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409 Computer — Memory Entries

Computer — Memory — August 12th, 2026

Kioxia and Sandisk Unveil New High-Performance QLC 3D Flash Memory
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation and Sandisk Corporation today unveiled their new 9th-generation, high-performance 2 Tb QLC 3D flash memory technology designed to support the growing storage demands of AI-driven infrastructure. The technology demonstrates how architectural innovation can help storage advance at the fast pace required by AI-driven workloads, while supporting more capital-efficient manufacturing.
August 12th, 2026Source

Computer — Memory — August 9th, 2026

Memory prices have erased 20 years of progress in a single year, researcher says
This chart shows just how badly AI demand has broken memory prices
August 9th, 2026Source

Computer — Memory — August 8th, 2026

China's memory-making champion smashes DDR5-8800 barrier on AMD platform — CXMT chips close the gap with SK hynix
The best RAM on the market generally utilizes integrated circuits (ICs) from industry giants such as SK hynix, Samsung, or Micron. Recently, however, Chinese chipmaker ChangXin Memory Technologies (CXMT) has emerged as a strong competitor amid the ongoing global memory shortage. In Colorful's latest overclocking exhibition, CXMT's ICs achieved speeds up to DDR5-8800 on AMD's X870E platform, keeping pace with the best overclocking ICs, such as SK hynix's A-die and M-die.
August 8th, 2026Source

Computer — Memory — August 7th, 2026

Chinese CXMT Memory Chips Hit 8800 MT/s On AM5, Signaling A Fast-Maturing Alternative To Established DDR5 Vendors
This time, it's the 2x 16 GB configuration that was pushed to nearly 9000 MT/s on an X870E motherboard.
August 7th, 2026Source

Heating strategy keeps ultrathin magnetic films flat and highly ordered
A two-step heating process produces highly ordered 5-nm-thick FePd films for low-power magnetic random-access memory and high-density magnetic storage.
August 7th, 2026Source

Scientist says RAM pricing has risen to normalized 2007 levels, AI shortage undid 20 years of progress in a matter of months — memory prices had been falling exponentially for decades
The price reversal is caused by the unbridled demand for HBM.
August 7th, 2026Source

Synology DiskStation neo+ Cuts ECC Memory to Lower Entry Cost
Synology has introduced DiskStation neo+, a lower-cost derivative of its established Plus-series NAS hardware. The family comprises two-, four-, five- and eight-bay models. Rather than redesigning the complete platform, Synology replaces the 4GB or 8GB ECC memory supplied with comparable Plus models with one 4GB non-ECC DDR4 SO-DIMM. The underlying hardware can still support ECC memory, but buyers would need to install an appropriate module. This distinction matters for workloads where protection against memory bit errors is more important than initial purchase cost.
August 7th, 2026Source

Computer — Memory — August 5th, 2026

Samsung announces next-gen 3D memory when all we want is reasonably priced DDR5
The new tech looks impressive, but most of it will be gobbled up by AI data centers.
August 5th, 2026Source

Samsung pitches zHBM with 8x HBM5 performance, but it is still only a concept
Samsung pitches zHBM with 8x HBM5 performance, but it is still only a concept
August 5th, 2026Source

Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026
Samsung Electronics a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California.
August 5th, 2026Source

Computer — Memory — August 3rd, 2026

China's CXMT Eyes Second Beijing Fab To Fight Memory Shortage
Backed by local government entities, the expansion aims to bolster China's semiconductor manufacturing capability amidst soaring global demand for computer memory. Constructing a fancy new DRAM facility typically requires an investment exceeding $10 billion, so to meet that steep threshold, CXMT is actively negotiating financing arrangements with the Beijing Economic-Technological Development Area (the development zone's governing body) and state-linked investment groups that have historically supported its growth.
August 3rd, 2026Source

CXMT Eyes Second Beijing Memory Fab After Record IPO, Circling the Gap Samsung and Micron Left Behind
Flush with its cash from a record-setting IPO, China's CXMT is considering building a second memory chip plant in Beijing. CXMT is regularly discussed in the media as a Chinese chip firm that might be able to compete on the global stage due to the ongoing turmoil in the memory chip industry. Reports have suggested that the firm is on its way to be able to produce the latest LPDDR6 and capitalize on Micron and Samsung's focus on high bandwidth memory (HBM) for the AI data center infrastructure buildout.
August 3rd, 2026Source

G.Skill Trident Z5 NeoX w/ EXPO ULL!
G.Skill has sent us two kits of their new Trident Z5 NeoX RGB DDR5 memory that features AMD EXPO Ultra Low Latency technology. The claim is that we will see 4% improvement in performance with absolutely no work required. Naturally those were claims we simply had to check.
August 3rd, 2026Source or Watch Video

Kioxia to Showcase CXL Compatible Memory Expansion Module KIOXIA XL1 Series for AI Workloads
Kioxia Corporation, a world leader in memory solutions, today announced that it will exhibit the KIOXIA XL1 series, a Compute Express Link (CXL) compatible memory expansion module, at the Kioxia booth at FMS: the Future of Memory and Storage, taking place August 4 - 6 in Santa Clara, CA. The product features KIOXIA XL-FLASH, a low-latency and high-performance flash memory technology that enables flash memory, traditionally used for storage applications, to also be utilized as a memory expansion solution. In addition, it is being designed and developed to support the growing volume of memory-intensive AI applications. Evaluation samples are scheduled to be shipped to industry ecosystem collaborators in August 2026.
August 3rd, 2026Source

RAM is painfully expensive. Try these fixes before buying more
You can't make RAM cheaper, but you can make Windows less wasteful.
August 3rd, 2026Source

Computer — Memory — July 31st, 2026

Apple CEO Tim Cook says the company is fighting 'a hundred-year flood' on memory pricing — expects to pay even more for memory in September following recent price hikes
Apple's filings show the size of the buffer absorbing the DRAM shock.
July 31th, 2026Source

Apple Talks Memory Shortage and Evaluating More Suppliers
Apple has reported record quarterly results for the second quarter, ending with $109.4 billion in revenue, highlighting the resilience of its business in recent months. The company is also one of the largest supply chain operators globally, manufacturing electronics across mobile, laptop, and desktop computing. When asked about recent memory inflation during an earnings call, Apple's CEO Tim Cook explained that the company has benefited from stockpiling memory inventory and reduced costs for some other non-memory components in its bill of materials (BOM) for each device.
July 31th, 2026Source

MSI's High-Efficiency Mode Gets Standard DDR5-6000 Within 0.2ns of an EXPO ULL Kit
One BIOS preset dropped AIDA64 latency from 79.4ns to 71.6ns on a plain EXPO kit — no manual subtiming work involved.
July 31th, 2026Source

Samsung warns the RAM shortage will last through 2027, maybe 2028
According to Samsung, the global RAM shortage driving up PC and laptop prices will persist through 2027 and possibly into 2028.
July 31th, 2026Source

Single-DIMM DDR5 gaming works better than you probably think — one DDR5 DIMM beats dual-channel DDR4 RAM, AMD's 3D V-Cache chips drop less than 3% with single stick
Expect to drop 8%-10% of your performance, and less with X3D CPUs.
July 31th, 2026Source

Computer — Memory — July 29th, 2026

DRAM chip supply to module makers could drop by more than 70% year-on-year in 2027, says Apacer CEO — demand for HBM and server RAM continues to devour manufacturing capacity
Apacer stockpiles $383 million in memory and raises another $124 million to secure supply
July 29th, 2026Source

Kioxia Announces UFS 5.0 Embedded Flash Memory Devices
Built on the latest JEDEC UFS 5.0 standard, Kioxia's new devices leverage the MIPI M-PHY v6.0 physical layer and UniPro v3.0 protocol, including HS-Gear6 operation, to support theoretical interface speeds of up to 46.6 Gb/s per lane and approximately 10.8 GB/s of effective dual-lane read/write performance. As AI workloads continue moving onto devices, storage performance is becoming increasingly important. Large language models, multimodal AI, advanced imaging and real-time inference require significantly faster movement of data between storage and compute. Until now, UFS read performance has been a limiting factor for increasingly sophisticated on-device AI, constraining how quickly large language models and other AI workloads can access data.
July 29th, 2026Source

Memory maker SK hynix's profit rises 557% amid global shortage, expansion costs climb to $27 billion — shares slide despite mammoth earnings as expectations outpace reality and global AI selloffs continue
Q3 DRAM bit shipments are guided up around 10%, one quarter after average selling prices climbed roughly 30%.
July 29th, 2026Source

MinIO AIStor Memory Puts Long-Term Agent Memory, Workspaces, and Secrets on Storage You Own
MinIO has introduced AIStor Memory, a storage service that provides persistent memory, workspaces, and secrets for AI agents within a single enterprise-controlled platform. The offering targets organizations moving agentic AI workloads from isolated experiments into production processes involving analysis, software development, document creation, and decision support.
July 29th, 2026Source

Computer — Memory — July 27th, 2026

Chinese Memory Giant CXMT Goes Public, Stock Already Up 466%
Chinese memory maker CXMT has debuted on the Shanghai A-Class STAR stock market with one of the biggest public offerings in China. Today, CXMT's Initial Public Offering (IPO) saw the price of CXM jump from CNY 8.66 ($1.28). At the time of writing, the stock, under the ticker "688825.SS," is trading at CNY 49.00 ($7.24), indicating a 465.82% gain on its first trading day. Initial projections estimated CXMT's market capitalization at CNY 579 billion, or $78.11 billion, but the valuation has increased significantly, now reaching $513.75 billion. This makes it the world's 24th most valuable company by market capitalization, surpassing Tencent, Mastercard, and even the technology giant Intel.
July 27th, 2026Source

Genesis chip may help AI with its memory problem
One of artificial intelligence's most stubborn problems is enabling AI systems to accumulate new knowledge without losing what they previously learned. A team of researchers at the MATRIX AI Consortium at The University of Texas at San Antonio may have solved this issue with Genesis, a spiking neuromorphic accelerator chip that would enable on-device continual learning throughout its operational lifetime.
July 27th, 2026Source

Huawei Prepares New Memory Factory To Shake Up Global RAM Costs
Computer memory has become wildly expensive lately as tech companies buy up all the available supply to build massive artificial intelligence systems. Regular buyers looking to upgrade their personal computers have watched price tags double with no end in sight. Now, new reports from industry watchers show that Huawei is working with the Chinese government to build a massive new memory factory from the ground up.
July 27th, 2026Source

RTX 5070 Ti Now Starts 38% Over MSRP in China — Memory Costs Are Doing the Damage
Distributor sheets from MSI and Colorful show the memory crunch has stopped being a supply-chain story and started being a price tag.
July 27th, 2026Source

Computer — Memory — July 24th, 2026

AMD Turns to Samsung for HBM4 Memory as Lisa Su Races to Match NVIDIA's Rubin
AI chip designer AMD will procure HBM4 memory from Samsung and has signed an agreement to this effect, according to remarks made by CEO Lisa Su. The firm held its Advancing AI event earlier this week, and Su revealed the decision to bring Samsung into the fold to reporters at the conference. For memory manufacturers, securing contracts from firms such as AMD comes after they have qualified their products to meet the designers' specifications. At the event, Su announced AMD's Helios AI rack solutions to further beef up its portfolio and compete with NVIDIA.
July 24th, 2026Source

China's CXMT Is Betting On Customized DRAM To Circumvent U.S. Sanctions On HBM; Korean Suppliers Playing Safe Could Miss Out On Major Opportunity
The U.S. ban hammer currently restricts CXMT from getting its hands on the HBM manufacturing tools needed to stay competitive in mainstream AI memory. However, the Chinese memory maker may have found its true calling in the form of customized DRAM. By diving headfirst into 3D memory and 3D Integrated Circuits (3D ICs), a fresh report highlights a strategy CXMT could employ to forge its own path and potentially catch South Korean titans like Samsung and SK Hynix off guard.
July 24th, 2026Source

China's CXMT Now Charges More Than Samsung For DRAM As Memory Demand Skyrockets, Even Denying Relief To Huawei
CXMT is now charging more for memory than the big three DRAM makers as demand swells in China's domestic AI markets.
July 24th, 2026Source

CXMT Evicted Huawei-Linked Engineers From Its R&D Facility, As The Once-Humble Memory Maker Has Acquired A Taste Of Newfound Power Amid The AI Boom
Memory chips were previously a low-margin business, with customers like Apple and other companies dictating prices that often allowed them to acquire shipments at pennies on the dollar. However, times have changed since late 2025, as AI datacenters have gobbled up the majority of the DRAM supply, leaving manufacturers like CXMT and YTMC to flex some might of their own, introducing hikes on the likes of Huawei of all companies.
July 24th, 2026Source

CXMT's 64GB Server DDR5 Memory Chip Is Now Pricier Than Samsung's, As It Races To Increase Capacity To 600,000 Wafers Per Month
CXMT's ideology is fast becoming wholly mercantile as it appears to have adopted the same price gouging tactics that are now the bread and butter of its 'Big Three' counterparts - Samsung, SK hynix, and Micron.
July 24th, 2026Source

GIGABYTE Opens the Door to CXMT DDR5 — Just as Memory Prices Bite
A BIOS update brings 16Gb and 24Gb CXMT chips to AM5 and Intel boards, and GIGABYTE is pitching it as breathing room for a starved DRAM market.
July 24th, 2026Source or Source

Qualcomm Admits Its Snapdragon 8 Elite Gen 6 Will Become More Expensive, As Chipset Maker Aims For Double-Digit Hike Due To Higher Supplier Costs
Another company that has thrown in the towel during the DRAM shortage is Qualcomm, with the latest report stating that the chipset manufacturer tried to hold off for as long as it could, but the company eventually caved in. Various unnamed products are expected to become pricier, with those likely being the Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro.
July 24th, 2026Source

Team Group Launches The ACE 8K MicroSDXC Memory Card
As next-generation imaging devices, including professional gimbal cameras, 360-degree cameras, action cameras, and drones increasingly support 8K high-resolution video recording, demand for memory cards that deliver broad device compatibility, stable data transfer, and reliable application performance continues to grow. To meet these needs, Team Group Inc. introduces the ACE 8K MicroSDXC Memory Card. Designed for seamless compatibility with mainstream handheld imaging devices, the ACE 8K supports A2 Application Performance Class and V30 Video Speed Class.
July 24th, 2026Source

Two Guys Checked Into Chinese Gaming Hotels and Left With 16 Sticks of RAM
Four hotels, one boot-failure mystery, and about $1,840 in second-hand memory — a very 2026 kind of crime spree.
July 24th, 2026Source

Computer — Memory — July 23rd, 2026

CXMT-Based Asgard DDR5 Memory Hits 8800 MT/s On Z890 Motherboard As Vendors Optimize Intel Platforms For CXMT Memory
More optimized DDR5 memory are being pushed beyond 8000 MT/s on mainstream Intel and AMD platforms.
July 23rd, 2026Source

HBM's & DRAM's Importance Is Waning; Here's The Silent Upgrade AI Giants Are Racing To Buy Before the Next Big Wave Hits
As hyperscalers continue to increase their massive investments to boost capacity, there's a growing realization that risks their lofty ambitions: power consumption, physical space constraints, and rising prices of HBM and DRAM memory that'll only creep up due to stagnant capacity. Fortunately, a new report dives into a new component that'll help accelerate hyperscalers' goals, and with the ever-expanding capacity, this part will become a key player in this particular industry.
July 23rd, 2026Source

Computer — Memory — July 22nd, 2026

Adata chairman says DRAM shortage will last another 10 years — dismisses AI bubble talk until '2040 or 2050'
Simon Chen made the comments after TSMC's record earnings failed to stop a Taiwan market slide.
July 22nd, 2026Source

Intel Says Memory Bandwidth Drives AI Performance More Than Compute
In a recent newsroom post, Intel is making a case that might sound counterintuitive in an industry obsessed with TOPS, TFLOPS, and ever-larger GPU clusters, but which AI enthusiasts and server operators have known for a while: the most important performance metric for many modern AI workloads is memory bandwidth, not compute.
July 22nd, 2026Source

Samsung Develops V11 NAND With Up to 500 Layers, 60% for NVIDIA
Samsung is significantly expanding its role in NVIDIA's AI infrastructure supply chain by dedicating more than 60% of its V-NAND flash memory production capacity to the GPU company's enterprise storage requirements. According to reports from South Korea, the cooperation centers around NVIDIA's Context Memory Storage (CMX) platform, where high-capacity enterprise SSDs complement GPU memory for large-scale AI inference workloads. The rapid expansion reflects changing requirements within modern AI systems. As large language models continue increasing in size, key-value (KV) caches generated during inference occupy enormous amounts of storage. While GPUs remain responsible for computation, maintaining these growing context datasets has become an important storage challenge, driving demand for increasingly dense enterprise NAND flash solutions. NVIDIA's current CMX implementation reportedly integrates 576 enterprise SSDs with a combined storage capacity of approximately 9.6 petabytes.
July 22nd, 2026Source

Computer — Memory — July 16th, 2026

CXMT's DDR5 RAM isn't as performant or as consistent as SK hynix dies, early testing shows — reveals resistance to voltage scaling and inferior manual overclocking capabilities
You can't tighten the timings either, apparently.
July 16th, 2026Source

Computer — Memory — July 12th, 2026

Memory makers are slaves to the boom-bust rollercoaster, and the AI boom is the wildest ride of all
The RAMpocalypse may be the precursor to the AIpocalypse
July 12th, 2026Source

