Computer — Processors — August 13th, 2026

Alphacool Unveils Apex 2 Thermal Grease
Alphacool International GmbH from Braunschweig is a pioneer in PC water cooling technology. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool now expands its lineup with the Apex 2 Thermal Grease. With the Apex 2, Alphacool introduces a new generation of its thermal grease. The completely revised formula was developed together with Halnziye for high-performance hardware and demanding cooling systems. Compared to its predecessor, the Apex 2 offers improved heat transfer, helping to reduce CPU and GPU temperatures.
August 13th, 2026 — Source

Qualcomm Claims Snapdragon C Crushes Intel N250 On Battery Power
Targeted at students, families, small businesses, and frontline workers, Snapdragon C aims to establish a new performance benchmark for entry-level devices. Under the hood, the 6nm chip features an 8-core Qualcomm Kryo CPU reaching up to 3GHz on a single core and 2GHz across multi-core workloads, supported by 2MB of cache.
August 13th, 2026 — Source

Ryzen 7 7800X3D swelling appears again despite updated AM5 BIOS
Ryzen 7 7800X3D burns and swells on updated MSI X870 motherboard
August 13th, 2026 — Source

Snapdragon C specs mean Qualcomm could eat Intel's lunch with budget laptops: Here's what we know (and what we still don't)
Qualcomm's new chips look great on paper, but can they beat Intel in the real world?
August 13th, 2026 — Source

Computer — Processors — August 12th, 2026

'Forgetful' AI semiconductor processes recent inputs without separate resets
For the first time, researchers have demonstrated that the "ability to forget" can serve as a new computational function for artificial intelligence.
August 12th, 2026 — Source

Intel Nova Lake 8P+12E reportedly keeps 36MB L3 cache despite E-core cutdown
Intel Nova Lake single-cluster E-core cutdowns may not lose L3 cache
August 12th, 2026 — Source

Intel Nova Lake Leak Says Cut-Down E-Core SKUs May Keep More L3 Cache
Intel's upcoming Nova Lake-S processors may retain more L3 cache than previously thought, according to a fresh update from leaker Jaykihn. The revised information says some SKUs created by disabling part of an E-core cluster will still retain the full L3 cache allocation of the corresponding fully enabled silicon. Intel has not confirmed any of these specifications. The most notable example is the reported 8P + 12E + 4 LP-E configuration, which is now said to carry 36 MB of L3 cache, rather than the previously expected 33 MB. That would give it the same native L3 capacity as the larger 8P + 16E + 4 LP-E configuration. A smaller 4P + 4E + 4 LP-E model is similarly said to retain 18 MB, up from an earlier expectation of 15 MB. The reported 6P + 12E + 4 LP-E configuration is an exception, with current information placing it at 27 MB of L3.
August 12th, 2026 — Source

Intel's Razor Lake-AX Surfaces In HWiNFO Support, Confirming Halo-Class SoC To Challenge AMD's Halo Around 2028
Intel's very own "Halo" SoCs are being prepped as next-generation Razor Lake-AX chips have received first support on HWiNFO.
August 12th, 2026 — Source

Lian Li Uni Fan Flex Series Uses Interlocking to Cut Cables
Lian Li's Uni Fan Flex series introduces a thoughtful approach to PC cooling, combining performance and aesthetics in a way that caters to diverse user needs. As highlighted by PC Centric, the series includes two distinct fan models: the TL fans, optimized for high-performance systems with exceptional airflow and the SL fans, which emphasize visual appeal with RGB lighting and an infinite mirror design. Both models feature an interlocking design that reduces cable clutter and simplifies installation, making them practical for users at any experience level. Additionally, the lineup is complemented by an OLED liquid cooler, which integrates a curved display for monitoring system stats and custom animations.
August 12th, 2026 — Source

Nova Lake CPUs with cut-down E-core clusters may still retain full cache pool, says new leak — 8P+12E config predictions revised from 33MB to 36MB, 4P+4E config from 15MB to 18MB
Not all SKUs are affected, however.
August 12th, 2026 — Source

Computer — Processors — August 9th, 2026

A new attack slips past the latest defenses built into your computer's processor
Chipmakers and operating system developers have spent years building defenses. A new study from MIT's Computer Science and Artificial Intelligence Laboratory (CSAIL) shows that a key assumption behind many of them doesn't hold.
August 9th, 2026 — Source

Intel Core Ultra 7 270K Plus versus AMD Ryzen 7 7700X3D faceoff — battle of the upper mid-range CPUs
Yet another closely fought battle.
August 9th, 2026 — Source

