Graphene is a two-dimensional crystalline sheet of carbon atoms – meaning it is only one atom thick – through which electrons can race at nearly the speed of light – 100 times faster than they can move through silicon. View Source August 6, 2010 Provides Information U UAlbany nanoelectronics experts deliver presentations at SEMICON West 2010 Recognized academic and technical experts from the College of Nanoscale Science and Engineering of the University at Albany delivered presentations on July 14 at SEMICON West 2010, a leading industry conference and trade show held July 13 through 15 in San Francisco, CA View Source July 15, 2010 Provides Information UAT Expands Wafer Bumping Facility in Malaysia Unisem Advanced Technologies (UAT) announced today that it is expanding wafer bumping capacity in its factory in Ipoh, Malaysia. View Source July 13, 2010 Provides Information UBM TechInsights Honors IMFT's 25nm Process UBM TechInsights has announced Intel Micron Flash Technologies (IMFT) as the winner of the Most Innovative Memory Process award in TechInsights' 9th Annual Insight Awards. View Source July 29, 2010 Provides Information UBM TechInsights Honors Intel for 32nm Process UBM TechInsights has announced Intel Corporation as the winner of the Most Innovative Logic Process award in TechInsights' 9th Annual Insight Awards. View Source July 28, 2010 Provides Information UC Berkeley Orders AIXTRON Black Magic for CNT and SiGe Nanowires AIXTRON AG today announced an order for one 4-inch Black Magic deposition system from the University of California, Berkeley, USA. Capable of both SiGe nanowire and CNT (carbon nanotube) deposition, the system will be installed in the Laboratory for Nano Materials & Electronics by the local AIXTRON support team in the first half of 2010. View Source May 31, 2010 Provides Information Ultrahigh-power energy storage made with carbon nano-onions Ultra- or supercapacitors are emerging as a key enabling storage technology for use in fuel-efficient transport as well as in renewable energy. Supercapacitors offer a low-cost alternative source of energy to replace rechargeable batteries for various applications, such as power tools, mobile electronics, and electric vehicles. View Source August 19, 2010 Provides Information Ultra-secure quantum communications The risk of sensitive information falling into the wrong hands could be eliminated by a new quantum communication process that delivers unprecedented security. View Source May 24, 2010 Provides Information Ultra-thin, waterproof piezoelectric speaker promises much improved mobile audio The slender casing of a mobile phone, PMP, or even a tablet device, means that certain components do have to take a hit on quality in order to fit them inside the form factor. One area that has always suffered, especially on mobile phones, is the speaker. View Source June 11, 2010 Provides Information Understanding light-driven molecular switches Light-driven molecular switches are already used in technical devices such as LCD displays and storage media. Full comprehension of the processes at a molecular scale is required to increase their efficiency, but this knowledge had not been available to date. View Source May 20, 2010 Provides Information Unidym and Guardian Industries Form Partnership to Develop and Commercialize Carbon Coated Glass Products Unidym, a majority owned subsidiary of Arrowhead Research, announced today that it has entered an agreement with global glass manufacturer Guardian Industries to develop and commercialize carbon coated glass products for touch screen devices and other applications. Guardian is one of the world’s largest manufacturers of float glass and fabricated glass products for automotive and building materials businesses and is active in providing glass solutions for solar energy and electronics applications. View Source May 19, 2010 Provides Information United Microelectronics to Purchase 300mm CMOS Manufacturing Tools from TI United Microelectronics Corporation, today announced it will further increase its production capacity with the purchase of numerous advanced 300mm CMOS manufacturing tools. The tools will be bought from Texas Instruments (TI) upon closure of a larger asset purchase in Japan that was just announced by TI. View Source July 16, 2010 Provides Information Using Mathematical Algorithm to Predict Precise Shape of Metal Nanostructures Evaporated on Array of Spheres Plasmonic structures are metallic nanostructures that can be used to manipulate light on very small scales, so they are investigated intensively for applications ranging from optical circuits and enhanced solar cells to biosensing and imaging. View Source June 9, 2010 Provides Information Universal Display Corporation Introduces New Light-Blue PHOLED Material System Universal Display Corporation, enabling energy-efficient displays and lighting with its UniversalPHOLED™ technology and materials, today will unveil a