SK Hynix CEO Warns 2027 Will Be Memory's "Worst Year" Ever, With Shortages Set To Outlast The Decade
Memory Supply Won't See Any Sign of Relief Beyond 2030 As SK Hynix Signals 2027 To Be The Worst Year In Terms of Shortages
July 12th, 2026Source

Computer — Memory — July 11th, 2026

Colorful pushes CXMT DDR5 memory to 8600 MT/s on Ryzen 9 9950X3D
Colorful iGame Shadow II DDR5 kit overclocked from 6000 to 8600 MT/s
July 11th, 2026Source

SK Hynix says 2027 will be the 'worst year' for memory shortage, forecasts crunch to last until 2030 — CEO shares grim outlook on the day SK Hynix gets listed on Nasdaq
Somehow, the memory shortage could get even worse next year.
July 11th, 2026Source

Computer — Memory — July 9th, 2026

AMD EXPO ULL shows middling performance gains in initial tests despite eye-watering price increase — first benchmarks show up to a 4% improvement with DDR5-6000 CL36
You can probably achieve similar uplifts with manual tuning.
July 9th, 2026Source

ASUS shows CXMT-based DDR5 memory running at up to 8400 MT/s o n AMD B850 motherboard
ASUS joins MSI in validating Chinese CXMT DDR5 memory on AMD motherboards
July 9th, 2026Source or Source

NVIDIA's Rubin Ultra Rack Estimated To Cost $21 Million, With HBM4e Memory Alone Swelling To $1.5 Million Per Unit
NVIDIA's Rubin & Rubin Ultra servers are going to be super expensive, with a large portion of the costs going towards memory alone.
July 9th, 2026Source

The Global PC Market Declined By 4.9% Versus Last Year As Memory Shortages Intensify, But MacBook Neo's Success Shows That x86 Rivals Need To Do More
The worldwide PC market declined by 4.9% in Q2 2026, showing how memory shortages have disrupted the segment.
July 9th, 2026Source

Computer — Memory — July 8th, 2026

JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates
JEDEC has released its new specification that aims to push down the pricing of the ultra-expensive HBM that powers the fastest AI processors. While the new standard will not help relieve the DRAM shortage as it uses large HBM4 DRAM devices, it can make high-bandwidth memory a bit cheaper as it enables attaching SPHBM4 memory stacks without advanced packaging and using inexpensive organic substrates.
July 8th, 2026Source

Memory Shortages Drive DDR4 Prices Over 50% In Q3 2026, DDR3 Also Impacted By Higher Costs
Memory Supply Chain Expects Significant Price Hikes For DRAM & Flash, As DDR4/DDR3 Prices To Surge By Over 50% In Q3
July 8th, 2026Source

Patriot Memory Announces Viper Steel 5 Infinite DDR5 Memory with Speeds up to 8000MT/s
Patriot Memory, a global leader in performance memory and storage solutions, today announced the upcoming launch of its Viper Steel 5 Infinite DDR5 memory kit. Designed for high-end gaming, professional content creation, and PC modding, the new series features a patent-pending "Infinite Mirror" RGB lightbar alongside tested overclocking speeds reaching up to 8000MT/s. As the successor to the highly successful Viper Steel 4 series—which established a strong reputation for reliability and performance in the DDR4 era—this new lineup shifts from traditional flat lighting layouts to a 3D optical design engineered to fit standard hardware constraints.
July 8th, 2026Source or Source

Single versus Dual Channel Memory Performance With The Intel Core Ultra 7 270K Plus
Given today's pricing environment around system memory, a Phoronix Premium supporter recently requested some benchmarks to quantify the performance difference from single to dual channel memory. In considering a new computer build, he is contemplating whether to go for a single stick of DDR5 memory until memory prices hopefully subside in the future. For those in a similar boat, here are some benchmarks of single versus dual channel memory on an Intel Core Ultra 7 270K Plus "Arrow Lake" desktop.
July 8th, 2026Source

Computer — Memory — July 4th, 2026

Inside the history of DRAM price-fixing lawsuits — how HBM allocations could make a difference after two decades of failed cases
Garciaguirre v. Samsung leans on HBM to prove an agreement that federal courts have twice declined to see in parallel production cuts.
July 4th, 2026Source

Memory price surge begins to cool as consumers hit affordability limit — AI demand still keeps DRAM and NAND prices climbing through Q3 2026
Long-term supply deals are quietly capping server DRAM prices.
July 4th, 2026Source

Computer — Memory — July 2nd, 2026

AMD EXPO ULL DDR5 Memory Launches with Prices Up to $1,099
G.Skill's first AMD EXPO ULL (Ultra Low Latency) DDR5 memory kits have appeared at retail, although early pricing has created some confusion about the new product line. Initial retailer listings suggested substantial price premiums over conventional EXPO memory, with some configurations appearing significantly more expensive than their standard counterparts. However, according to G.Skill, the company's intended pricing for EXPO ULL memory remains broadly in line with its existing non-ULL product range. The first products consist of G.Skill Trident Z5 NeoX DDR5-6000 32GB (2x16GB) dual-channel kits, including CL36, CL32, CL28 and CL26 variants.
July 2nd, 2026Source

G.Skill Clarifies On Big Price Difference Between Its DDR5 EXPO ULL & Standard EXPO Memory Kits, Says Retailers Are Selling Older Inventory That Was Bought Before Cost Increases
G.Skill has clarified its position on the higher costs of its EXPO ULL series memory kits compared to regular EXPO DDR5 kits.
July 2nd, 2026Source

Intel Reportedly Restarts Production of 13th and 14th Gen Core CPUs as DDR4 Demand Surges
Intel is reportedly preparing to increase production of several previous-generation desktop processors, including its 13th and 14th Gen Core lineup, as demand for DDR4-based systems continues to strengthen. The move would significantly expand CPU availability across multiple generations while extending the lifespan of the LGA 1700 platform. According to a report from ChannelGate, citing information published through the BoBantang WeChat platform, Intel has updated its manufacturing plans to restart production of 13th and 14th Gen Core processors. The report claims this will substantially increase overall supply across Intel's 10th, 12th, 13th, and 14th generation desktop CPU families, with mainland China expected to receive a significant share of the additional inventory.
July 2nd, 2026Source

MOF thin films reveal a denser, less porous structure than expected
Advanced diffraction and modeling show a widely studied MOF thin film is densely packed, reshaping expectations for sensors, microelectronics and magnetic storage.
July 2nd, 2026Source

Overclocker Breaks 13,600 MT/s Barrier By Pushing His Corsair DDR5 To A Whopping $13,606 MT/s On Z890 AORUS Tachyon Duo X ICE
Popular overclocker "saltycroissant" just dropped another world record and this time, he's the first one to break the 13,600 MT/s barrier.
July 2nd, 2026Source

Computer — Memory — June 28th, 2026

Apple Seeks U.S. Approval to Use Sanctioned Chinese Memory Maker CXMT
Apple has reportedly been negotiating with the U.S. government to get clearance to use sanctioned Chinese memory maker CXMT in its products. According to a report from the Financial Times, Apple is in talks with the U.S. government to clear the previously blacklisted Chinese entity. The U.S. government had earlier placed Chinese memory maker CXMT on a sanctions list, preventing American companies from purchasing products like the now highly sought-after DRAM. This has created a challenging situation given the severe supply shortage the entire industry is facing. Since the big three—Samsung, SK hynix, and Micron—are ramping up capacity at an insufficient rate, sourcing DRAM from another supplier would help ease the pressure on electronics makers by providing better pricing, more supply, and facilitating product shipments.
June 28th, 2026Source

Lenovo says DRAM prices "will never be like last year again", shares "RAMageddon survival guide"
Lenovo says server buyers must rethink RAM capacity planning
June 28th, 2026Source

Why Wall Street thinks US memory maker Micron is the next Nvidia
Micron, the Boise, Idaho-based memory chip maker, has captured Wall Street's heart. Whether the love affair endures will heavily depend on how long the AI-driven supply crunch for memory chips lasts.
June 28th, 2026Source

Computer — Memory — June 27th, 2026

The RAM crisis is getting worse — I take a look at when prices might fall, and whether you'll ever see the savings when they do
Experts aren't offering a sunny forecast, and PC prices may not ever return to their "normal" state.
June 27th, 2026Source

Computer — Memory — June 26th, 2026

GOODRAM says DDR4 still has an active user base, launches RIVAL DDR4 modules starting at 4GB
GOODRAM launches RIVAL DDR4 RADIANT for active DDR4 user base
June 26th, 2026Source or Source

Computer — Memory — June 23rd, 2026

After Earning Major Profits From HBM, SK Hynix Now Plans To Prioritize DDR5 "General-Purpose DRAM" Production
SK Hynix is planning to return to general-purpose DRAM, such as DDR5, after securing record revenue from HBM memory.
June 23rd, 2026Source

Memory Shortages Have Destroyed The Consumer Segment As DRAM Prices Surge By Up To 89% In Q2 2026
Consumer-focused DRAM saw a major spike in prices in Q2 versus Q1, with DDR4 memory floating at 50% and LPDDR around 80% due to persistent shortages.
June 23rd, 2026Source

Computer — Memory — June 22nd, 2026

2003-era DDR2 memory prices jump up to 60% — AI-driven DRAM shortage reaches the oldest standard still in production
TrendForce expects another 40% rise in Q3 as buyers downgrade specs to secure supply.
June 22nd, 2026Source

Expert Warns Memory Prices Will Climb Up To 50% Per Quarter, With No Relief Until 2028
Financial firm Jefferies outlined in a fresh report that memory prices will continue their upward momentum in the second half of this year. The global memory industry has been thrown into turmoil due to aggressive demand from the AI sector. As a result, the production shortages and the corresponding price increases have affected consumer electronics as well. However, the prices will continue to rise throughout 2027, believes the expert, with the first signs of easing in 2028.
June 22nd, 2026Source

Intel to Revive "Raptor Lake Next" Even for Gaming Notebooks to Soak Up DDR4 SODIMM Inventory
Last week, it was reported that Intel is bringing back its Core "Raptor Lake" client microarchitecture a second time under the "Raptor Lake Next" internal codename, and newer Core (non-Ultra) nomenclature, to cater to the PC crowd benefiting from its DDR4 memory backwards compatibility to save on memory costs.
June 22nd, 2026Source

The AI memory crisis just hit DDR2, a standard from 2003, with 60% price hikes
Hardware makers are downgrading from DDR4 to DDR3 and from DDR3 to DDR2 to secure supply, driving contract prices for two-decade-old memory components to record levels
June 22nd, 2026Source

Computer — Memory — June 20th, 2026

AMD to bring back "TSME" memory encryption on Ryzen 9000 non-PRO CPUs after backlash
AMD to restore non-PRO Ryzen 9000 memory encryption in July
June 20th, 2026Source

SK Hynix Fires Back In The AI Memory Race With Next Gen 48GB HBM4E
SK hynix just announced the delivery of its 12-layer HBM4E memory samples to major hardware clients, intensifying the competition to supply the memory backbone for future AI accelerators. The new fat stacks of RAM represent a significant leap in data density and throughput, offering 48 gigabytes of capacity per single stack. By pushing transfer speeds up to 16 Gbps per-pin across the massive 2-kilobit interface width defined by the HBM4 standard, the new chips deliver upwards of 4 terabytes per second of memory bandwidth using a single stack of silicon.
June 20th, 2026Source

Computer — Memory — June 16th, 2026

AMD Seems To Have Silently Cut TSME Memory Encryption From Consumer Chips
AMD has officially stated "Regarding certain non-PRO Ryzen 9000-series desktop processors, a BIOS option to enable Memory Guard was previously available but was removed in a recent update. Based on valuable community feedback, we will reinstate this option in an upcoming BIOS release in July."
June 16th, 2026Source

Gloway And KingBank Ditch Samsung, Micron, And SK Hynix, Building 48 GB DDR5 Kits From China-Made 24 Gb Chips
Gloway Announces Longwu Yi Special Edition 48 GB DDR5 RAM Kit Using Domestically Produced 24 Gb DDR5 Chips; KingBank Also Joins the Race With its Star Blade RGB Series
June 16th, 2026Source

Goodram RIVAL Gaming Brand Debuts with DDR5 SODIMM Memory
Goodram expands its portfolio with a new gaming brand - Goodram RIVAL. Its first product is the Goodram RIVAL DDR5 SODIMM series: memory modules designed for gaming laptops and compact mobile workstations built to perform without hardware limitations.
June 16th, 2026Source

Computer — Memory — June 15th, 2026

AMD AGESA 1.3.0.1b BIOS Provides Better DDR5 Memory Support Than Previous Releases, Leading To Lower Voltages
AMD's latest AGESA 1.3.0.1b BIOS firmware offers much better DDR5 memory support and even lower voltages than past versions.
June 15th, 2026Source

AMD Bets on MEXT's Predictive Memory Tech to Slash Data Center TCO While Rivals Scramble for DRAM
AMD has announced the acquisition of MEXT, a pioneer in AI-driven memory optimization technologies to help lower TCO.
June 15th, 2026Source

DDR5 Memory Prices Continue To Spiral Upwards In Germany, Now 419% Higher Than In July 2025
The continuous rise in DDR5 memory will make it more difficult for users to upgrade or build new PCs from scratch.
June 15th, 2026Source

LPDDR6 Memory To Double Capacities For AI Datacenters, Delivering 512 GB Per Module To Meet Agentic AI Demand
LPDDR6 will become the next major component addressing the rising memory requirements in Agentic AI datacenters.
June 15th, 2026Source

SK Hynix Plans to Triple Memory Production Capacity by 2034
Memory manufacturer SK Hynix has unveiled an ambitious long-term expansion strategy aimed at addressing growing demand for memory products across the artificial intelligence sector. The company plans to triple its manufacturing capacity by 2034 and double current production levels by 2031, accelerating expansion goals that were previously expected to take much longer to achieve. The decision comes as the semiconductor industry faces sustained demand for advanced memory technologies. AI training clusters, cloud computing infrastructure, and enterprise data centers continue to consume increasing quantities of DRAM, NAND flash, and high-bandwidth memory.
June 15th, 2026Source

Computer — Memory — June 8th, 2026

bl4ckdot Hits DDR5-12824 Wins $10,000 at Computex 2026 G.Skill OC World Cup
French overclocker bl4ckdot claimed the OC World Cup 2026 championship during Computex, securing the event's $10,000 grand prize after successfully navigating a series of demanding benchmark and overclocking challenges. Hosted by G.SKILL, the annual competition once again attracted some of the most experienced extreme overclockers in the world, all competing to extract maximum performance from a standardized hardware platform using liquid nitrogen cooling. The competition platform combined G.SKILL DDR5 memory with Intel's latest enthusiast processors, including the Core Ultra 7 265K, Core Ultra 9 285K, and Core Ultra 7 270K Plus.
June 8th, 2026Source

Dato Ares DDR5 Memory and Storage with Active Cooling at Computex 2026
At Computex 2026, we walked through the Dato booth, showcasing their latest memory products. We begin our tour with the Ares Armor Lite DDR5 memory series. Very reminiscent of late-2010s memory module designs, it features curvy metal heatspreaders capped by acrylic diffusers for ARGB LEDs. The module comes in 8 GB, 16 GB, and 32 GB making up single- and dual-channel kits. It comes in DDR5-5600, DDR5-6000, and DDR5-6400 speeds.
June 8th, 2026Source

GIGABYTE Achieves DDR5 World Record and 10 Global First Places in Overclocking at Computex 2026
GIGABYTE, the world's leading computer brand, achieved several milestones in overclocking, including a DDR5-13556 MT/s world record with Corsair VENGEANCE DDR5 memory and 10 global first overclocking places on G.SKILL 12th Annual OC World Record Stage at Computex 2026. GIGABYTE's renowned overclocker team, led by Hicookie, achieved the DDR5 record-breaking performances with the OC-enthusiast Z890 AORUS TACHYON DUO X ICE motherboard. The team was also invited by G.SKILL to the overclocking event and topped the competition with new accomplishments in several categories achieved by the newly launched X870 AORUS INFINITY.
June 8th, 2026Source

Computer — Memory — June 7th, 2026

V-Color Pushes DDR5 Capacity to 2 TB With New MRDIMM Kits, While Its OLED Memory Gets Low-Profile EXPO ULL Redesign
V-Color presents its new XOT1 DDR5 memory kits that will come in super-fast speeds, and EXPO ULL "low-latency" optimized flavors.
June 7th, 2026Source

Computer — Memory — June 6th, 2026

Firm's regional manager says that RAM prices are expected to double by the end of the year — 'discounts' and stabilized prices result from distributors getting rid of old stock or sourcing products from other regions
Lexar's Regional Manager for Australia & New Zealand, Chris Xia, said that he personally thinks RAM prices are expected to double by the end of the year. While there have been a few instances of RAM module prices stabilizing and even some retailers selling them for a discount or bundled with other PC parts, he said that this is just sellers making an effort to make their inventory move and make way for new stocks, which are expected to be priced higher.
June 6th, 2026Source

G.Skill explains how AMD EXPO ULL unlocks additional performance — expanded profiles allow memory makers to include subtiming tweaks for the first time
But more involved binning could mean more expensive memory, and X3D chips see less benefit
June 6th, 2026Source

Intel's Next LGA 1954 Socket Gains First Q970 Workstation Board Ahead Of Nova Lake, Packing vPro And 128GB DDR5 CUDIMM
One of the upcoming chipsets for Intel Nova Lake has been leaked online, revealing the specifications in detail.
June 6th, 2026Source

Computer — Memory — June 5th, 2026

KLEVV Pushes DDR5 To A Blistering 10,000 MT/s With New CUDIMM Memory, AMD EXPO ULL & 4R CUDIMM Also Showcased
KLEVV is showcasing its upcoming DDR5 memory portfolio at Computex, including super-fast 10 GT/s speeds & 4R kits with up to 256 GB capacity.
June 5th, 2026Source