Intel Nova Lake desktop CPU with 12 Xe3P iGPU reportedly has 40W PL2 for graphics
Intel Nova Lake-S desktop chip with 12 Xe3P cores reportedly has 154W PL2
August 9th, 2026 — Source

Intel Says Linux Cluster Scheduling "Fails” on Its Hybrid CPUs -- The Fix Is Queued for 7.3
Cluster-aware load balancing has been quietly misfiring on Intel's P-core/E-core chips since it landed in 2021. A short patch series from Intel's own kernel team is now sitting in the scheduler tree.
August 9th, 2026 — Source

Intel Xeon 7 Diamond Rapids reportedly tops out at 256 P-cores
Intel reportedly cancels 512-core Diamond Rapids, flagship Xeon 7 gets 256 P-cores
August 9th, 2026 — Source

Modder pumps liquid directly over bare GPU silicon via 3D-printed block — drops RTX 2060 Super load temps to 28°C despite initial leaks
Custom 3D printed block was glued to the GPU so water went straight to the die.
August 9th, 2026 — Source

Owner of original Intel 8080 pre-production layout seeks restorer — handcrafted Rubylith mask shows 5,000 transistors and interconnect patterns of the fabled 2 MHz CPU
The same computing history artifact was previously pictured alongside Andy Grove, Robert Noyce, and Gordon Moore in 1978.
August 9th, 2026 — Source

Safe RET Interrupt Vulnerability Leaves a Two-Instruction Hole in AMD's Spectre v2 Defense
Two instructions of exposed window on Zen 2, one well-timed interrupt, and the kernel starts handing over its password hashes.
August 9th, 2026 — Source

Two variants of Nvidia's RTX Spark show up on Geekbench, revealing a cut-down 18-core model — Full 20-core beats most x86 mobile chips across multi-core and single-core tests
N1X is finally taking shape.
August 9th, 2026 — Source

Computer — Processors — August 8th, 2026

Hardware researcher spins up 'CPU deoptimization' project to find the slowest single x86 instruction, creates hall of shame — worst offender takes 198 billion cycles spanning 62 seconds to execute
Ironically, new advanced instruction sets could make for even slower commands.
August 8th, 2026 — Source

Modder Pumps Water Directly Onto RTX 2060 Silicon, Crashing Temperatures From 70°C To A Startling 28°C
In a wild experiment, we saw how this modder went from traditional heatsink to a direct water-cooling method to achieve very low temperatures.
August 8th, 2026 — Source

Taiwanese Retailer Won't Sell The RTX 5090 Alone, Forcing Buyers Into An $7,481 Eight-Motherboard Bundle
It can be difficult to purchase an RTX 5090 as a standalone product in some regions, which is why some retailers are now bundling these high-end GPUs with more products.
August 8th, 2026 — Source

Computer — Processors — August 7th, 2026

Amazon cracks down on 'CPU waste' among engineers as agentic AI crunch intensifies — CPU demand makes low-utilization EC2 instances a hot commodity
What used to take engineers a few hours can now take several days.
August 7th, 2026 — Source

AMD Buys Startup Taalas To Bake AI Models Straight Into Silicon
AMD is making a big bet on the future of AI hardware. The Santa Clara chip designer announced it has reached a definitive agreement to acquire Toronto-based startup Taalas, a company taking an unconventional approach to inference by burning AI models directly into custom silicon.
August 7th, 2026 — Source

Anthropic co-designing custom AI inference chips to bypass costly Nvidia GPUs — Samsung reported as manufacturing partner for Claude maker
It joins Amazon, Meta, OpenAI, and Google with its new "multi-chip" strategy.
August 7th, 2026 — Source

Anthropic Is Paying Nearly A Million Dollars Per Year To The Engineers Teaching Its AI Models To Design A Chip, But Just $320,000-$485,000 To Those Actually Building Its First ASIC
I guess we are in an era where the zeitgeist is not to teach the man how to fish, but the AI model, ensuring that the AI lab - Anthropic in this case - would then nosh on a lifetime's worth of customized silicon chips.
August 7th, 2026 — Source

'Chameleon' chip adapts to changing data speeds, cutting prediction errors by up to 40-fold
AI semiconductors are becoming more programmable. KAIST researchers have developed a device whose response characteristics can be programmed to process data that changes at different speeds. The technology reduced prediction errors for time-varying data by up to 40-fold and is expected to enhance real-time AI performance in autonomous vehicles, robots and wearable devices.
August 7th, 2026 — Source