new light-blue phosphorescent OLED emitter system at the Society for Information Display’s (SID) 2010 International Symposium, Seminar and Exhibition, being held at the Washington State Convention Center in Seattle, WA from May 23 through May 28, 2010. This new UniversalPHOLED emitter system offers the potential for significantly reduced power consumption and extended operational lifetime in OLED devices. View Source May 25, 2010 Provides Information Universal Display, Moser Baer Chosen for New U.S. DOE Program Universal Display Corporation, enabling energy-efficient displays and lighting with its UniversalPHOLED™ technology and materials, today announced that the company, along with Moser Baer Technologies, has been awarded $4,000,000 for a two-year program from the United States Department of Energy (DOE) under the American Recovery and Reinvestment Act of 2009 for a program titled “Creation of a U.S. Phosphorescent OLED Lighting Panel Manufacturing Facility.” View Source May 12, 2010 Provides Information University of Duisburg-Essen Orders AIXTRON MOCVD System for NaSoL Nitride Nanowires Project AIXTRON AG today announced a new order for one CRIUS® deposition system from the University of Duisburg-Essen. The order was placed in the fourth quarter of 2009 and the system will be delivered in the second quarter of 2010. View Source June 23, 2010 Provides Information Uppsala University Orders Silicon DRIE Tool from Tegal Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for a Tegal 110 S/DE DRIE tool from Uppsala University. View Source May 19, 2010 Provides Information Use of Colloidal Quantum Dots for Designing All-Optical Processors Photonic integrated circuits (PICs), in which photons carry out signal processing, are expected to play a crucial role in next-generation computing and communication systems. Much progress has been made over the last decade toward realizing all-optical circuits on a chip. View Source August 24, 2010 Provides Information Used electronic test equipment dealers We buy and sell electronic test and measurement equipment, coaxial and waveguide components, laboratory standards and calibration equipment, oscilloscopes, power supplies and manuals. View Source   Provides Products V Veeco Ships MOCVD Systems to Support Invenlux's Production Ramp at Its China LED Factory Veeco Instruments Inc. announced today that it shipped multiple TurboDisc® K-Series™ gallium nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems to Invenlux Corporation, a U.S.-based manufacturer of light-emitting diodes (LEDs) to ramp capacity at its factory in Haiyan City, China. View Source July 21, 2010 Provides Information Verigy’s Subsidiary Launches First Probe Card for Advanced DRAM Wafer Testing Touchdown Technologies, a wholly owned subsidiary of leading semiconductor test company Verigy (NASDAQ: VRGY), today introduced its 1Td300 full-wafer probe card, the company’s first probe card for single-touchdown, high-volume testing of advanced DRAM memory devices. View Source July 2, 2010 Provides Information Virus-enabled fabrication of stable silicon anodes for lithium-ion batteries Most of today's lithium-ion batteries rely on anodes made from graphite, a form of carbon. There are several candidate electrodes to replace graphite as the anode for lithium-ion batteries. Such electrodes like silicon or tin have very high capacities but suffer from poor efficiency and cyclic stability as they experience large volume change and particle pulverization during repeated cycling. View Source August 24, 2010 Provides Information Vishay's New SMD Wraparound Thin-Film Chip Resistors Optimized For Use in Multichip Modules Vishay Intertechnology, Inc. is adding to its passive component portfolio for extreme high-temperature environments with a new series of SMD wraparound thin-film chip resistors optimized for use in multichip modules for down-hole drilling and aerospace applications. View Source July 26, 2010 Provides Information Vitesse’s New 12-Port PHY Device Leverages 65-nm Technology with SparX-III GE Switch Vitesse Semiconductor Corporation, a leading provider of advanced IC solutions for Carrier and Enterprise networks, today added to the industry’s only 12-port Gigabit Ethernet PHY family with the VSC8522, delivering 50-percent higher density than the leading competitor and energy efficiency features with up to 90-percent power savings when compared to other active 1000BASE-T devices. View Source June 1, 2010 Provides Information Voice Alert Parents, Relatives, and Caregivers -- Voice Alert is the extra set of eyes and ears you've been looking for! View Source   Provides Products Vorbeck Materials And PNNL to Develop Graphene Product for Batteries Vorbeck Materials Corp., in collaboration with the Pacific Northwest National Laboratory (PNNL), operated by Battelle for the Department of Energy, announces a cooperative research and development agreement (CRADA) to develop Li-ion battery electrodes