Silicon Power XPower Memory and SSD Products at Computex 2026
XPower, the brand of Silicon Power targeting gamers and PC enthusiasts, showcased their latest high-end DDR5 memory kits, and SSDs. The star attraction in their booth was the XPower Cyclone ASUS ROG Certified DDR5 memory. This memory comes with ARGB LED diffusers that support ASUS Aura Sync RGB, and which you can control from the Armoury Crate application. These modules feature DDR5-6000 with AMD EXPO-ULL (ultra-low latency) profiles. The wider XPower Cyclone series comes in 64 GB (2× 32 GB), 48 GB (2× 24 GB), 32 GB (2× 16 GB), and 16 GB kits, with speeds of DDR5-6000, DDR5-7200, and DDR5-8000, with CAS latencies ranging from CL28 to CL40; and module voltages between 1.35 V and 1.45 V.
June 5th, 2026Source

Teamgroup Preps Carbon-Fiber DDR5 Memory & SSDs, Wooden Designs, & 4-Rank CUDIMM With Up To 128 GB Capacity
Teamgroup is displaying a variety of DDR5 memory and PCIe Gen5 SSD solutions within its T-Force & T-Create brands.
June 5th, 2026Source

The RAM crisis is resurrecting DDR4 memory and motherboard production as hardware cycle reverses
CPU, GPU, and RAM production are going back in time, for consumers anyway
June 5th, 2026Source

Computer — Memory — May 30th, 2026

Cooler Master And G.Skill Team Up On Actively Cooled MasterDIMM AC DDR5 Memory
Cooler Master and G.Skill have joined forces on fan-cooled memory modules that they plan to showcase at Computex next week. In the meantime, we get some teaser shots posted to X of the MasterDimm AC DDR5 memory, as it's called, which is basically a DDR5 memory module tucked inside a thick cooler with a fan attached for active cooling.
May 30th, 2026Source

Samsung starts HBM4E sampling with 16Gbps speed and 48GB stacks
Samsung HBM4E samples now shipping to major customers
May 30th, 2026Source

Computer — Memory — May 29th, 2026

Cooler Master and G.SKILL Collaborate to Bring Back DRAM Cooling with MasterDiim AC DDR5 Kits Featuring Blower-Style Heatspreaders
Cooler Master and G.SKILL have teamed up to engineer a sleek-looking air-cooled DDR5 kit called MasterDimm AC. Air-cooled memory is making a comeback, something not commonly seen since DDR3 and G.SKILL had several products featuring it back then. This time around, with the help of Cooler Master, those seeking the faster speeds of DDR5 can keep their kits cool with the CU-DIMM kits capable of running up to 8400 MT/s with Intel XMP 3.0.
May 29th, 2026Source

Cooler Master and G.SKILL Partner to Bring Active Cooling Technology to DDR5 Memory
Cooler Master, a global leader in innovative thermal solutions and PC hardware, today announced a partnership with G.SKILL to introduce new MasterDimm AC DDR5 memory featuring active cooling technology from Cooler Master. MasterDimm AC will be showcased during Computex 2026 at Cooler Master's Taipei headquarters, where the company will present its broader thermal engineering vision across AI infrastructure, workstations, gaming systems, and next-generation PC platforms.
May 29th, 2026Source

Cooler Master and G.SKILL reveal thick DDR5 memory with built-in cooling fan
Cooler Master G.SKILL MasterDimm AC DDR5 memory with a fan
May 29th, 2026Source

Cooler Master And G.Skill Team Up To Launch MasterDIMM AC Actively Cooled DDR5 Memory
The new DDR5 memory modules will be actively cooled by a dedicated fan, ensuring lower temperatures under heavy workloads.
May 29th, 2026Source

G.SKILL Demonstrates DDR5-9200 CU-DIMM Memory Running at Just 1.1 Volts
G.SKILL used Computex 2026 to showcase an unusually efficient high-speed DDR5 memory configuration, demonstrating a 32 GB (2×16 GB) CU-DIMM memory kit operating at DDR5-9200 while maintaining the standard JEDEC operating voltage of just 1.1 volts. The demonstration was conducted on an Intel Core Ultra 7 270K Plus processor paired with the MSI MEG Z890 GODLIKE motherboard. While extreme DDR5 frequencies are becoming increasingly common among enthusiast memory kits, achieving such speeds without requiring elevated voltages remains a significant engineering challenge. High-frequency memory typically relies on increased DRAM voltage to maintain stability, which in turn raises power consumption and thermal output. G.SKILL's demonstration highlights the potential for future DDR5 modules to deliver higher bandwidth without the traditional trade-offs associated with aggressive memory overclocking.
May 29th, 2026Source

G.SKILL Introduces Actively Cooled DDR5 Memory at Computex 2026
G.SKILL have announced a joint development effort aimed at addressing one of the less-discussed challenges of modern high-performance memory: thermals. The two companies unveiled the new MasterDimm AC DDR5 memory series at Computex 2026, combining G.SKILL's high-speed DDR5 technology with Cooler Master's active cooling expertise. As DDR5 capacities and transfer rates continue to increase, thermal management has become increasingly important, particularly in AI workloads, content creation systems, professional workstations, and enthusiast gaming PCs. The new MasterDimm AC modules are designed to maintain stable operation during sustained memory-intensive workloads while supporting capacities of up to 128 GB through dual 64 GB modules.
May 29th, 2026Source

G.Skill Pushes Its Trident Z5 CK "CUDIMM" DDR5 Memory To 9200 MT/s at Just 1.1V On MSI Z890 GODLIKE
G.Skill demos the capabilities of its DDR5 memory by pushing the Trident Z5 CK "CUDIMM" kit to 9200 MT/s at just 1.1V.
May 29th, 2026Source

G.Skill Showcases DDR5-9200 1.1 V 2×16 GB High-Speed CU-DIMM Memory Kit
G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory, is showcasing an ultra-high speed DDR5 CU-DIMM 32 GB (2× 16 GB) memory kit operating at an impressive DDR5-9200 CL74-74-74-148 speed with only 1.1 V DRAM voltage, validated on the flagship MSI MEG Z890 GODLIKE motherboard platform.
May 29th, 2026Source

Samsung Electronics Begins Shipment of Industry-First HBM4E Samples
Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun shipping the industry's first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market.
May 29th, 2026Source

Computer — Memory — May 28th, 2026

ADATA TRUSTA AI Scaler Extended Memory Solution Breaks GPU Limits
TRUSTA, the enterprise storage brand of memory leader ADATA Technology Co., today will officially launch the TRUSTA AI Scaler Extended Memory Solution. As an industry pioneer, TRUSTA introduces the AI Scaler Toolkit as the core of the solution, extending AI model deployment beyond GPU-only architectures to system memory and high-speed SSDs. This software-hardware integrated solution helps enterprises overcome GPU memory limitations and reduce AI deployment costs by more than 50% in model inference and fine-tuning scenarios.
May 28th, 2026Source

Silicon Motion Unveils SM2524XT PCIe Gen5 DRAMless AI SSD Controller
Silicon Motion has announced the SM2524XT, a new PCIe Gen 5 DRAMless SSD controller developed for AI inference workloads and KV Cache-heavy storage operations. The controller targets next-generation AI PCs and local large language model deployments where sustained low-latency random performance is becoming increasingly important. The SM2524XT uses a new four-core processor architecture combined with PCIe Gen 5 x4 connectivity and NAND interface speeds reaching up to 4,800 MT/s. Silicon Motion rates the controller for sequential read throughput up to 14 GB/s and random performance up to 2.5 million IOPS.
May 28th, 2026Source

Computer — Memory — May 23rd, 2026

768GB of cheap Intel Optane DIMM memory sticks used to run 1-trillion-parameter LLM on a system with a single GPU — local Kimi K2.5 install achieved roughly 4 tokens per second
Redditor found 768GB of affordable Optane sticks second-hand.
May 23rd, 2026Source

Computer — Memory — May 22nd, 2026

Chinese memory maker CXMT enters mainstream consumer memory with Corsair Vengeance DDR5 kit — Chinese-made DRAM emerges as an antidote for crushing shortages
Corsair typically only buys from Micron, Samsung, or SK Hynix.
May 22nd, 2026Source

Corsair Vengeance DDR5 module spotted with Chinese CXMT memory
Corsair DDR5 memory with 6000 MT/s with Chinese modules
May 22nd, 2026Source

Corsair Vengeance DDR5 Memory Modules with CXMT DRAM Chips Surface
Chinese DRAM manufacturer CXMT (Chang Xin Memory Technologies) is mass-producing DDR5 DRAM chips, and the company seems to have gained good traction with popular retail-channel PC memory brands. PC enthusiast WXNOD identified a Corsair Vengeance DDR5 memory module with CXMT-sourced DRAM chips. The brand is known to normally source its chips from Micron Technology. The Corsair module in question is the "CMK5X16G3E60C36A2," a Vengeance DDR5-6000 16 GB module that's part of 32 GB kits. It offers DDR5-6000 at 36-44-44-96 with 1.35 V, supporting both EXPO and XMP.
May 22nd, 2026Source

G.Skill to Demo New Memory Solutions for Gaming, Server, AI & Workstation Applications, Host OC World Cup 2026 at Computex
G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory, is thrilled to demo multiple new DDR5 memory solutions for PC enthusiast systems, servers, AI, industrial applications, and high-performance workstations. And continuing the tradition, G.SKILL will also host two highly anticipated annual extreme overclocking events at the G.SKILL Computex booth - the OC World Record Stage 2026 and the OC World Cup 2026 - as well as the G.SKILL Extreme Mod Stage 2026 to showcase creative system mods.
May 22nd, 2026Source

Memory prices tipped to fall as China starts flooding the market with DRAM and NAND chips
Relief for consumers or just another pipe dream?
May 22nd, 2026Source

Micron Advances Made-in-America Memory with Manufacturing Expansion in Virginia
Micron Technology, Inc. (Nasdaq: MU) today is celebrating the start of 1α (1-alpha) DRAM manufacturing at its Manassas, Virginia, fab, an important step in the company's efforts to significantly expand U.S. memory manufacturing. As the only United States manufacturer of memory, Micron is uniquely positioned to strengthen America's domestic memory supply. The 1α DRAM node, the most advanced memory technology ever produced in the United States, is well suited to long-lifecycle memory for critical applications, including DDR4 and LP4 products.
May 22nd, 2026Source

Samsung Mobile Workers Revolt Over $4,000 Bonus While Memory Employees Pocket $400,000 Each, Vowing Court Injunction To Block The Deal
Samsung's new pay deal is creating more headaches than the ones it purports to solve, especially after a nearly 100x difference in implied bonuses between various divisions of the tech conglomerate has caused something of an all-out revolt, with the union that caters to Samsung's employees working in its home appliances and mobile division now vowing to seek a court injunction.
May 22nd, 2026Source

Computer — Memory — May 21st, 2026

G.SKILL Trident Z5 CK RGB DDR5 8400MT/s 48GB CU-DIMM Memory Review
CUDIMM, or Clocked Unbuffered Dual In-Line Memory Module, is a type of DDR5 memory that integrates a clock driver (CKD) chip directly onto the memory module itself. This allows the electrical signal to be improved, thus allowing the memory modules to achieve very high memory speeds, Mega Transfers per Second (MT/s) at stable frequencies. We have one such memory kit to review today, the G.SKILL Trident Z5 CK RGB DDR5-8400 CL40-52-52-134 1.40V 48GB (2x24GB) memory kit. This is G.SKILL's high-end offering in its Trident Z5 CU-DIMM series.
May 21st, 2026Source

Computer — Memory — May 18th, 2026

Asus picked the worst possible time to start selling gaming RAM
Asus is now selling a 48GB DDR5-6000 memory kit for around $880 with its pricey "ROG" label. In this economy?
May 18th, 2026Source

DDR5 Memory Continues To Sell At A Whopping 400%+ Premium In Germany As The Market Sees No Relief
The upward pricing trend for the DDR5 memory continues in Germany, and even though it seems stabilized, it's the worst time to buy a memory kit.
May 18th, 2026Source

Ex-Samsung Chip Boss Says China's DRAM Blitz Could Crush The 414% DDR5 Price Spike Within A Year
With the memory chip market being significantly disrupted due to high demand from the artificial intelligence market, advisor to Samsung Electronics, Kye-hyun Kyung, believes that prices will come down in the second half of next year. Kyung previously served as the head of Samsung's Device Solutions (DS) group, which is the firm's chip and display manufacturing business division. The former executive believes that high investment by China in the memory market will be responsible for the lower prices and adds that Korea needs to expand its presence in the global fabless chip fabrication market in order to remain competitive with the US and China.
May 18th, 2026Source

Computer — Memory — May 17th, 2026

ASUS Demos Its First "ROG" DDR5 Memory Running at 8800 MT/s On Its Crosshair X870E APEX Motherboard
ASUS's first DDR5 memory modules, the ROG 20th Edition, have been demoed on the ROG Crosshair X870E APEX motherboard, showcasing impressive OC capabilities.
May 17th, 2026Source

ASUS Is Showing Off Its First High-Speed ROG Memory Kit Ahead Of Computex
Following the reveal of its retro-inspired ROG Crosshair 2006 X870E motherboard, Asus is showing off some ROG-branded, Hynix-based DDR5 RAM running at 8800 MT/s with the powerful AMD Ryzen 9 9950X3D2 CPU. It's an impressive overclock, though CAS Latency is increased to CL34 from CL26 in exchange for the big boost from the base 6000 MT/s specification. This demo was posted to Facebook by ASUS employee SoonHo Jeong (aka Safedisk) and spotted by WCCFTech.
May 17th, 2026Source

ASUS lists 17 ROG Certified DDR5 memory modules from 14 brands
ASUS ROG Certified DDR5 memory list covers ADATA, Corsair, G.SKILL and more
May 17th, 2026Source

Jay Forrester filed the first practical computer RAM patent 75 years ago this week — his Magnetic Core Memory patent would be granted five years later
75 years ago this week, on May 11th, 1951, MIT electrical engineer Jay Forrester filed the patent application for coincident-current magnetic core memory, a technology that became the dominant form of random-access storage in digital computers for two decades.
May 17th, 2026Source

NVIDIA's Rubin AI Platform Alone Will Devour More LPDDR Memory in 2027 Than Apple and Samsung Combined, Starving Smartphone Supply
LPDDR memory demand in the AI & server segment is going to outstrip smartphone demand massively in 2027, with next-gen platforms such as NVIDIA Rubin and AMD MI400 requiring way more DRAM to meet the needs of AI firms.
May 17th, 2026Source

Computer — Memory — May 16th, 2026

Asus enters the RAM market during the largest memory shortage in history, 48GB kit lands at $880 — brand's first DDR5 kit makes the RTX 5070 Ti look like a bargain
Asus has memory to spare.
May 16th, 2026Source

Chinese Memory Makers Accelerate DDR5 Development, Reaching 8000 MT/s DRAM Speeds As They Near Samsung, SK Hynix & Micron Levels
Chinese DRAM and memory makers are accelerating their DDR5 development to tackle the growing needs of AI, Enterprise, and Consumer segments.
May 16th, 2026Source

Computer — Memory — May 15th, 2026

ASUS Enters the Enthusiast Memory Market with ROG-branded DDR5 Kit
ASUS is entering the enthusiast PC memory market segment with its first ROG branded DDR5 memory kits. The company has launched these memory kits in China, and VideoCardz reports that BIWIN is the OEM behind the kit. The module comes with the distinct black+red ROG color scheme with gold accents commemorating 20 years of the ROG brand. ASUS recommends pairing the memory with its limited edition ROG Crosshair X870E 2006 20th Anniversary Edition motherboard.
May 15th, 2026Source

ASUS Launches First ROG DDR5 Memory Kit for Enthusiast PCs
ASUS has officially entered the enthusiast desktop memory market with the launch of its first Republic of Gamers branded DDR5 memory kit. Initially introduced in China, the new product expands the ROG ecosystem into another core PC hardware category alongside motherboards, graphics cards, cooling hardware, power supplies, displays, and gaming peripherals. According to reports, the memory modules are manufactured by BIWIN, which acts as the OEM behind the product. The design follows ASUS' familiar Republic of Gamers styling language, featuring a black heatsink with red accents and gold highlights commemorating the 20th anniversary of the ROG brand.
May 15th, 2026Source

ASUS Launches Its First-Ever "ROG" DDR5 Memory Modules: 48 GB Capacity With ROG-Mode That Switches Between 6000 CL26 & 8000 CL36 Modes
ASUS ROG RGB Edition 20 DDR5 Memory Modules Are Now Official, Support For Intel XMP and AMD EXPO Profiles
May 15th, 2026Source

ASUS ROG launches its first DDR5 memory kit with 48GB capacity and DDR5-6000 CL26 specs
ASUS ROG first DDR5 memory kit costs 5999 yuan in China
May 15th, 2026Source

Computer — Memory — May 14th, 2026

DDR5 Pricing Remains Stable, But SSDs Continue to Soar, Notes Framework
Framework, the maker of various modular laptops, has updated its blog post regarding the pricing and availability of consumer memory and storage configurations for its products. As the company collaborates with its supply chain to equip its laptops and mini-PCs with necessary components, it possesses inside knowledge of pricing trends that ultimately affect consumer purchases. According to the update, Framework notes that the price of DRAM has stabilized for now, and the latest DDR5 memory has remained relatively unchanged in recent weeks. This is noteworthy as memory is one of the most expensive PC components these days.
May 14th, 2026Source