Intel Diamond Rapids Xeon ES Appears With 32 Cores, 240MB Cache and 18A-P Silicon
An Intel Diamond Rapids Xeon engineering sample has appeared in SiSoftware's benchmark database, providing an early indication that the next server architecture is operational on Intel's enhanced 18A-P manufacturing process. The detected processor contains 32 cores and 64 threads. Its cache configuration reportedly includes 4MB of L1, 64MB of L2 and 240MB of L3. The unusually large L2 allocation is consistent with Intel's continuing emphasis on per-core cache and memory performance for server workloads. Clock speeds are low, as expected from early silicon.
August 7th, 2026 — Source

Noctua Warns PC Builders That Cooler Clearance Specs Can Lie
Building a PC is not difficult, but it does require a series of checks for compatibility, including size and space constraints. This is especially true for small form factor (SFF) or mini-ITX builds. When it comes to cooling, whether a high-performance cooler clears the side panel or presses against the glass usually depends on the "Maximum CPU Cooler Height" printed on the case manufacturer's spec sheet, but according to Noctua, those official numbers are not always reliable.
August 7th, 2026 — Source or Source

Ocypus Omega L36 Ultra AIO Uses a Motorized Display and Deployable VRM Fan
Ocypus has listed a limited engineering edition of its Omega L36 Ultra liquid cooler featuring a motorized pump-cover assembly. During low-load operation, the screen and fan assembly remain in a lowered position and the dedicated VRM fan stays inactive. When the CPU reaches a configurable temperature threshold, the display rises, a metal airflow guide deploys and the auxiliary fan begins directing air around the socket. The mechanical movement is primarily a visual feature, but it also creates clearance for the airflow path. This makes the product more elaborate than fixed LCD pump covers or conventional top-down fans.
August 7th, 2026 — Source

RTX Spark With 20-Core CPU Closes Multi-Core Performance Gap With 14-Core M4 Max; New Leak Shows NVIDIA's ARM-Based SoC Is 11% Slower
Prior to NVIDIA's official announcement of the RTX Spark, the chip named N1X showcased some disappointing single-core and multi-core scores on Geekbench 6, failing to beat Apple's older-generation M3 Max. Fortunately, a fresh leak shows some improvements from the ARM-based silicon, as it's managed to narrow the multi-core performance gap with Apple's 14-core M4 Max.
August 7th, 2026 — Source

TSMC & Researchers Make Big Breakthrough In Chip Transistor Technology As Part Of Push Towards Developing Sub-1-nanometer Technologies
The Taiwan Semiconductor Manufacturing Company (TSMC), in partnership with the National Yang Ming Chiao Tung University (NYCU) in Taipei, Taiwan, has made a key breakthrough for next-generation transistor design. TSMC and the NYCU have demonstrated that instead of focusing on depositing new materials on the transistor channel, a better approach is to engineer the channel material to create a buffer before adding the insulating material and then the gate to control the electron flow across the transistor.
August 7th, 2026 — Source

Computer — Processors — August 5th, 2026

Chieftec Announces Iceberg PRO Series All-in-One Liquid CPU Coolers
Chieftec is excited to introduce the Iceberg PRO Series, our new flagship 360 mm all-in-one CPU liquid cooler, available in both ARGB and Black editions. Unlike conventional AIO coolers, the Iceberg PRO features an integrated centrifugal VRM fan that actively cools surrounding motherboard components, including VRMs, M.2 SSDs and RAM, helping maintain lower temperatures and stable performance under heavy workloads.
August 5th, 2026 — Source

Frore claims its LiquidJet can drop Nvidia Rubin GPU temperatures by 10°C — can also boost performance by 15% as hyperscalers eye using delidded GPUs in production environments
It is not a secret that proper cooling ensures longevity and enables hardware to demonstrate its full potential. But when it comes to data center AI hardware, proper cooling also means higher sustained performance, which directly translates into money earned by the owner. Frore Systems, a maker of cooling solutions that are made using semiconductor-grade tools, seems to have a perfect idea of how to reduce the temperature of next-generation AI accelerators and increase their performance by 15%.
August 5th, 2026 — Source

Computer — Processors — August 3rd, 2026

IBM Targets a 200-Logical-Qubit Processor for 2029 Launch
Quantum computing in 2026 stands at a fantastic crossroads, with fault-tolerant quantum computing (FTQC) emerging as a critical focus. This year has seen a shift from simply increasing physical qubits to developing error-corrected logical qubits, a necessary step for reliable and scalable quantum systems. Explaining Computers highlights how companies like IBM and Google are advancing superconducting qubit technologies, while alternative approaches such as photonic, silicon spin and neutral atom qubits are gaining traction. These developments underscore the diverse strategies being pursued to overcome challenges like error correction and scalability, bringing practical quantum applications closer to reality.
August 3rd, 2026 — Source