using Vorbeck's unique graphene material, Vor-x™. View Source July 14, 2010 Provides Information VSU Professor and Students Collaborate for Developing Semiconductor Nanoparticles Associate Professor Dr. Linda de la Garza and two of her students spent 10 weeks this summer conducting research at Argonne National Laboratory (ANL) located just outside Chicago, Ill. View Source August 24, 2010 Provides Information W When top-down meets bottom-up: EUV and X-ray interference lithography for sub-20-nm features After achieving the 45-nm process [1], today's semiconductor industry is nearing the 20-nm process and looking for techniques that would enable sub-22-nm-half-pitch line patterns [2]. Following the continuous increase in exposure tool numerical aperture (NA), researchers are pursuing reductions in exposure wavelengths. View Source July 8, 2010 Provides Information 'White graphene' to the rescue What researchers might call "white graphene" may be the perfect sidekick for the real thing as a new era unfolds in nanoscale electronics. View Source July 29, 2010 Provides Information WiSpry and IBM Team Up to Develop Advanced RF-MEMS Technology WiSpry, Inc., the leader in tunable radio frequency (RF) semiconductor products for the wireless industry, today announced that it is working with IBM (NYSE: IBM) to develop MEMS process technology and manufacture its tunable RF product roadmap. View Source June 28, 2010 Provides Information Workshop to identify commercial opportunities for nanotechnology in the UK The NanoKTN is pleased to announce that for the second-year running, it’s Electronic Devices and Nano Systems focus group will be hosting a workshop at this year’s S2K event in Cardiff, alongside JEMI UK. The workshop will look at the use of enabling technologies in nano-applications and will discuss areas where key technologies are yet to be established, with the aim to identify gaps in the market where UK companies can invest and become involved. View Source May 19, 2010 Provides Information World of lights in the microcosmos Light-emitting diodes are gaining ground: They are now being used as background lighting for displays. But the manufacturing of complex LED optics is still complex and expensive. A new technology is revolutionizing production: Large-scale LED components can now be manufactured cost-effectively. View Source June 1, 2010 Provides Information World record data density for ferroelectric recording Scientists at Tohoku University in Japan have recorded data at a density of 4 trillion bits per square inch, which is a world record for the experimental "ferroelectric" data storage method. As described the journal Applied Physics Letters, which is published by the American Institute of Physics, this density is about eight times the density of today's most advanced magnetic hard-disk drives. View Source August 17, 2010 Provides Information World's Most Advanced Semiconductor Foundry to Use GE's Water Purification System GE has announced that it has signed a contract to supply an ultrapure water system to GLOBALFOUNDRIES' new semiconductor manufacturing facility currently under construction at the Luther Forest Technology Campus in Saratoga County, N.Y. GE will design, supply and install an advanced ultrapure water system for the new $4.6 billion computer chip factory called "Fab 8." View Source June 15, 2010 Provides Information X X-FAB Introduces New High-Voltage Foundry Process X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, today announced the industry’s first 100V high-voltage 0.35 micrometer foundry process. View Source July 16, 2010 Provides Information X-FAB to Expand 200mm MEMS Wafer Manufacturing Capability X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, today announced it will expand its foundry service to include 8-inch (200mm) MEMS wafer processing. Moving to the larger wafer diameter and monolithic MEMS/CMOS integration allows significant reductions in manufacturing costs. View Source June 8, 2010 Provides Information Z Zecotek Announces Contract With the Fermi National Accelerator Laboratory in Illinois to Develop Micro-Pixel Avalanche Photo Diodes Zecotek Photonics Inc., a developer of leading-edge photonics technologies for medical, industrial and scientific markets, today announced that the Fermi National Accelerator Laboratory in Illinois (Fermilab) has contracted with Zecotek to develop a custom Micro-pixel Avalanche Photo Diode (MAPD) based on an existing Zecotek MAPD-3 design. View Source July 28, 2010 Provides Information ZeeBazar.com best electronics at the loest cost, if you dont find it on the site let us know and ww will order it for you! View Source   Provides Products Zenith Sure, you can browse through every kind of television imaginable, but check out the new cool products like Z-Trak, DVD and HDTV. Job and company information also available. View Source   Provides Products
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