Origin Code Unveils 48GB Vortex DDR5-6200 CL28 "Meteorite Black" and Dedicated Water Block at Computex 2026
Origin Code is bringing a new configuration to its Vortex DDR5 lineup at Computex 2026, and the headliner this time is a 48GB (two 24GB modules) kit running at 6200 MT/s with CL28 timings, in a new Meteorite Black finish. The company is also debuting a dedicated water block for the Vortex series — one with a 178-degree wide-view LCD display built in — making this a two-product announcement aimed at high-end builders who want both performance headroom and a clean aesthetic.
May 14th, 2026Source

Team Group Elite And Elite Plus DDR5 Hit 8000 MT/s At 1.1V, Undercutting Enthusiast Modules That Need 1.35V To Match
To meet the growing demands of high-frequency memory, Team Group has launched two new DDR5 memory kits that can operate at a low voltage without sacrificing memory speeds.
May 14th, 2026Source

V-Color launches DDR5-8000 1.1V RDIMM for Intel W890, claims 9600 MT/s OC on ASUS board
The new workstation memory targets Intel Xeon 6 systems with ECC RDIMM support, SK hynix DDR5 ICs and up to 256GB per module.
May 14th, 2026Source

Computer — Memory — May 11th, 2026

Chinese POWEV Enters DDR5 Market With Up to 64 GB UDIMM, SODIMM, and RDIMM Modules
The Chinese DRAM market has just gained another player with POWEV entering the DDR5 market. POWEV is a sub-brand of the Chinese company Jiahe Jinwei, which announced its entry into the DDR5 market almost half a decade ago but is delivering now when it is needed most. POWEV has introduced DDR5 DRAM in form factors like UDIMM, SODIMM, and RDIMM, capable of up to 64 GB capacity and available in either 4,800 MT/s or 5,600 MT/s speeds.
May 11th, 2026Source

Scammers are selling fake DDR5 with empty plastic chips relabeled to pass as legit — fake components mounted to PCBs are yet another sign of the RAMpocalypse
Impossible to detect on desktop memory with heatspreaders.
May 11th, 2026Source

SK hynix Eyes Intel EMIB 2.5D Packaging for HBM Memory
SK hynix is collaborating with Intel to utilize its Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging technology for HBM memory. As SK hynix aims to diversify its supply chain and customers are increasingly considering Intel Foundry, the South Korean memory giant is exploring research and development efforts with Intel on 2.5D packaging technology. Intel's premier 2.5D packaging technology is its EMIB, which interconnects multiple silicon dies using bridges embedded in a packaging substrate. SK hynix is interested in integrating this technology into its HBM memory, presumably to bring its HBM4 memory modules up to standard for EMIB integration, should its AI chip partners choose Intel Foundry for advanced packaging of their next-generation solutions.
May 11th, 2026Source

The RAM crisis is bringing out DDR5 counterfeiters
Fake RAM chips and fake stickers are popping up in secondary markets in Asia. Watch out for "broken" electronics deals that are too good to be true.
May 11th, 2026Source

Computer — Memory — May 10th, 2026

Fake DDR5 Memory Sticks Flood The PC Markets, Equipped With Plastic DRAM As Prices Continue To Skyrocket
Asian markets are now seeing fake DDR5 memory at several retailers, both online and in shops. These DDR5 memory modules might look real to an average buyer, but on closer inspection, they're equipped with fake DRAM modules and sometimes even worse.
May 10th, 2026Source or Source

Memory godboxes could offer relief from the RAMpocalypse
Amid the AI-fueled memory crunch, will Compute Express Link finally have its moment to shine?
May 10th, 2026Source

Computer — Memory — May 8th, 2026

Memristor chip merges memory and computing, cutting AI power use by more than half
With a simple click, your hastily taken photo sharpens, a garbled voice message turns into polished text and a chatbot drafts an email in perfect prose. Today's digital tools, enhanced by artificial intelligence (AI), seem to perform magic on demand.
May 8th, 2026Source

Computer — Memory — May 7th, 2026

AMD X970E May Reuse Existing Chipset Silicon with DDR5 Upgrades
AMD's next high-end desktop chipset, expected to launch as X970E, may not be based on entirely new chipset silicon. Current information points toward continued use of ASMedia's Promontory 21 design, the same silicon foundation already used for X870E and X670E motherboards. If correct, the 900-series platform would be less about a new chipset architecture and more about firmware, validation, and memory support improvements. The more important platform changes are expected to come from AMD's next-generation Ryzen desktop processors, reportedly codenamed Olympic Ridge and based on the Zen 6 architecture.
May 7th, 2026Source

GeIL Announces JEDEC Standard 8000 MT/s Memory and the AQUARIUS Diamond RGB Series at Computex 2026
GeIL is redefining the boundaries of high-speed DRAM by introducing the DDR5-8000 MT/s specification that fully adheres to JEDEC standards. Unlike traditional high-frequency modules that require manual BIOS adjustments or overclocking profiles, GeIL's JEDEC 8000 MT/s modules offer a "True Plug & Play" experience.
May 7th, 2026Source or Source

GeIL readies AQUARIUS Diamond RGB memory with G.SKILL Trident Z Royal-style design
GEIL presents new DDR5 memory: SPEAR V does not require XMP or EXPO to reach 8000 MT/s
May 7th, 2026Source

Computer — Memory — May 4th, 2026

DDR6 Development Aims for Commercial Shipments in 2028
It seems we are not too far from the next-generation Double Data Rate 6 (DDR6) memory for desktops and servers, as memory manufacturers are working with JEDEC to establish a new standard. According to South Korean media outlet The Elec, major memory makers such as SK hynix, Samsung, and Micron have reportedly begun designing DDR6 in their labs and are gradually coordinating module development with substrate manufacturers. This collaborative effort is taking place under the supervision of JEDEC, the industry authority that oversees standard development and ensures a common foundation for design.
May 4th, 2026Source

DDR6 Memory Development Kicks off As Samsung, SK Hynix & Micron Race Towards Commercialization By 2028-2029
DDR6 memory development is in full swing with major DRAM makers including Samsung, SK Hynix & Micron all racing towards completion to meet growing AI demands.
May 4th, 2026Source

Mobile DRAM Prices Expected To Increase By ~100% Quarter-Over-Quarter, As Long-Term Agreements Now Getting Signed At Prices As High As $21/GB
The mobile DRAM market is showing no sign of retrenchment as the wider industry stares at a ~100 percent quarter-over-quarter (QoQ) price increase in Q2 2026, building upon the 58 percent - 63 percent QoQ price growth for LPDDR5X in Q1.
May 4th, 2026Source

Next-gen MRDIMM standard nears completion targeting 12,800 MT/s DDR5 transfer rates for AI and data center workloads
MRDIMM is going to be even faster, although it's not for consumers
May 4th, 2026Source

SK Hynix jumps 12% as Big Tech doubles down on AI memory
A $725bn hyperscaler capex ramp and a 20% HBM price rise have made the South Korean chipmaker the second-most valuable company on the KOSPI. The harder question is when supply catches demand.
May 4th, 2026Source

Computer — Memory — April 27th, 2026

AMD EXPO 1.2 Enables CUDIMM DDR5 Memory Support On Next-Gen Ryzen CPUs, Current CPUs Only Support "Bypass" Mode
AMD is enabling CUDIMM DDR5 memory support with new AGESA updates & upcoming EXPO 1.2 tech, but only next-gen Ryzen CPUs will enable it.
April 27th, 2026Source

Computer — Memory — April 26th, 2026

3D X-DRAM Hits Proof-of-Concept, HBM-Replacement with 10x Density versus Traditional DRAM & High-Yield Memory Design
Think of DRAM, but in a NAND-like structure, that's the basic concept of 3D X-DRAM, a revolution for the memory markets, bringing higher densities for AI.
April 24th, 2026Source

AMD EXPO 1.2 may bring new tuning options and support for new memory DIMMs
AMD is reportedly working on EXPO 1.2, a major update to its memory overclocking standard designed to squeeze more performance out of the AM5 platform while laying the groundwork for the future.
April 24th, 2026Source

Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Boosts Density By Up to 50%
Samsung has reportedly produced the world's first "standalone" DRAM module that uses a process tech below 10nm.
April 24th, 2026Source

Computer — Memory — April 24th, 2026

AMD EXPO 1.2 Expands DDR5 Tuning Before Zen 6 Rollout
AMD has introduced EXPO 1.2, an updated version of its Extended Profiles for Overclocking standard for DDR5 memory. The new revision expands the amount of memory profile data available to AMD platforms and adds support for newer DDR5 module types, including MRDIMM, CUDIMM, and CSODIMM-related functionality. EXPO is AMD's memory profile system for applying validated DDR5 settings through motherboard firmware.
April 24th, 2026Source

AMD EXPO 1.2 now available, adds partial CUDIMM support and three new Chinese memory vendors
1usmus reveals AMD EXPO 1.2 details
April 24th, 2026Source

AMD Enables Chinese DDR5 Memory Support With EXPO 1.2: Adds CUDIMM, MRDIMM & Ultra-Low Latency Support
AMD EXPO 1.2 is launching soon, and with it, some new features, along with support for Chinese DDR5 memory, are being added too.
April 24th, 2026Source

AMD Launches EXPO 1.2 for CUDIMM and Low-Latency DDR5 Memory
AMD has officially launched its Extended Profiles for Overclocking (EXPO) version 1.2, which expands support for more memory profiles, CUDIMM, and additional features. With this release, AMD aims to introduce more advanced memory tuning profiles to the "Zen 5" platform and its DDR5 memory types, while full support for EXPO 1.2 features is anticipated with the "Zen 6" processor generation. This means that full CUDIMM support for "Zen 5" tuning is still limited, and only "Zen 6" will offer complete CUDIMM support.
April 24th, 2026Source

Computer — Memory — April 23rd, 2026

Everyone Thought Google's TurboQuant Would Solve The Memory Crisis, But SK Hynix Says It Will Only Make It Worse
Google TurboQuant was seen as a savior to the memory crisis; unfortunately, things will remain the same or get even worse from here.
April 23rd, 2026Source

JEDEC Previews LPDDR6 Memory With SOCAMM2 Modules & 512 GB Capacities, Clearing the Path for Next-Gen AI Servers
JEDEC has previewed its LPDDR6 memory standard, powering future AI datacenters & mobile platforms with 512 GB capacities & SOCAMM2 variants.
April 23rd, 2026Source

JEDEC previews LPDDR6 roadmap for data centers, SOCAMM2 and PIM
JEDEC has outlined the next step for LPDDR6, and this time the focus goes beyond phones and laptops. The standards body said the next update to JESD209-6 is being prepared to extend LPDDR6 into selected data center and accelerated computing workloads, building on the original LPDDR6 standard...
April 23rd, 2026Source

NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept
NEO Semiconductor, a leading innovator in advanced AI and memory technologies, today announced successful proof-of-concept (POC) results for its 3D X-DRAM technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems.
April 23rd, 2026Source

Rambus launches SOCAMM2 chipset for LPDDR5X AI server modules
Rambus SOCAMM2 chipset adds SPD Hub and VRs for LPDDR5X server modules
April 23rd, 2026Source

YouTuber has DIMM idea, builds working DRAM in backyard
What are you doing to solve the memory crisis?
April 23rd, 2026Source

Computer — Memory — April 21st, 2026

China's Premiere Memory Maker Hits HBM3 Roadblock As Domestic DRAM Makers Rush HBM Manufacturing
China's domestic memory manufacturers are rushing to produce HBM chips, but the biggest DRAM maker has run into roadblocks with HBM3 tech.
April 21st, 2026Source

Computer — Memory — April 17th, 2026

ASRock Develops HUDIMM Memory Standard: DDR5 with Just One Sub-channel
You know we've hit rock-bottom with memory affordability when ASRock innovates a new memory standard to lower prices. The new "HUDIMM," or half unbuffered DIMM, is an ASRock-innovated standard. It calls for UDIMMs with half a rank of memory, populating just one of the two 40-bit sub-channels. Such a DIMM would only offer half its bandwidth even at its rated memory clock, and of course half the density. The HUDIMM standard is targeted at entry-level builds and business desktops that just want a modern platform for everyday tasks, and something to tide over the DDR5 memory crunch.
April 17th, 2026Source

Intel, & ASRock's HUDIMM Standard Could Finally Make DDR5 Memory Affordable for Budget PC Builders
ASRock, Intel & Teamgroup have come together to address concerns related to higher DDR5 memory prices with the new HUDIMM standard.
April 17th, 2026Source

Samsung Leaves Customers High And Dry By Halting LPDDR4 Production, As Memory Crisis Forces A Shift Towards The Profitable LPDDR5 RAM
Older-generation LPDDR4 and LPDDR4X memory chips have been in production for about 8 to 10 years, but Samsung is reportedly pulling the plug on manufacturing, likely because it wants to focus more on maximizing profits by supplying LPDDR5 and LPDDR5X RAM chips.
April 17th, 2026Source

Computer — Memory — April 14th, 2026

China's premiere memory-maker YMTC plans two additional Wuhan fabs using homegrown chipmaking tools — Phase 3 crosses 50% domestic tooling threshold
Chinese NAND leader's third fab sources more than half its equipment from domestic suppliers.
April 14th, 2026Source

Computer — Memory — April 11th, 2026

Micro Center now sells 128GB DDR5 memory for $4,200 while shelves remain full
Full shelves, high price tags
April 11th, 2026Source

Computer — Memory — April 8th, 2026

Why Google's TurboQuant Algorithm is Disrupting the AI Memory Chip Market
Google's TurboQuant is making waves in the AI hardware sector by addressing long-standing challenges in memory usage and processing efficiency. Developed with components like the Quantized Johnson-Lindenstrauss Algorithm, TurboQuant achieves up to sixfold reductions in memory requirements while preserving model accuracy. This compression algorithm also accelerates processing speeds by as much as eight times, allowing faster and more cost-effective deployment of large language models (LLMs). As Wes Roth explains, these advancements are reshaping how enterprises approach AI infrastructure, with significant implications for both operational efficiency and the broader hardware market.
April 8th, 2026Source

Why your 'fast' PC feels slow: Blame your RAM
Fast CPU, slow PC? Find out if RAM is holding you back (and how to fix it).
April 8th, 2026Source

Computer — Memory — April 6th, 2026

DRAM Prices Rise Again as Samsung Adds 30% Increase
Samsung has reportedly applied another average 30% increase in the price of its DRAM products for the second quarter of 2026, according to a report published by ETNews. This move comes after a sharp price rise earlier this year and suggests that major memory makers are not, at least for now, buying into the idea of a broad market collapse.
April 6th, 2026Source

Samsung pushes DDR5 and HBM prices higher (30%) as AI demand persists
Samsung is reportedly increasing DRAM pricing once again, with new reports indicating an average 30 percent rise for the second quarter of 2026 across both DDR5 and HBM memory products. That follows a strong first quarter in which memory prices had already moved substantially higher compared to the same period a year ago. The latest adjustment is notable because it is not limited to one niche category. It affects commodity DDR5 used in mainstream PCs, notebooks, and servers, while also covering high-bandwidth memory deployed in AI accelerators and data center hardware.
April 6th, 2026Source

Computer — Memory — April 3rd, 2026

Apple may be stockpiling mobile DRAM to outmaneuver rivals in a tight market
Apple is reportedly paying premium prices for memory and absorbing the cost to secure supply and pressure rivals
April 3rd, 2026Source

Lenovo Legion Go 2 suddenly costs $650 more as RAMageddon lays waste to gaming hardware
Twice as much as an Xbox Ally X.
April 3rd, 2026Source

Computer — Memory — April 2nd, 2026

Chinese memory stockpilers start to panic as falling prices leave them stuck with modules
Memory scalpers in China are now trying to exit at lower prices
April 2nd, 2026Source

Chinese Memory Vendors Are Claiming to Be "Doomed", Tossing Aside Stockpiled DDR Modules as Dropping Prices Cause Panic
In a new video shared by a Chinese media account, the current situation in the memory industry appears to be causing panic among DDR sellers, who are now 'begging' for prices to rise again.
April 2nd, 2026Source

Germany Misses Out On DDR5 RAM Price Relief As Other Regions See Temporary Declines
You were lucky if you were able to buy DDR5 RAM for slightly lower prices, because in some regions, there was no difference.
April 2nd, 2026Source

RAM Prices Fall in China, Triggering Panic Among Stockpilers
Behind every crisis, there are always those who suffer the most and those who try to profit from it through abusive practices. China is no exception. Many sellers had stockpiled large amounts of RAM to take advantage of the high prices caused by the memory crisis, but the bubble there has burst earlier than expected, and prices are now falling quickly.
April 2nd, 2026Source

Seller Who Stockpiled Memory Now Panicking After RAM Prices Dip: 'We're Doomed, We're Screwed'
The worried vendor also asked if prices might go 'back up' in the future
April 2nd, 2026Source

Computer — Memory — April 1st, 2026

DRAM prices predicted to jump 63% in Q2, NAND up to 75% — follows 95% jumps in Q1, Trendforce says AI server demand keeps supply tight
NAND Flash contract prices are now rising faster than DRAM.
April 1st, 2026Source

Computer — Memory — March 31st, 2026

Advantech Unveils SQRAM DDR5 7200 MT/s 64 GB Industrial Memory Modules
Advantech, a global leader in IoT intelligent systems and embedded platforms, today announced the expansion of its SQRAM DDR5 7200 MT/s industrial memory module series. Designed to meet the escalating data demands of Edge AI, the new modules offer a 12.5% performance increase over previous generations and a groundbreaking 64 GB per-module capacity, setting a new benchmark for stability and scalability in outdoor deployments.
March 31st, 2026Source