TSMC Approaching A New Milestone With Its 2nm Process By The End Of 2026 With 100,000 Monthly Wafers; NVIDIA, AMD, & Others Force Manufacturing Acceleration
AI customers will eventually move their orders towards TSMC's 2nm process in droves to target higher inference performance while utilizing less power to reduce the datacenter footprint. This demand surge has already forced the biggest semiconductor manufacturer in the world to make production adjustments for its lucrative customers, with a new report stating that NVIDIA, AMD, and others will push TSMC towards achieving that 100,000 monthly wafer milestone by the end of 2026.
August 3rd, 2026 — Source

Computer — Processors — July 31st, 2026

30 years of CPUs at Tom's Hardware — looking back on three decades of processors, from the Pentium II to Ryzen 9 9950X3D2
We've been covering CPUs for a long time. It's time to zoom out for some perspective.
July 31th, 2026 — Source

Modder der8auer builds 110cm 3D-printed chimney to passively cool Ryzen 7 9800X3D without fans, cuts temps by 19C — radically simple PC mod uses the 'stack effect'
Intensifying natural buoyancy.
July 31th, 2026 — Source

Computer — Processors — July 29th, 2026

Huawei's AI Chips Lack Differentiation And Face Global Market Penetration Hurdles, But A Focus On Glass Substrates Could Ignite Its Fortunes
China's AI chip market is dominated by Huawei, but that's mainly due to NVIDIA's lack of presence in the region, not due to the company's technological prowess. However, a new report states that the former Chinese smartphone giant plans to adopt glass substrates much sooner, making it a global player that could challenge other entities and slowly tilt the leadership race towards China.
July 29th, 2026 — Source

Intel Core i9-14901KE Prototype Reaches 7.4GHz Under Subzero Cooling
A qualification sample of Intel's abandoned Core i9-14901KE has been tested under conventional and subzero cooling. The unusual Raptor Lake processor contains eight Performance cores, sixteen threads and no Efficient cores. Intel briefly listed the model during 2024 before removing its product page. The specification included a 3.8GHz base clock, 5.8GHz maximum boost, 36MB combined cache and 125W processor base power. Unlike the related 14901E and 14901TE embedded models, the KE variant has an unlocked multiplier.
July 29th, 2026 — Source

Intel Nova Lake desktop APU with 12 Xe3P graphics reportedly needs 65W power tier for full performance
Intel's 12 Xe3P Nova Lake desktop chip may require a 65W power tier
July 29th, 2026 — Source

Intel Nova Lake-S APU With 12 Xe3P Cores Will Reportedly Require 65W For Full Performance
One of the Nova Lake SKUs with a specific configuration will operate at up to 65W to unlock full performance.
July 29th, 2026 — Source

Intel's upcoming Nova Lake desktop SKU to require 65W of separate power delivery for its iGPU, leaker claims — beefy integrated graphics could require two VCCGT phases for 12 Xe3P cores
One VCCGT phase can usually sustain up to 30W safely.
July 29th, 2026 — Source

Noctua NL-LC1-36 Liquid CPU Cooler Review
Noctua's NL-LC1-36 AIO brings near-silent cooling, premium build quality, and Asetek hardware to a 360mm liquid CPU cooler for Intel and AMD.
July 29th, 2026 — Source

Computer — Processors — July 27th, 2026

AMD splits Zen 7 into three EPYC families for 2028 and starts selling server CPUs by the agent — Florence, Ferrara, and Fidenza to be applied across AI-focused product stack
Florence, Ferrara, and Fidenza reverse the single-stack approach AMD took with Zen 5.
July 27th, 2026 — Source

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A
Cadence's AI-driven digital and custom reference flows, tools, and solutions are now certified on Intel 18A-P and Intel 14A technologies, based on the latest Intel Foundry process design kits (PDKs). Building on the companies' recent expansion of design IP optimized for Intel 18A and 18A-P and their multi-year Design Technology Co-Optimization (DTCO) agreement targeting Intel 14A, this new certification provides customers with a signoff-ready path to deploy advanced AI, high performance computing (HPC), and mobile SoCs on Intel Foundry's leading-edge nodes.
July 27th, 2026 — Source

Genesis chip may help AI with its memory problem
One of artificial intelligence's most stubborn problems is enabling AI systems to accumulate new knowledge without losing what they previously learned. A team of researchers at the MATRIX AI Consortium at The University of Texas at San Antonio may have solved this issue with Genesis, a spiking neuromorphic accelerator chip that would enable on-device continual learning throughout its operational lifetime.
July 27th, 2026 — Source