DDR5 Prices in China Face a "Complete Collapse" as Memory Markets Shift From Desperate Scarcity to Sudden Uncertainty
The memory market has seen a dramatic turn in the past few days, with RAM prices in mainland China now dropping aggressively.
March 31st, 2026Source

GeForce RTX 6090 leak points to 192 SMs and 32GB GDDR7 memory
Rumors (and they are just that) are beginning to outline NVIDIA's next-generation GeForce RTX 6000 series, which is expected to be based on the new Rubin architecture. While the company has not officially confirmed any specifications, multiple reports and analyst discussions suggest that Rubin will represent a significant architectural step forward, particularly in ray tracing performance and AI-driven workloads. One of the key points emerging from these reports is that Rubin may originate from data center GPU designs before being adapted for gaming.
March 31st, 2026Source

Memory prices are finally falling, DDR4 sticks drop by $14 in a single day in China
So, Micron, was it worth it?
March 31st, 2026Source

Scientists capture atoms in motion, unlocking next-generation memory technology
Monash University researchers have captured the exact atomic movements that write data to next-generation memory devices, which could pave the way for smaller, faster and more energy-efficient electronics. Published in Nature Communications, the study was led by Dr. Kousuke Ooe, a Japan Society for the Promotion of Science (JSPS) postdoctoral fellow in the School of Physics and Astronomy at Monash University who is first author of the paper, in collaboration with Australian Laureate Professor Joanne Etheridge and researchers from the Japan Fine Ceramics Center, Kyoto University, and the University of Osaka.
March 31st, 2026Source

Computer — Memory — March 24th, 2026

G.SKILL DDR5 Kits Gain XMP 3.0 Support for Intel 200S Platform
G.SKILL has announced that its DDR5 memory kits are now validated for Intel XMP 3.0 on the latest Intel Core Ultra 200S Plus processors and Z890 chipset motherboards. The update applies to both existing and upcoming memory products, including standard U-DIMM and CU-DIMM modules, enabling broader compatibility across the new platform. With Intel XMP 3.0 support, users can activate predefined memory overclocking profiles directly through the BIOS. This simplifies the process of achieving higher memory frequencies without requiring manual tuning, allowing systems to operate at validated performance levels with minimal configuration.
March 24th, 2026Source

G.SKILL DDR5 Memory Kits Confirmed as Intel XMP 3.0 'Ready' for Intel Core Ultra 200S Plus Series Processors
G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory, announces that its existing -- and new -- DDR5 memory kits have gained Intel Extreme Memory Profile (Intel XMP) 3.0 overclock readiness to support the new Intel Core Ultra 200S Plus Series processors and compatible Intel Z890 chipset motherboards. With support across overclocked specification DDR5 U-DIMM (Unbuffered DIMM) and CU-DIMM (Clocked Unbuffered DIMM) memory kits, Intel XMP 3.0 support provides an easy method to achieve memory overclock performance by enabling the profile in the motherboard BIOS.
March 24th, 2026Source or Source

G.SKILL showcases DDR5-10000 memory speed on Core Ultra 7 270K Plus
G.SKILL says existing DDR5 kits are now Intel XMP 3.0 Ready for Core Ultra 200S Plus
March 24th, 2026Source

JEDEC Releases Updated LPDDR5/5X SPD Standard with Enhanced Mode-Switching Support
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD406-5D: LPDDR5/5X Serial Presence Detect (SPD) Contents standard, an update of the Revision C standard that adds support for calculating recovery time when switching operating modes. JESD406-5D is available for free download from the JEDEC website.
March 24th, 2026Source

TEAMGROUP previews industrial LPDDR5X CAMM2 memory for dense systems
TEAMGROUP Japan IT Week booth to feature LPDDR5X CAMM2 memory modules
March 24th, 2026Source

Computer — Memory — March 22nd, 2026

Micron predicts that cars will need 300GB of RAM — memory-laden vehicles could exacerbate shortages but create 'robust long-term growth in automotive memory demand'
Self-driving cars are essentially AI supercomputers on wheels.
March 22nd, 2026Source

Computer — Memory — March 20th, 2026

Big Tech Is Paying Billions to Lock In Memory Supply, Essentially Promising Suppliers the Shortage Is Here to Stay
The memory industry is now witnessing a major shift, as DRAM suppliers are now looking to lock in customers into 'multi-year' contracts, essentially guaranteeing demand.
March 20th, 2026Source

SK Group chairman claims ongoing memory shortage could last up to four years
The memory market might be entering a "long winter" for consumers, as SK Group Chairman Chey Tae-won delivered a sobering prevision at Nvidia's GTC 2026. The narrative that high prices are a temporary blip might not be as short-lived as some imagined, as Chey says the current supply-demand gap won't likely close until the turn of the decade.
March 20th, 2026Source

Computer — Memory — March 18th, 2026

ASRock Launches AI BOX-A395, Powered By Ryzen AI Max+ 395 And Up To 128 GB LPDDR5X Memory
One more high-end mini PC has been released, featuring the flagship Zen 5 mobile chip for AI workloads, gaming without a discrete GPU, and professional apps.
March 18th, 2026Source

I'll never buy a PC with soldered RAM
Soldered RAM is anti-consumer, bad for the environment, and reduces your laptop's lifespan.
March 18th, 2026Source

Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions
Samsung Electronics Co., Ltd. today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies. The signing ceremony was held at Samsung's most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.
March 18th, 2026Source

SK Group chairman says memory chip shortage will last until 2030 — wafer supply trails demand by 20%
SK Hynix's CEO is expected to announce price stabilization measures soon.
March 18th, 2026Source

Computer — Memory — March 16th, 2026

DDR5 prices in Germany fall 7.2% in March, first clear drop after months of increases
DDR5 memory now cheaper in Germany, but it is far from the last year's price
March 16th, 2026Source

Memory Makers Expect Shortages to End in Late 2028, Could Pause Expansion Plans
Memory manufacturers are forecasting that memory shortages will persist until the end of 2028, when the supply chain balance is expected to be restored and memory will once again reach its commodity status. However, according to the South Korean Chosun Biz newspaper, memory manufacturers are reconsidering their expansion plans to ensure they don't overinvest in building new capacity after demand cools down. Reportedly, Samsung's internal projections indicate that demand for DRAM in forms like HBM and regular DDR will peak in the next few quarters, up until the end of 2028.
March 16th, 2026Source

Memory makers see supply tightness lasting until late 2028
The memory industry may not return to a balanced supply environment for another two and a half years. According to new reporting from South Korea, major suppliers now expect current shortages across several memory categories to persist until the end of 2028, with a more stable market only emerging once existing expansion projects start contributing enough volume. Samsung is reportedly projecting that demand for HBM, conventional DDR memory, and related products will remain elevated through the coming quarters before gradually cooling toward a more normalized level. That timeline is notable because it suggests vendors do not see the current shortage cycle ending anytime soon.
March 16th, 2026Source

Computer — Memory — March 13th, 2026

RAM is getting expensive, so squeeze the most from it
Zram versus zswap -- two ways to get a quart into a pint pot
March 13th, 2026Source

RAM kits are now sold with one fake RAM stick alongside a real one to create a performance illusion — 1+1 'value pack' offers desperate psychological relief as the memory shortage worsens
Filler RAM won't make your system run any better, but it'll at least make it look good.
March 13th, 2026Source

Computer — Memory — March 12th, 2026

It's come to this: V-Color to launch 1+1 DDR5 value pack with one RAM stick and one filler module
This is the world we now live in
March 12, 2026Source

Retailer denies memory replacement due to 4x increase in DDR5 pricing, says price increase would equate to an 'upgrade' for the customer — Australian retailer refuses to replace faulty Corsair kit
The RAM crisis is unfair for everyone, but some situations absolutely beggar belief.
March 12, 2026Source

Samsung Reportedly to Use 2 nm Process on HBM4E Base Die
Samsung is reportedly planning to bring its 2 nm process to the base die of HBM4E, its 7th-generation high-bandwidth memory. This comes just a month after the company shipped the industry's first commercial HBM4, and alongside a separate effort to redesign the HBM4E power delivery network to handle the increase in power bumps from 13,682 to 14,457 within the same footprint. Until HBM3, the base die had a somewhat passive role, sitting at the bottom of an HBM stack and handling power and signal control. Starting with HBM4, it took on a more active role by handling some compute tasks directly, making the underlying process node increasingly important.
March 12, 2026Source

Two RMA'd RAM Sticks Sent, Only One Reached Kingston; Company Reportedly Denies Replacement
User Reportedly Sends Two DDR4 RAM Sticks, But Kingston Says Only a Single Stick Was Shipped; Company Denied Replacement
March 12, 2026Source

V-COLOR Debuts DDR5 1 + 1 Dummy Memory Kits for Ryzen Gaming PCs
We're really trying to not be synical here. V-COLOR has introduced a new DDR5 product format aimed at AMD Ryzen gaming systems, combining one active memory module with one RGB filler in a single retail package. The concept targets users who want to move onto a DDR5 platform without immediately paying for a full two-module kit, while still maintaining the symmetrical, RGB-lit appearance that has become standard in many modern gaming PC builds. Rather than leaving one DIMM slot visually empty, the bundled filler module gives the system a more complete look from the beginning.
March 12, 2026Source

V-Color Launches 1+1 DDR5 Memory And RGB Filler Kit For AM5 Platform
New memory and filler kits have arrived, offering users a combo of real and fake memory DIMMs.
March 12, 2026Source

V-COLOR Launches 1+1 DDR5 Memory and RGB Filler Kit for AMD Ryzen Gaming Builds
As more gamers move toward AMD Ryzen series platforms for modern DDR5 gaming builds, v-color Technology Inc. is introducing a smarter and more flexible upgrade option with its new 1+1 DDR5 Memory and RGB Filler NON-DRAM Solution. Designed for gamers who want a more accessible way into DDR5, each kit includes one active DDR5 memory module and one matching RGB Filler module. This gives users real DDR5 performance today while keeping the clean dual DIMM RGB look that many builders want in their systems.
March 12, 2026Source

V-COLOR to launch 1+1 DDR5 memory kits with fillers, you can now fake it until RAMapocalypse ends
V-COLOR says it is fine to run with one DDR5 module
March 12, 2026Source

Computer — Memory — March 11th, 2026

Patriot Memory Showcases ACPI Industrial-Grade PCIe Gen 5 SSDs and DDR5 RDIMM at Embedded World 2026
Patriot Memory, a global leader in high-performance memory and storage solutions, is pleased to announce its participation in Embedded World 2026. Under its dedicated industrial and embedded brand, ACPI, Patriot Memory will showcase a comprehensive portfolio of next-generation hardware designed for AIoT, edge computing, and 5G infrastructure. Highlighting the display are the new M2PDR-8LP PCIe Gen 5 x4 SSD, the high-capacity Enterprise NVMe SSD series, and high-speed DDR5 RDIMM modules featuring wide-temperature support.
March 11, 2026Source

Silicon Power's XPOWER Cyclone DDR5 RGB Wins iF Design Award 2026
Silicon Power (SP) proudly announces that its XPOWER Cyclone DDR5 RGB gaming memory module has been honored with the iF Design Award 2026, one of the world's most prestigious recognitions, for outstanding product design. The award highlights the Cyclone's successful fusion of high-performance engineering and bold, minimalist aesthetics designed for gamers, overclockers, and PC enthusiasts.
March 11, 2026Source

Computer — Memory — March 5th, 2026

Lenovo ThinkBook 2026 Reportedly Utilizes CXMT's LPCAMM2 Memory Modules
Looks like CXMT is also producing LPCAMM2 memory modules and not just the regular DDR4 and DDR5 DRAM chips.
March 5, 2026Source or Source

Monitors Unboxed shows 2-year QD-OLED burn-in results after 6,000+ hours
24-month QD-OLED burn-in test
March 5, 2026Source

Micron Unveils First-Ever 256GB LPDDR5X SOCAMM2 For Huge Memory Capacity Gains
We've already reported a few times on SOCAMM2 memory, so if you're not familiar, check out one or all of these stories. The last of those links goes to a story about Micron sampling 192GB SOCAMM2 modules. Well, as you've already read in the headline, the US memory firm is now able to make 256GB SOCAMM2 modules thanks to new 32-Gigabit LPDDR5 chips, which Micron says it is the first to bring to market.
March 5, 2026Source

Computer — Memory — March 4th, 2026

DataDome: DDR5 scalping bots hit RAM product pages 6x more than shoppers, 10M requests from one bot
DDR5 scalping surge: DataDome says bots tuned request rates to evade alarms
March 4, 2026Source

Micron sampling first 256GB SOCAMM2 memory packages to customers — 2TB of RAM per CPU is now in reach of datacenter players
A 33% leap in capacity in six months is an impressive feat.
March 4, 2026Source

Memory Makers Shift to Hourly Contracts as AI Demand Continues to Climb
The memory procurement market has adopted a new business model with hourly contracts, where quoted prices are valid for only a single hour, necessitating a new pricing quote with each change. Memory makers like SK hynix, Samsung, and Micron are responding to the massive demand for their memory solutions with new types of contracts that force OEMs to make quick decisions to procure DRAM within a very short timeframe. This means that memory makers are requiring much faster contract settlements, as the rapid increase in demand is causing product pricing to change literally by the hour.
March 4, 2026Source

NVIDIA Preps GeForce RTX 5050 With 9 GB GDDR7 Memory
NVIDIA is preparing a new variant of its GeForce RTX 5050 graphics card, which will feature 9 GB of memory capacity.
March 4, 2026Source or Source

NVIDIA reportedly plans GeForce RTX 5050 with 9GB memory and 96-bit bus
RTX 5050 update: NVIDIA will add 1GB more for gamers
March 4, 2026Source

NVIDIA Reportedly Preparing 9 GB GeForce RTX 5050 Variant with GDDR7
NVIDIA is reportedly planning a second RTX 5050 variant with 9 GB of memory instead of the standard 8 GB, according to leaker MEGAsizeGPU who has a decent track record on NVIDIA leaks. Unlike the existing RTX 5050, which uses 8 GB of 20 Gbps GDDR6 memory on a 128-bit bus for 320 GB/s of bandwidth, the new model is said to adopt 3 GB GDDR7 modules. The updated configuration would total 9 GB across a 96-bit memory bus. While the narrower bus reduces interface width, the move to 28 Gbps GDDR7 would raise total memory bandwidth to 336 GB/s, a roughly 5% increase, alongside a 12.5% boost in VRAM capacity.
March 4, 2026Source

Rambus Intros Industry's Fastest HBM4E Memory Controller: 60% Faster versus HBM4 at 4.1 TB/s Per IC
Rambus has announced the development of its fastest HBM controller yet, based on the HBM4E standard, offering up to 16 Gbps transfer speeds per pin.
March 4, 2026Source

Scalper bots are now scraping DDR5 memory supply chains as AI data centers consume more RAM
Automated scrapers are crawling everything from retail kits to DIMM sockets and industrial DDR5 suppliers
March 4, 2026Source

Scientists capture a magnetic flip in 140 trillionths of a second
Scientists have captured the split-second spin flips inside a "hidden" magnet — a breakthrough that could supercharge tomorrow's memory technology.
March 4, 2026Source

Computer — Memory — March 3rd, 2026

Asymmetric spin torque unlocks deterministic control of antiferromagnetic memory
Researchers propose a universal mechanism that enables deterministic electrical control of collinear antiferromagnets.
March 3, 2026Source

DRAM bots reportedly being deployed to hoover up memory chips and components — one operation ran 10 million web scraping requests, hitting DDR5 RAM product pages every 6.5 seconds
That's six times more frequent than the average user, meaning only one in seven requests comes from legitimate buyers.
March 3, 2026Source

Micron introduces 256GB LPDRAM SOCAMM2 module for servers
Having exited the consumer market, Micron is currently concentrating on improving the appeal of its AI product lineup. In this case, capacity is quite an important spec that may attract hyperscalers. And large capacity they delivered, on a single module. 
March 3, 2026Source

Micron Releases World's First High-Capacity 256 GB LPDRAM SOCAMM2 for Data Center Infrastructure
Micron Technology, Inc. today extended its leadership in low-power server memory by shipping customer samples of the industry's highest-capacity LPDRAM module—256 GB SOCAMM2. Enabled by the industry's first monolithic 32 Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures.
March 3, 2026Source

Micron Ships Out the "World's First" 256GB SOCAMM2 Modules Targeted Toward the Agentic AI Frenzy
Micron's latest breakthrough in the memory industry is the debut of the more capable SOCAMM2 memory modules, featuring leading capacity and power efficiency.
March 3, 2026Source

Next-generation memory material has the surprising property of shrinking when heated
Most materials we use in everyday life expand slightly when heated and return to their original size when cooled. In addition to such thermal properties, materials can also have electrical properties or magnetic properties, and traditionally we have used these characteristics separately. However, some materials allow multiple properties to coexist within a single substance.
March 3, 2026Source

Samsung Redesigns HBM4E Power Delivery to Cut Defects and Explore HBM-GPU Separation
Samsung is overhauling the power delivery network in its HBM4E memory to tackle what's becoming one of the bigger engineering headaches in next-gen AI chips. This comes just two weeks after the company shipped its first commercial HBM4, already pushing 11.7 Gbps consistently with headroom up to 13 Gbps. As designs move from HBM4 to HBM4E, the number of power bumps grows from 13,682 to 14,457, packed into the same space with thinner, denser wiring.
March 3, 2026Source

Computer — Memory — March 2nd, 2026

Memory scalpers hunt scarce DRAM with bot blitz
We can remember it for you wholesale, and sell it back to you for big bucks
March 2, 2026Source

Computer — Memory — February 24th, 2026

When smaller means better: How device scaling enhances memory performance
When smaller means better: How device scaling enhances memory performance
February 24, 2026Source

Why buying DDR4 RAM is now a smarter play than DDR5 - especially if you're PC building
Rising memory prices (and demand) are driving up PC costs, but savvy shoppers can still find bargains by following these steps.
February 24, 2026Source

Computer — Memory — February 17th, 2026

A Deep Dive Into Modern Computer Memory: ROM, DRAM, SRAM & Flash
When we talk about computer memory nowadays, most people think of "RAM" or perhaps the long-term storage in their phones or laptops. But behind those simple terms lies a vast and fascinating ecosystem of semiconductor memory technologies, each with its own history, design philosophy, and role in modern electronics. At its core, memory in computers stores information, from the instructions and data a processor is actively using to the massive amounts of user content and system files we keep on our SSDs and memory cards. Yet not all memory is created equal in how fast it responds, how long it retains data, or how much it costs per gigabyte.
February 17, 2026Source

Intel Xeon 6 Granite Rapids Memory Scaling Performance From 6 To 12 MRDIMMs
With memory pricing being as wild as it is these days and with MRDIMMs on Xeon 6 Granite Rapids offering much more memory bandwidth than conventional DDR5 RDIMMs, you may be wondering about the performance impact when not populating all twelve memory channels on the Xeon 6900 series processors. In this article are benchmarks to demonstrate the performance difference of MRDIMM-8800 memory across using six, eight, ten, and twelve MRDIMMs with a Xeon 6980P server.
February 17, 2026Source

This is the Ampere AmpereOne M A192-32M 192 Core 12-Channel DDR5 Arm CPU
This is the Ampere AmpereOne M A192-32M 192 Core 12-Channel DDR5 Arm CPU
February 17, 2026Source

Wi-Fi routers are expected to explode in price due to RAM shortage
Memory now accounts for 20 percent of the total cost of a Wi-Fi router, up from 3 percent. Market analysts think that number will keep rising.
February 17, 2026Source

Computer — Memory — February 15th, 2026

You can now file your G.Skill class action claim to get a cut of the $2.4 million settlement — deceptive memory marketing class action now accepting payout submissions
Don't expect to get a big amount, though.
February 15, 2026Source

Computer — Memory — February 14th, 2026

Corsair redesigns DDR5 packaging to combat rising RAM scams
Customers can now see the actual DRAM product they are paying a fortune for
February 14, 2026Source

Computer — Memory — February 13th, 2026

Corsair Updates Its Memory Packaging For Vengeance DDR5 To Improve Product Verification
Due to an increase in reports of fake RAM kits, Corsair has begun packaging its Vengeance DDR5 RAM modules in a new packaging to combat counterfeits.
February 13, 2026Source

CORSAIR Updates Vengeance DDR5 Packaging - Vows to Protect Product Authenticity
Corsair published a low-key blog entry earlier this month (February 2), that described their recent updating of DRAM packaging that is "security and transparency"-focused. As depicted in a lone preview shot, the new container is plastic, but Corsair insists that this change—that ditches signature yellow cardboard boxes—will still retain "environmental responsibility."
February 13, 2026Source

Framework's latest update brings more bad news about memory and storage pricing crisis — RAM costs increased to $12 to $16 per GB, recommends purchasing some models elsewhere for Framework Laptop DIY Edition customers
Good news is getting scarce these days.
February 13, 2026Source or Source

HBM4 Validation Expected in 2Q26; Three Major Suppliers Poised to Shape NVIDIA Supply Landscape
TrendForce's latest analysis of the HBM industry reveals that as the ongoing expansion of AI infrastructure continues to fuel GPU demand, NVIDIA's upcoming Rubin platform is expected to become a major catalyst for HBM4 adoption once mass production begins. The three leading memory suppliers—Samsung, SK hynix, and Micron—are now in the final stages of HBM4 validation, with completion anticipated by 2Q26.
February 13, 2026Source

Lenovo Reveals Ultra-Fast And Capacious 96GB LPCAMM2 Memory At 9600 MT/s
Let's talk memory form factors, friends. You're surely familiar with DIMMs, and SODIMMs, and maybe you've even fooled around with RDIMMs, or LRDIMMs. Well, the number of memory module formats in the computing world has exploded over the last few years. This isn't an explainer, so we won't go over all of them, but rather we'll focus on the one that is getting the most attention recently: LPCAMM2.
February 13, 2026Source

Lenovo showscases Samsung LPCAMM2 module with 96GB capacity and 9600 MT/s speed
A Lenovo ThinkBook product manager, posting on Weibo, shared a photo of a Samsung LPDDR5X CAMM2 (LPCAMM2) memory module with a label showing 96GB capacity and a 9600MT/s data rate. The same post calls it "dual 96" and says the part has not entered mass production yet.
February 13, 2026Source

Lenovo stockpiled enough RAM for 2026. It's still raising PC prices
The company's CEO said that it will have to bring prices up because of the RAM crunch, even though a few months ago another executive said the company has enough for 2026.
February 13, 2026Source

Lenovo stockpiled enough RAM for 2026. It's still raising PC prices
The company's CEO said that it will have to bring prices up because of the RAM crunch, even though a few months ago another executive said the company has enough for 2026.
February 13, 2026Source

Samsung 96 GB LPCAMM2 with 9600 MT/s Speed Pictured
A Lenovo product manager on Chinese social media held up what is possibly the highest capacity and highest speed LPCAMM2 module. An LPCAMM2 is a SOCAMM2 module that uses LPDDR5 or LPDDR5X DRAM. It is replaceable, unlike traditional LPDDR implementations that see the DRAM chips hardwired to the notebook's mainboard. Pictured here, is a new Samsung LPCAMM2 that offers 96 GB of density with a speed of LPDDR5X-9600.
February 13, 2026Source

Computer — Memory — February 12th, 2026

BIOSTAR launches budget DDR5 16GB UDIMM at 4800 and 5600 MT/s
BIOSTAR is a company that advertises itself as a 'motheboard' brand is slowly expanding into new markets, including industrial PCs, graphics cards, and storage. They also have memory products, but their lineup is quite limited.
February 12, 2026Source

Biostar Introduces DDR5 16 GB UDIMM 4800/5600 MT Memory
BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, storage devices, and memory solutions, is excited to introduce its latest DDR5 16 GB UDIMM memory, available in 4800 and 5600 MT variants. Designed with a focus on stability, efficiency, and broad system compatibility, the new DDR5 memory delivers reliable performance across everyday computing and professional applications.
February 12, 2026Source

Biostar launches new 16GB UDIMM DDR5 memory modules
Biostar has new UDIMM memory modules hitting the market. The new 16GB DDR5 kits are now shipping out, available with either 4800MHz or 5600MHz speeds, designed with a focus on stability and efficiency.
February 12, 2026Source

Samsung begins HBM4 mass production and customer shipments up to 3.3 TB/s per stack
Samsung Electronics says it has begun mass production of HBM4 and has shipped commercial products to customers, marking what the company describes as a first for commercial HBM4 shipments.
February 12, 2026Source

Samsung has reportedly sent LPDDR6X samples even before the LPDD6 release
Qualcomm is rumored to have requested Samsung's next-gen DRAM solution.
February 12, 2026Source

Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
"Instead of taking the conventional path of utilizing existing proven designs, Samsung took the leap and adopted the most advanced nodes like the 1c DRAM and 4nm logic process for HBM4," said Sang Joon Hwang, Executive Vice President and Head of Memory Development at Samsung Electronics. "By leveraging our process competitiveness and design optimization, we are able to secure substantial performance headroom, enabling us to satisfy our customers' escalating demands for higher performance, when they need them."
February 12, 2026Source

Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
Mass production commences for HBM4 with consistent transfer speed of 11.7Gbps, capable of up to 13Gbps
February 12, 2026Source

Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
Samsung Electronics Co., Ltd., a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the industry, securing an early leadership position in the HBM4 market. By proactively leveraging its most advanced 6th-generation 10 nanometer (nm)-class DRAM process (1c), the company achieved stable yields and industry-leading performance from the outset of mass production—all accomplished seamlessly and without any additional redesigns.
February 12, 2026Source

Computer — Memory — February 11th, 2026

Biostar Introduces DDR5 16 GB UDIMM 4800/5600 MT Memory
BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, storage devices, and memory solutions, is excited to introduce its latest DDR5 16 GB UDIMM memory, available in 4800 and 5600 MT variants. Designed with a focus on stability, efficiency, and broad system compatibility, the new DDR5 memory delivers reliable performance across everyday computing and professional applications.
February 11, 2026Source

BIOSTAR Introduces DDR5 16GB UDIMM 4800MHz/5600MHz Memory
BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, storage devices, and memory solutions, is excited to introduce its latest DDR5 16GB UDIMM memory, available in 4800MHz and 5600MHz variants. Designed with a focus on stability, efficiency, and broad system compatibility, the new DDR5 memory delivers reliable performance across everyday computing and professional applications.
February 11, 2026Source

Does PC RAM wear out? It's complicated
We answer this tricky question!
February 11, 2026Source

G.Skill reaches $2.4 million DDR4 and DDR5 memory speed settlement, changes to OC speed labels proposed
Settlement pushes clearer disclosures that DDR4 and DDR5 speeds depend on CPU and motherboard support
February 11, 2026Source

G.SKILL settles U.S. lawsuit over RAM speed labels and XMP for 2.4 Million USD
A U.S. class-action lawsuit challenging how G.SKILL advertises desktop memory speeds has been resolved through a settlement that combines a cash fund with changes to future packaging language. The dispute centers on a long-running PC industry convention: memory kits are commonly marketed using their validated XMP or EXPO profile rating, while many systems default to a lower JEDEC baseline on first boot until the user enables the profile in firmware.
February 11, 2026Source

Intel Nova Lake Compute Tile Die Sizes Revealed: 8+16 at 110mm2 & bLLC Variant at 150mm2
Intel's Nova Lake bLLC Compute Tile Measures Slightly Bigger Than Standard Variant, Dual Compute Tile Variants To Take 300mm² of Space on Package
February 11, 2026Source or Source

Intel "Nova Lake" Compute Tile Die-sizes Surface
Intel is preparing to launch its next generation Core Ultra Series 4 "Nova Lake" processors in the second half of 2026. We have some hint on what the sizes of the Compute tiles of these chips could measure. "Nova Lake" remains a tile-based disaggregated chip, just like the current "Arrow Lake," with the most advanced foundry node being allocated only to the components that can benefit the most from it, the CPU cores.
February 11, 2026Source

Intel Nova Lake die sizes leak, signaling higher cost — smaller compute tile still demands higher price on TSMC N2
Intel expects its Core Ultra series 4 processors, codenamed Nova Lake, to change its fortunes on the desktop and laptop markets and finally offer performance that is higher compared to direct competitors from AMD. However, another important factor to consider will be the costs of these CPUs, and if the alleged Nova Lake compute chiplet die sizes leaked by @9550pro are accurate, these processors will be anything but cheap to make.
February 11, 2026Source

Intel Nova Lake flagship leak hints at new 700W-plus PL4 ceiling
Intel's next desktop generation, Nova Lake, is already picking up some spicy numbers, and this time it is not a benchmark screenshot. Leaker kopite7kimi claims that the top Nova Lake desktop processor could be configured with a Power Level 4 limit above 700 watts. The most likely candidate would be the leading unlocked SKU in the lineup, often discussed as a Core Ultra 400K-class part. Before anyone panics, PL4 is best understood as an upper boundary rather than a typical operating point. It is commonly treated as a hard cap the CPU should not exceed, with power management designed to rein in frequency and voltage behavior preemptively if a workload threatens to push beyond the ceiling.
February 11, 2026Source

Samsung and SK hynix shorten memory contracts as pricing power shifts back to suppliers — both companies now at 40-50% operating margins
Rising prices are prompting memory makers to abandon long-term fixed deals in favor of shorter contracts and post-settlement pricing.
February 11, 2026Source

SK hynix previews 14.4 Gb/s LPDDR6, Samsung targets 12.8
LPDDR6 is moving from standards documents into device-level reality, and ISSCC 2026 is set to provide one of the first detailed looks at what the major DRAM vendors can deliver. With JEDEC's LPDDR6 (JESD209-6) already published, the ecosystem has a defined speed trajectory: early implementations around 10.67 Gb/s per pin, scaling toward a 14.4 Gb/s ceiling as controllers, PHYs, channel design rules, and DRAM devices mature.
February 11, 2026Source

Work on Next-Gen HBM5 & HBM6 Memory Is Already Underway, New Wide TC Bonders Ready
HBM memory will see a big upgrade with next-gen HBM5 and HBM6 standards, which are already being developed with new TC Bonders.
February 11, 2026Source

Computer — Memory — February 6th, 2026

Aurzen's Zip Foldable Pocket Projector Gets a Cyberpunk-Themed Makeover
A new look for a futuristic foldable PJ.
February 6, 2026Source

Don't let RAM clearance wreck your PC build
When building a PC, many factors must be considered, but one is often overlooked: the space around the RAM slots.
February 6, 2026Source

DRAM Memory Shortage Crisis Explained: When Will Memory Prices Calm After the AI Surge
What happens when the backbone of modern technology, memory, becomes a scarce resource? The global DRAM shortage isn't just a supply chain hiccup; it's a full-blown crisis reshaping industries from AI development to consumer electronics. Prices for memory products have skyrocketed by as much as 300%, leaving businesses and individuals scrambling to adapt. In this breakdown, Caleb Writes Code walks through how the convergence of surging AI demands, production bottlenecks, and geopolitical tensions has created a perfect storm for the memory market.
February 6, 2026Source

NVIDIA to Use SK hynix and Samsung HBM4 for "Vera Rubin" Without Micron
NVIDIA's upcoming "Vera Rubin" AI systems are scheduled for late summer shipping in the form of VR200 NVL72 rack-scale solutions that will power the next generation of AI models. However, not every memory maker of HBM4 qualified for a design win, as Micron has reportedly fallen out of the equation, with only Samsung and SK hynix left to supply the precious HBM4 memory. According to leaked institutional notes from SemiAnalysis, which tracks the supply chain in great detail, SK Hynix will represent about 70% of the HBM4 supply for VR200 NVL72 systems, with Samsung getting the remaining 30% of the supply.
February 6, 2026Source

Computer — Memory — February 4th, 2026

China's CXMT and YMTC to increase memory output — two new fabs could close the gap with the 'big three'
CXMT and YMTC are scaling fab capacity as AI demand strains global supply.
February 4, 2026Source

Crucial DDR5 Pro OC Memory DDR5-6400 16GB Dual-Channel Memory Kit Review
As they exit the consumer market, we get one last look at the potential of Crucial and Micron and what the DDR5 Pro OC lineup peaks at.
February 4, 2026Source

Intel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers — vertically-stacked memory touts 2 to 3x more capacity, greater bandwidth, and half the power consumption
With the first prototypes expected in 2027.
February 4, 2026Source

Computer — Memory — February 2nd, 2026

Memory Price Outlook for 1Q26 Sharply Upgraded; QoQ Increases of All Product Categories to Hit Record Highs
TrendForce's latest memory industry survey indicates that persistent AI and data center demands in 1Q26 are further worsening the global memory supply and demand imbalance, thereby increasing suppliers' pricing power. As a result, TrendForce has significantly raised its 1Q26 price forecasts for both DRAM and NAND Flash products. The quarter-over-quarter increase in conventional DRAM contract prices has been revised upward, from a previous estimate of 55-60% to now 90-95%. Similarly, NAND Flash contract prices are now expected to rise from 33-38% to 55-60%.
February 2, 2026Source

Memory Prices Reach "Shocking" Levels as Manufacturers Are Now Quoting a Whopping 125% Premium, Turning DRAM Into a Full-Blown Seller's Market
Memory contract pricing is rising at a rate never seen before, and according to a new report, QoQ quotations have almost doubled amid gigantic demand.
February 2, 2026Source

Computer — Memory — January 30th, 2026

Big three memory chip manufacturers policing customers to prevent hoarding — employee says industry relationships 'matter in a crunch'
The three major memory chip manufacturers — Micron, Samsung, and SK hynix — are reportedly becoming stricter when it comes to chip orders. Sources tell Nikkei Asia that the companies will conduct more stringent due diligence measures, including confirming the identity of the end-user, the quantity of the order, and even asking if the demand is real. These measures come as the memory chip supply remains tight, with AI chip makers still demanding huge amounts of HBM, taking up capacity that would otherwise be used for consumer memory.
January 30, 2026Source

KLEVV CRAS V RGB DDR5-9200 CUDIMM 48GB Dual-Channel Memory Kit Review
KLEVVV adds CUDIMM to the CRAS V RGB lineup with insane speed and lower voltage, but do they have the performance to justify their existence? Let's see.
January 30, 2026Source

Microsoft's Maia AI chip ambitions might include an exclusive SK Hynix HBM3e memory deal
Big Tech buying all the memory chips they can, for years to come
January 30, 2026Source

This V-Color 512 GB DDR5 Server Kit Becomes So Expensive It Costs Nearly As Much As Seven NVIDIA RTX 5090 GPUs
A single 128 GB DDR5 memory module is selling for a price higher than the GeForce RTX 5070 Ti and we are seeing
January 30, 2026Source

Computer — Memory — January 15th, 2026

Intel & ASUS Explain Why RAM Shortages Have Not Raised Laptop Prices... Yet
Intel and Asus say careful planning and large RAM inventories are delaying laptop price increases in 2026. This careful planning gives buyers short-term relief despite rising memory costs and growing pressure from AI-driven demand.
January 15, 2026Source

Computer — Memory — January 9th, 2026

Chinese researchers hail breakthrough in DRAM-like cells, which could be used in embedded or 3D stacked memory — absence of manufacturing detail casts doubt on mass production
Uncertainties make it impossible to evaluate commercial viability
January 9, 2026Source

GIGABYTE Announces World's First 256GB DDR5-7200 CQDIMM Support at CES 2026
GIGABYTE, the world's leading computer brand, announces a breakthrough introduction of the world's first CQDIMM (Clocked Unbuffered Dual In-Line Memory Module) technology at CES 2026. By leveraging the CQDIMM-supported motherboard, Z890 AORUS Tachyon ICE CQDIMM Edition, and BIOS tuning technology, GIGABYTE achieves the industry-first record DDR5-7200 without compromise at full capacity with two 128GB memory modules.
January 9, 2026Source

HP Is Reportedly Left With Limited Choices but to Turn to Chinese Memory Suppliers Like CXMT to Combat DRAM Shortages
One of the largest PC manufacturers, HP, may look to Chinese memory suppliers to secure its DRAM supply, as all other options appear to be exhausted for now.
January 9, 2026Source

Netac Shows DDR5 Memory, Portable SSDs, and PCIe 5.0 M.2 NVMe Drives at CES 2026
At the Netac booth at CES 2026, we saw a fleet of memory and storage solutions that the company has prepared for the consumer market. Starting with its Basic memory lineup, it includes DDR5 memory running up to 4,800 MT/s with capacities of up to 32 GB per DIMM. On the other hand, its older DDR4 tops out at 3,200 MT/s with the same 32 GB max capacity (per kit). However, the company has prepared even more advanced DDR5 and DDR4 DIMMs that can reach much higher clock speeds.
January 9, 2026Source

Samsung and SK Hynix are jacking up DRAM prices by as much as 70 percent
Hyperscalers and Big Tech are buying every memory chip they can
January 9, 2026Source

Computer — Memory — January 8th, 2026

As memory crisis continues, Samsung expects record profit in latest quarter
Despite a memory crisis driven by AI demand, Samsung anticipates a record-breaking quarter with estimated revenue of $64.2 billion and operating profit of $13.8 billion.
January 8, 2026Source

Here's How You Could Afford a House in Shanghai Using DDR5 Modules, as Prices Have Reached Astronomical Levels in the Region
DDR5 prices have reached a point where you could actually afford a house in Shanghai by acquiring a few modules, highlighting the severity of DRAM shortages.
January 8, 2026Source

High RAM prices mean record-setting profits for Samsung and other memory makers
Supply shortages and big price increases for RAM and storage have been a major drag for enthusiasts and PC builders in recent months. And while we haven't yet seen large, widespread price increases for memory-dependent products like pre-built laptop PCs, smartphones, and graphics cards, most companies expect that to change this year if shortages continue.
January 8, 2026Source

How Much RAM Do Gamers Need? 8GB versus 16GB versus 32GB versus 64GB
It's that point in the hardware cycle where it's worth taking a fresh look at how much system memory modern games actually use -- and, more importantly, how much you really need. With DRAM pricing still in flux, most people aren't exactly rushing out to buy a brand-new 32GB DDR5 memory kit. That uncertainty has pushed a familiar question back into the spotlight: can you still get away with 16GB? That's what we set out to answer here.
January 8, 2026Source

Patriot shows off opulent Viper Xtreme 5 Aurum RAM kit with flashy finish as prices surge throughout industry — company also showcases new SSDs and MicroSD Express card for Switch 2
We've got a plethora of new SSDs and RAM modules on the scene, with storage solutions for mobile devices on display, too.
January 8, 2026Source

Computer — Memory — January 7th, 2026

Nvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch — high bandwidth memory offers more flexibility in AI deployments across a range of workloads
Jensen Huang argues that SRAM, cheaper memory, and open models can boost efficiency, but the reality of shifting AI workloads keeps Nvidia tied to HBM.
January 7, 2026Source

PC-Canada cites "Market volatility" and requests more money from customer for a RAM order
A PC-Canada customer says an already-placed RAM order turned into a pay-more-or-cancel email. The retailer asked for explicit approval of a higher price before shipping.
January 7, 2026Source

Computer — Memory — January 6th, 2026

Light storage in light cages: A revolutionary approach to on-chip quantum memories
Quantum memories can extend network range via repeaters. A new approach uses 3D-nanoprinted 'light cages' filled with atomic vapor, enabling scalable on-chip quantum storage.
January 6, 2026Source

Mem-ageddon: AI chip frenzy to wallop DRAM prices with 70% hike
Samsung and SK hynix readying another gouge as server silicon squeeze leaves PCs and phones out in the cold
January 6, 2026Source

MSI and GIGABYTE demo 256GB 4-rank DDR5 CQDIMM support on Intel Z890 with 2-DIMM boards
256GB memory on Z890 with two DDR5 modules is now possible
January 6, 2026Source

NVIDIA Reveals Why the Company Is "Immune" to Memory Shortages — and How The Firm Prepaid Inventory to Keep the AI Boom Running
NVIDIA has addressed the ongoing memory shortages and explained how the company has positioned itself to ensure it doesn't compromise its supply chain operations.
January 6, 2026Source

SK Hynix Shows 16-Layer 48 GB HBM4 Memory Modules at CES 2026
SK Hynix has showcased its most advanced high-bandwidth memory, packaged as a 16-high 48 GB HBM4, designed for high-capacity AI and HPC accelerators that require lots of memory. This is the first time SK Hynix has shown a memory module more advanced than the 12-high 36 GB HBM4, which used to run at 11.7 Gbps. For the new 16-high HBM4, we don't have official data or any speed references, but we can assume SK Hynix managed to extract a bit more bandwidth from the four additional DRAM layers. Interestingly, the announcement was somewhat vague, possibly because Micron and Samsung are also enhancing their HBM4 modules before they become available to companies like AMD and NVIDIA, allowing for potential increases in speed if needed.
January 6, 2026Source

Computer — Memory — January 5th, 2026

Memory Makers Prioritize Server Applications, Driving Across-the-Board Price Increases in 1Q26
TrendForce's latest investigations indicate that DRAM suppliers in 1Q26 will continue to reallocate advanced process nodes and new capacity toward server and HBM products to support rising AI server demand. This shift has significantly limited supply in other markets, causing conventional DRAM contract prices to increase by about 55-60% QoQ. Meanwhile, disciplined capacity management by NAND Flash suppliers, along with robust server demand that is displacing other applications, is likely to increase contract prices across all NAND Flash product categories by 33-38%.
January 5, 2026Source

Patriot Memory Showcases Next-Generation Performance at CES 2026
Patriot Memory, a global leader in high-performance memory and storage solutions, will unveil its latest advancements at CES 2026, taking place January 6--9, 2026, in Las Vegas, Nevada. Building on decades of engineering expertise, Patriot's CES 2026 showcase highlights the company's continued focus on next-generation DDR5 memory and PCIe Gen5 storage technologies designed for enthusiasts, gamers, and professional users.
January 5, 2026Source or Source

Samsung CEO Says What We Already Know About the Memory Shortage
It's a new year. Start pinching those pennies!
January 5, 2026Source

Samsung pushes HBM4 as it battles SK Hynix for AI memory dominance
2026 will test Samsung's HBM4 bet
January 5, 2026Source

Computer — Memory — January 2nd, 2026

ASUS Intros Pro WS B850M-ACE SE Motherboard with IPMI for Home and SMB Servers
ASUS introduced the Pro WS B850M-ACE SE, an AMD Socket AM5 motherboard in the microATX form-factor that's laid out like a server motherboard, but targets a range of consumers spanning from home and small-business servers, to workstations with storage-heavy loadouts. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It supports the entire range of consumer Ryzen and commercial Ryzen PRO desktop processors from the Ryzen 7000 and Ryzen 9000 series. It also supports EPYC 4005 series server processors in the AM5 package. The board also supports ECC DDR5 unbuffered memory, with support for up to 256 GB of dual-channel (4 sub-channel) DDR5-5600 memory.
January 2, 2026Source

DRAM Contract Prices Are Projected to Rise By a Whopping 50% In This Quarter, As Shortages Now Appear to Be Out of Control
DRAM shortages are expected to become more aggressive moving forward, and according to a new report, DRAM contract prices could rise by up to 50% in Q1 2026.
January 2, 2026Source

LPDDR6 RAM May Only Reach Ultra-Premium Android Phones
Android phones are expected to begin adopting LPDDR6 RAM in 2026, promising higher bandwidth and better energy efficiency. However, rising memory costs and supply constraints could mean that only flagship devices benefit from the upgrade.
January 2, 2026Source

Micron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies — three-year project aims to develop leading-edge, high-performance memory
Taiwan doubles down on advanced memory by backing Micron's next-gen HBM development.
January 2, 2026Source

Computer — Memory — December 26th, 2025

This strange magnetism could power tomorrow's AI
A newly revealed magnetic state in ruthenium dioxide could be the secret to faster, denser, and more reliable memory chips.
December 26, 2025Source

Computer — Memory — December 25th, 2025

ASUS Rumored To Enter DRAM Market Next Year To Tackle Memory Shortages
SUS is rumored to enter the DRAM manufacturing segment by 2026, which should ensure a stable memory supply for its PC lineups.
December 25, 2025Source

Framework announces another DDR5 prices hike
Framework announced another DDR5 price hike, encourages users to 'bring their own RAM'
December 25, 2025Source

Russian enthusiasts planning do-it-yourself DDR5 memory amidst the worldwide shortage — building your own RAM is as 'easy' as sourcing your own memory modules and soldering them on empty PCBs
An enterprising Russian enthusiast has taken to building his own memory amid the extreme price increases driven by a global shortage. As the world suffers from dried-up memory inventories, some people are wondering when things will go back to normal, while others are looking toward exotic alternatives like SODIMM-to-UDIMM adapters. Now, a bunch of modders in Russia have taken matters into their own hands and are proposing a radically inventive solution: making your own RAM by assembling the relevant parts yourself.
December 25, 2025Source

Computer — Memory — December 21st, 2025

Samsung explains SOCAMM2: LPDDRX memory for AI servers
Samsung has announced SOCAMM2, short for Small Outline Compression Attached Memory Module. It is a server memory module that uses LPDDR, a low-power memory type usually found in laptops and phones.
December 21, 2025Source

User Gets Scammed As Amazon Sells DDR4 RAM Disguised As DDR5
Beware of the fake DDR5 RAM kits that are now being sold on major retailers. It's possible that your RAM might not be what it appears on the outside.
December 21, 2025Source

Computer — Memory — December 20th, 2025

The Tables Are Turning for Samsung in the HBM Market, as It Has Now Overtaken Micron After Recent HBM3E & HBM4 Breakthroughs
Samsung's HBM business has managed to make a massive comeback after a few sluggish quarters, as the firm now sees its quarterly market share surpassing that of Micron's.
December 20, 2025December 20, 2025 — Source

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Tired of sky-high memory prices? Buckle up, we're in this for the long haul
If you were hoping for some relief from stratospheric memory pricing, don't hold your breath. DRAM prices aren't expected to peak until at least 2026, TechInsights analyst James Sanders tells El Reg.
December 20, 2025Source

Computer — Memory — December 19th, 2025

BIWIN's Advanced Memory and Storage Solutions
BIWIN will highlight products designed to meet the growing demands of modern devices, from wearables and smartphones to industrial systems, automotive platforms, and high-end PCs. The company's focus this year is on delivering higher performance, lower power consumption, and long-term reliability across a wide range of applications.
December 19, 2025Source

Colorful iGame Shadow II DDR5-6000 UDIMM 32GB Dual-Channel Memory Kit Review
Colorful's iGame Shadow II DDR5-6000 delivers strong performance, Hynix A-die OC headroom, and striking design with XMP/EXPO support for enthusiasts.
December 19, 2025Source

Here's why HBM is coming for your PC's RAM — HBM consumes around three times the wafer capacity of DDR5 per gigabyte, as AI supercharges demand for chips and advanced packaging
Surging prices, diverted wafer capacity, and multi-year delays in relief are pushing memory out of reach for consumers.
December 19, 2025Source

Origin Code Unveils VORTEX DDR5 Memory
Origin Code is set to showcase its flagship VORTEX DDR5 memory series at CES 2026, introducing what it claims is the world's first DDR5 module with a detachable triple-fan active cooling system.
December 19, 2025Source or Source

RAM sticks of the future will have triple fan modules for cooling
Origin Code is announcing its latest advancements in RAM with the new Vortex DDR5 memory sticks. These RAM kits can come with a detachable triple-fan module to help keep the RAM at cooler temperatures during heavy use.
December 19, 2025Source

Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs
The LPDDR5X-based module is being positioned as a standardized, serviceable alternative to soldered memory as AI servers chase higher bandwidth.
December 19, 2025Source or Source

Computer — Memory — December 15th, 2025

AI-driven chip shortage could mean your next smartphone or laptop will have less RAM
Reducing memory capacity may be the next step to cope with chip shortage
December 15, 2025Source

DDR5 memory prices triple in three months, giving AMD AM4 upgrades a second wind
ComputerBase's latest price check shows mainstream RAM kits rising by an average 251.95% between mid-September and mid-December 2025. In the same tracking set, SSDs rose 41.59% on average and HDDs rose 33.72%.
December 15, 2025Source

One Of The Biggest RAM Brands Is About To Become Impossible To Buy From
The market for PC components is rapidly being warped by ravenous demand from the AI industry. With prices on the rise, consumers have been dealt another blow as one of the most recognizable memory and storage brands in the industry is set to close its doors. Micron, one of the world's major RAM suppliers, is shutting down its consumer-facing Crucial brand, a move that could put even more upward pressure on PC prices going into 2026.
December 15, 2025Source

SK Hynix has reportedly forecast consumer memory shortages through 2028
Gamers and PC enthusiasts may face prolonged, inflated component prices, as SK Hynix has reportedly forecast that the shortage of DRAM could last until 2028. This may not only impact current-generation products like DDR5 and GDDR7, but also previous-gen DDR4 memory, GDDR6 and even LPDDR, which is typically used in mobile devices.
December 15, 2025Source or Source

Computer — Memory — December 12th, 2025

Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM
Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce power consumption across a wide range of applications, including AI servers and IoT components.
December 12, 2025Source

Computer — Memory — December 11th, 2025

'Outlet' RAM sold in Japan as new with huge markups, scuffed packaging — Crucial DDR5-5600 64GB kit commands $600 overseas as AI shortage bites
"Outlet" quality, but still at premium pricing
December 11, 2025Source

Computer — Memory — December 5th, 2025

DDR5 versus DDR4 Gaming Performance Revisited
Modern Games Say It's Time to Move On
December 5, 2025Source

I hope Crucial's death isn't a canary in a PC memory coal mine
I'm now wondering what comes next.
December 5, 2025Source

Memory Shortages To Last Till At Least Q4 2027, Higher Prices Expected Throughout 2026-2027, 256 GB DDR4 Kits Retail For Over $3000, Entry-Level DDR5 32 GB Kits Over $300
Memory prices are getting out of control on both the DDR5 & DDR4 fronts, and it looks like the situation won't improve even in 2027.
December 5, 2025Source

Samsung Secures Deal to Supply Half of NVIDIA's SOCAMM2 Modules in 2026
Korean tech publication Hankyng reports that Samsung Electronics has secured a deal to supply half of NVIDIA's SOCAMM2 modules in 2026. NVIDIA designed its upcoming "Vera Rubin" Superchip module, which consists of two "Rubin" AI GPUs and one "Vera" CPU, to support DDR5 SOCAMM2 modules. These replace hardwired LPDDR5X ECC memory found in current "Grace Blackwell" Superchip modules. SOCAMM2, or small-outline CAMM2, is a variant of DDR5 CAMM2 modules with slimmer outlines, to further minimize their PCB footprint.
December 5, 2025Source

Someone swapped 192GB of DDR5 for a 5070 Ti, but the price difference is stunning
A terrible deal, or a stand against scalpers?
December 5, 2025Source

Computer — Memory — December 3rd, 2025

Fraunhofer, TSRI Partner on Ferroelectric Transistors for Low-Power Memory ICs
Artificial intelligence works fast, but its energy consumption is growing rapidly. A German-Taiwanese research team is now developing a solution: new memory for leading chip technologies smaller than 3 nm. These innovative nanosheet devices enable computing operations directly in memory, thereby drastically reducing energy consumption. They are based on ferroelectric field-effect transistors (FeMFETs) made from hafnium oxide, which are particularly efficient. With a joint research program, Fraunhofer IPMS, Fraunhofer IMWS, and the Taiwanese research institute TSRI are laying the foundation for the next generation of energy-efficient AI chips - from smartphones and automobiles to medical devices.
December 3, 2025Source

Winbond Launches 8Gb DDR4 DRAM Built on 16 nm for Industrial and Embedded Applications
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8 Gb DDR4 DRAM, developed using Winbond's in-house advanced 16 nm process technology, delivering higher speed, lower power consumption, and better cost efficiency solution for TV, servers, networking, industrial PCs, and embedded applications.
December 3, 2025Source

Computer — Memory — November 30th, 2025

Micron plans $9.6 billion HBM fab in Japan as AI memory race accelerates
U.S. chipmaker set to expand Hiroshima site with heavy support from Tokyo.
November 30, 2025Source

Computer — Memory — November 26th, 2025

CyberPowerPC cites 500% RAM surge as MAINGEAR warns of deeper memory shortages
CyberPowerPC has announced that it will raise prices on all gaming PCs starting December 7th, 2025. In a statement to customers, the company links the move to sharp component cost increases and frames the change as a necessary adjustment rather than a permanent shift in its pricing model.
November 23, 2025Source

Global DRAM Revenue Jumps 30.9% in 3Q25, Micron's Market Share Climbs by 3.7 Percentage Points
TrendForce's latest research shows that significant increases in conventional DRAM contract prices, higher bit shipments, and growing HBM volumes drove the global DRAM industry revenue to US$41.4 billion in 3Q25, marking a strong 30.9% QoQ growth.
November 23, 2025Source

Intel Arrow Lake Refresh CPUs arrive with native DDR5-7200 CUDIMM support — 12.5% higher speeds than initial Arrow Lake chips
Faster RAM support means little in today's market, though.
November 23, 2025Source

New DDR5-13530 memory world record set on GIGABYTE Z890 AORUS TACHYON motherboard
As you might have noticed, we stopped reporting on most memory overclocking world records. There is not much value in repeating that someone has pushed the frequency by another 10 MHz. Yesterday was different though. A new milestone pushed DDR5 past 13,500 MT/s for the first time.
November 23, 2025Source

RAM prices have increased '500%,' PC builder claims — CyberPowerPC announces price hikes in U.S. and UK starting December 7
The RAM situation is going from bad to worse.
November 23, 2025Source

SK Hynix to discuss 24Gb (3GB) GDDR7 memory at 48 Gbps at ISSCC 2026
SK hynix is preparing to showcase 48 Gb/s 24 Gb GDDR7 DRAM at ISSCC 2026, targeting mid-range inference AI workloads. The conference program lists a paper titled "A 48Gb/s 24Gb GDDR7 DRAM for Mid-Range Inference AI with Symmetric 2CH-Mode Operation, Clock-Path Optimization, and RAS Features," which specifies both the speed and capacity goals for this new chip. These modules would deliver more than 70% higher per-pin bandwidth than the 28 Gbps GDDR7 used on NVIDIA's RTX 5090 cards, while also moving from 2GB to 3GB per package.
November 23, 2025Source

Tachyum Unveils TDIMM DDR5 Memory: Up To 1 TB Capacity Per DIMM & 5x Bandwidth Increase To 231 GB/s, DDR6 TDIMM's Proposed For 2028
Tachyum has announced its new and open-source TDIMM memory standard, offering big uplifts in bandwidth & high capacity per module.
November 23, 2025Source

Computer — Memory — November 23rd, 2025

Chinese CXMT to produce DDR5-8000 and LPDDR5X-10667 memory
ChangXin Memory Technologies (CXMT) has introduced its first DDR5 and LPDDR5X memory products at IC CHINA 2025, marking a new step for domestically produced DRAM in China. The company is targeting servers, desktops, laptops, and embedded devices with a full product stack while aiming to reduce dependence on overseas memory vendors.
November 23, 2025Source

Computer — Memory — November 22nd, 2025

LPDDR6 RAM To Remain Exclusive To Snapdragon 8 Elite Gen 6 & Dimensity 9600 Due To Price Hikes; Qualcomm, MediaTek Also Have Expensive Wafer Costs To Worry About
On top of paying TSMC a premium for utilizing its 2nm technology next year, Qualcomm and MediaTek now have to deal with surging DRAM prices as they prepare for the launch of the Snapdragon 8 Elite Gen 6 and Dimensity 9600 next year. A rumor states that thanks to increased LPDDR6 RAM prices, only flagship chipsets like the ones mentioned above will be treated to next-generation memory, but that is not expected to make things easier for either Qualcomm's or MediaTek's smartphone partners.
November 22, 2025Source

Computer — Memory — November 21st, 2025

A twist of light could power the next generation of memory devices
Researchers have discovered a way to store information using a rare class of materials called ferroaxials, which rely on swirling electric dipoles instead of magnetism or charge. These vortex-like states are naturally stable and resistant to outside interference, but until now were almost impossible to control. By using circularly polarized terahertz light, scientists were able to flip these tiny rotational patterns on command, opening the door to a new form of robust, ultrafast, and long-lasting data storage.
November 21, 2025Source

Computer — Memory — November 20th, 2025

SK Hynix Shares Next-Generation AI Memory Strategy and Roadmap at the SK AI Summit 2025
SK Hynix Shares Next-Generation AI Memory Strategy and Roadmap at the SK AI Summit 2025
November 20, 2025Source

Computer — Memory — November 14th, 2025

ADATA and MSI Launch the World's First 4-RANK DDR5 CUDIMM Memory Module
ADATA Technology, a global leader in memory and storage solutions, today announced the launch of the world's first ADATA High Capacity DDR5 4-Rank CUDIMM Memory Module, jointly developed with leading motherboard manufacturer MSI. This groundbreaking module features the innovative 4-RANK architecture, delivering an impressive 128GB per module and stable operation on the Intel Z890 platform, ushering in a new era of high-capacity and high-efficiency desktop memory.
November 14, 2025Source or Source or Source

Patriot Viper Xtreme 5 DDR5 Achieves 13,211 MT/s Speed Record
Patriot Memory, a global leader in high-performance memory and storage solutions, proudly announces a landmark achievement for its flagship Viper Xtreme 5 DDR5 DRAM, which has officially set a new world record for memory frequency, breaking past the 13,200 MT/s barrier for the first time in history.
November 14, 2025Source or Source

Samsung Reportedly Raising Memory Chip Prices by Up to 60% Amid Tight Supply
Samsung has reportedly raised prices for several DDR5 memory modules by up to 60% this month as supply tightens amid the global push to build AI data centers, according to two people familiar with the changes. The increases follow Samsung's unusual move to delay October contract pricing, which it normally sets each month. The jump in server-grade DDR5 costs is putting added pressure on hyperscalers and OEMs already short on parts.
November 14, 2025Source

Samsung's Rumored Memory Price Hike Could Be a 'Catastrophe' for PC Gamers, Potentially Driving RAM Prices to Unimaginable Levels
Samsung is rumored to announce a significant increase in its memory prices, marking one of the largest hikes, which means that consumer RAM may become even more expensive in the future.
November 14, 2025Source

Computer — Memory — November 13th, 2025

Memory Industry to Maintain Cautious CapEx in 2026, with Limited Impact on Bit Supply Growth
TrendForce's latest investigations reveal that despite higher ASPs boosting profitability across the memory industry, capital spending on DRAM and NAND Flash is only anticipated to increase modestly in 2026. This limited investment growth is unlikely to significantly affect bit output. Instead, the emphasis is shifting from capacity expansion to advancements such as process technology upgrades, higher-layer stacking, hybrid bonding, and high-value products such as HBM.
November 13, 2025Source

Memory makers have no plans to increase RAM production despite crushing memory shortages — 'modest' 2026 increase predicted as DRAM makers hedge their AI bets
No relief in sight for RAM buyers.
November 13, 2025Source

Renesas Unleashes Industry's First & Fastest DDR5 RCD, Enabling 9600 MT/s Speeds On RDIMM Modules
Renesas has just introduced the industry's first and fastest Gen6 DDR5 RCD for RDIMM modules, offering 9600 MT/s transfer speeds.
November 13, 2025Source

Computer — Memory — November 8th, 2025

DDR5 Overclocking World Record Broken Again; 13211 MT/s Using Z890 AORUS Tachyon ICE
Overclocker AiMax Achieves 13,211 MT/s Using Patriot Viper Xtreme 5 on GIGABYTE Z890 AORUS Tachyon ICE and Secures The Top Spot at the Leaderboard
November 8, 2025Source

Computer — Memory — November 7th, 2025

Samsung Prepares 10.7 Gbps LPDDR6 Memory Built on 12 nm Node
Samsung has developed its next-generation low-power LPDDR6 memory for mobile applications. Built on a 12 nm process, this LPDDR6 memory module achieves data rates of 10.7 Gbps. Engineers have increased the input/output channel count and introduced dynamic power tuning, which adjusts power consumption in real time based on workload demands. Samsung has also incorporated robust security features directly into the memory subsystem to ensure data integrity across all applications.
November 7, 2025Source

Computer — Memory — November 6th, 2025

SK hynix expects to launch DDR6 and GDDR7 successor after 2028
GDDR8 is likely on the horizon
November 6, 2025Source

Computer — Memory — November 5th, 2025

DDR5 Memory Is Now Twice As Expensive, 16 & 32 GB Prices Hit All Time High Across All Major Retailers
DDR5 memory prices have reached an all-time high, with several 16 GB & 32 GB kits now twice as expensive due to shortages in supply.
November 5, 2025Source

SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming
No, HBF will not replace DRAM.
November 5, 2025Source

Computer — Memory — October 30th, 2025

Innodisk Unveils Industry's First DDR5-7200 RDIMM Offering 64 GB per Module
Innodisk, a leading global AI solution provider, introduces the industry's first DDR5 7200 RDIMM as a major upgrade to its DDR5 series, delivering superior performance and the largest 64 GB single-module capacity in the industrial market, driving innovation across the embedded and edge AI segments.
October 30, 2025Source

Klevv's UBRANE V RGB DDR5 memory will soon be available in Jet Black
KLEVV's URBANE V RGB DDR5 Gaming/OC memory has won several awards since launch, including an iF Design Award. Now, this memory is available in a new colourway, offering up a Jet Black option for those seeking to build a stealthy rig.
October 30, 2025Source

RRAM-based analog computing system rapidly solves matrix equations with high precision
Analog computers are systems that perform computations by manipulating physical quantities such as electrical current, that map math variables, instead of representing information using abstraction with discrete binary values (i.e., 0 or 1), like digital computers.
October 30, 2025Source

Samsung Ships HBM4 Samples to Customers, Mass Production in 2026
Samsung has just reported its third quarter 2025 results, and the company has confirmed that its next-generation HBM4 memory samples has been shipped to customers worldwide, with mass production expected in 2026. "HBM3E is currently in mass production and being sold to all related customers, while HBM4 samples are simultaneously being shipped to key clients," notes Samsung, confirming that its memory business is thriving and advanced memory solutions are in great demand.
October 30, 2025Source

SK Hynix DDR5 Inventory Down To Just 2 Weeks!
Morgan Stanley is raising alarm bells around SK Hynix's rapidly depleting DRAM inventory, which is now at effective "sold-out" levels as the AI-driven demand for high-bandwidth memory (HBM) - a type of DRAM - continues to corner an ever greater proportion of the global memory wafer capacity.
October 30, 2025Source

Computer — Memory — October 24th, 2025

Micron begins sampling 192GB SOCAMM2 low-power memory for AI servers
Micron has announced sampling of its new SOCAMM2 memory modules, offering up to 192GB capacity per module based on LPDDR5X. These modules are designed for data center systems focused on AI workloads, where power efficiency and memory bandwidth are becoming core requirements. SOCAMM2 is an updated version of Micron's earlier SOCAMM design, now offering 50% more capacity within the same footprint.
October 24, 2025Source or Source

Computer — Memory — October 17th, 2025

G.Skill DDR5 reaches stable 10,600 MT/s on Ryzen 5 8500G with ASUS B850M‑AYW motherboard
While the official DDR5‑13 010 MT/s world record was set recently, it did not reflect a typical usage scenario. The test used a limited CPU core configuration, liquid‑nitrogen cooling for both processor and memory, and a single DIMM setup.
October 17, 2025Source

Micron is preparing to exit China's data center memory market completely, report claims — Beijing banned company's chips from 'critical information infrastructure' in 2023
US memory maker may curb data center shipments to mainland China amid ongoing fallout from 2023 cybersecurity ban.
October 17, 2025Source

Computer — Memory — October 13th, 2025

Next-gen MRAM breakthrough can flip bits at SRAM-rivalling speeds with low power consumption — researchers claim true next-gen breakthrough using Tungsten layer
Technology is compatible with existing semiconductor manufacturing methods.
October 13thSource

Computer — Memory — October 8th, 2025

A new method to build more energy-efficient memory devices could lead to a sustainable data future
A research team led by Kyushu University has developed a new fabrication method for energy-efficient magnetic random-access memory (MRAM) using a new material called thulium iron garnet (TmIG) that has been attracting global attention for its ability to enable high-speed, low-power information rewriting at room temperature. The team hopes their findings will lead to significant improvements in the speed and power efficiency of high-computing hardware, such as that used to power generative AI.
October 10, 2025Source

A new type of light-controlled non-volatile memory
Researchers achieved ultrafast, stable switching of ferroaxial states using polarized terahertz light, paving the way for next-gen data storage.
October 10, 2025Source

Samsung Expected to Power AMD's MI450 Accelerators with HBM4
Samsung will reportedly supply HBM4 memory for AMD's MI450 chips, following a new deal and AMD's partnership with OpenAI.
October 8, 2025Source

Computer — Memory — October 3rd, 2025

Gamers, this is the RAM you want in your PC
The variety of RAM on offer nowadays can make your head spin. But it's quite simple for PC gamers, currently only this certain RAM configuration makes sense.
October 3, 2025Source

Computer Memory — Miscellaneous

2020 Software Ltd.
Offers memory for PCs, notebooks and servers.
Provides ProductsSource

A Collection of Optimization Algorithms in Fortran
and a Collection of Fortran Subroutines.
Provides InformationSource

Centon Electronics, Inc
manufacturer and supplier of memory solutions for desktops, servers, printers, notebooks, embedded systems, and telecommunication devices.
Provides InformationSource

Century Microelectronics
specializes in manufacturing DRAM memory modules including EDO, SDRAM, DDR, Rambus, and more.
Provides ProductsSource

Crucial.com: Glossary of Memory Terms
offers a series of computer memory related terms and definitions.
Provides InformationSource

CST Inc,
Find out the most affordable way to test ram memory with memory tester and diagnostic software.
Provides ProductsSource

Datec Electronics
International traders of IT components including processors, graphics and video cards and more.
Provides ProductsSource

DDR-Memory.com
provides information about DDR-based products such as motherboards and video cards.
Provides InformationSource

EDGE Tech Corp
EDGE Tech Corp, an ISO 9001:2008-certified company founded in 1986, is a leading supplier of computer memory upgrades, portable computing products, storage devices, and other experience-enhancing technology solutions.
Provides ProductsSource

Empower Labs, Inc.
provides semiconductor IC trading services and design and manufacturing solutions for memory upgrade products.
Provides ProductsSource

Howstuffworks: Computer Memory
describes how all types of computer memory work.
Provides InformationSource

Kingston Technology
Manufacturer of memory products for desktops, notebooks, servers, and workstations.
Provides ProductsSource

MEMO Electronics
offers contactless memory modules for data storage under extreme conditions.
Provides ProductsSource

Memory Express
Specialist supplier of memory, processor upgrades for PCs and printers.
Provides ProductsSource

Memory for Less
Specializes in memory upgrades for over 10,000 models of Servers, Notebooks, Desktops printers.
Provides ProductsSource

Memory Suppliers
Providers of High Quality Memory at Great Prices for PCs, Macs, Laptops, Digital Cameras, and Printers.
Provides ProductsSource

MemoryX Computer
Distributor of memory for all major systems.
Provides ProductsSource

Micro Memory Bank, Inc.
designs, manufactures, and distributes computer memory modules for a wide range of computer systems.
Provides ProductsSource

Micron Technology
Manufactures of high-performance memory.
Provides ProductsSource

Minnesota Memory, Inc.
Offers memory on desktops, laptops, notebooks, servers, workstations and printers.
Provides ProductsSource

MoreMemory.com
Offers memory for name brand computer, and digital camera.
Provides ProductsSource

Mushkin Computer Memory
Offers memory from virtually every computer memory module.
Provides ProductsSource

OCZ Technology
Performance Computer Memory Manufacturer, High End, Lifetime Warranty, Direct Support, Memory Products.
Provides ProductsSource

Princeton Technology, Inc.
offering several types of computer memory modules for OEMs and resellers.
Provides ProductsSource

Rambus
has provided leading chip and system companies with chip-to-chip interface solutions that enable higher performance and system bandwidth for a broad range of consumer electronic, computing and networking applications.
Provides ProductsSource

Ramcheck Memory Testers
Memory Testers for SDRAM, DDR, RAM, DIMMS, and other computer memory devices, at affordable prices.
Provides a ServiceSource

Ramseeker
Tracks memory prices from over 50 memory vendors on 20 different memory types for the Apple Macintosh Computer.
Provides a ServiceSource

S.A. Technologies, Inc.
Memory for all PCs, MACs, Notebooks, Printers, Samplers, Fax Machines, RAID Controllers, Cameras and MP3 Players.
Provides ProductsSource

Smart Modular Technologies
manufactures computer memory modules, compact flash cards, voltage regulators, wireless communications devices, and wireline communication sub-systems.
Provides ProductsSource

Swissbit
in Switzerland has more than 12 years experience in development, design, manufacturing and testing of Memory Products.
Provides InformationSource

The Chip Merchant
Offers a wide variety of memory modules for all types of computers, printers and laptops.
Provides ProductsSource

The Memory Tester Company
Offers solution to memory module testing at affordable prices.
Provides ProductsSource

The PC Technology Guide
Outlines the components of the PCs memory architecture and the various memory types and packaging.
Provides ProductsSource

UniRAM Technology
designs, develops, and licenses memory solutions for system on a chip applications and stand alone memory products.
Provides a ServiceSource

Vanguard International Semiconductor Corp.
manufactures memory products.
Provides ProductsSource

Viking Components
offering memory for desktops, laptops, printers, enterprise systems, and a line of flash memory.
Provides ProductsSource

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