Intel unveiled its iconic Core 2 Duo family 20 years ago — legendary chip dethroned AMD Athlon, restoring the chipmaker's performance lead
Team Blue crowed these efficient 65nm CPUs were "simply the best processors in the world” and reviewers tended to agree.
July 27th, 2026 — Source

NVIDIA Harnesses Vera CPU to Speed Up Design of Next-Generation CPUs and GPUs
The complexity of modern chip design continues to grow as engineering teams work to develop increasingly sophisticated CPUs, GPUs and AI systems. To help meet that challenge, NVIDIA is collaborating with industry leaders Cadence and Synopsys to optimize critical electronic design automation (EDA) applications for the NVIDIA Vera CPU. NVIDIA is now deploying Vera across EDA workflows used to develop its next generation of CPUs and GPUs, demonstrating how high-performance CPU architecture can help accelerate some of the industry's most demanding engineering workloads.
July 27th, 2026 — Source

NVIDIA Is Building Its Next Chips On Vera CPUs — And Verification Got 1.5x Faster
The Arm server CPU NVIDIA sells to everyone else is now grinding through the regression runs for the chips that will replace it.
July 27th, 2026 — Source

NVIDIA's Vera CPU Slashes Chip Verification Times at Cadence and Synopsys by 1.5x, Speeding Next-Gen Silicon
NVIDIA accelerates next-gen CPU and GPU chip designs with its Vera CPUs, delivering a 50% boost to improve system-level processes.
July 27th, 2026 — Source

Computer — Processors — July 24th, 2026

AAEON Prioritizes Durability with the Release of New COM Express Type 6 Modules
Leading provider of Computer-on-Modules AAEON today introduced the COM-TWLC6 Rev.B, COM-ASLC6 Rev.B, and COM-ADNC6 Rev.B COM Express Type 6 modules, powered by Intel Atom and Processor N-series CPUs.
July 24th, 2026 — Source

AMD Details Epyc Venice Zen 6 Server CPUs at Advancing AI Event
Up to 192 Zen 6 cores, or up to 256 Zen 6c in a high core density configuration.
July 24th, 2026 — Source

AMD EPYC Venice-X Gets 96 Zen 6 Cores, 1.15GB 3D V-Cache and 5.15GHz Boost
AMD has disclosed the first substantial specifications for Venice-X, the high-performance computing derivative of its sixth-generation EPYC processor family. Scheduled for the second half of 2027, Venice-X combines 96 Zen 6 cores with 1,152MB of L3 cache and boost frequencies reaching 5.15GHz. The processor is designed principally for high-performance computing workloads that benefit from large caches and strong per-core performance. Typical examples include computational fluid dynamics, electronic design automation, structural analysis, scientific simulation and other workloads that repeatedly access large datasets. Venice-X has the same 96-core count and 1,152MB cache capacity as the previous EPYC 9684X Genoa-X flagship. Its distinguishing feature is clock speed.
July 24th, 2026 — Source

AMD exec was 'very happy' to see Nvidia's Vera performance results -- 'I actually thought we were beating them by smaller numbers'
Although the industry has largely learned to move out of the way when the big green giant that is Nvidia steps into the room, one AMD executive said he was "very happy" to see Nvidia publish SPEC CPU 2026 benchmarks for its Vera CPU ahead of the Advancing AI 2026 event. AMD used the configuration in Nvidia's white paper as a basis to run SPEC on its new Zen 6 'Venice' CPUs, offering what it calls an "apples-to-apples" comparison between the two chips.
July 24th, 2026 — Source

AMD Maps EPYC and Instinct Generations Through 2030 With Zen 8
AMD has extended its server processor roadmap through 2030 while outlining annual Instinct accelerator updates through 2028. Presented at the end of Advancing AI 2026, the schedule introduces several CPU, accelerator, networking and rack-system codenames that will follow the current EPYC Venice and Instinct MI400 generation. The seventh-generation EPYC family is scheduled for 2028 and will use Zen 7 and Zen 7c CPU cores.
July 24th, 2026 — Source

AMD reveals CPU architecture roadmap through 2028, following Zen 6 'Venice' launch — Zen 7 'Florence' to debut in 2028 alongside diversified product family, confirms Zen 8 'Ravenna' in development
AMD has announced its long-term CPU roadmap, including multiple generations of its Zen microarchitecture at its Advancing AI event. Much of the event was focused on the new 256-core EPYC 9996 sporting the Zen 6 architecture, as well as Venice-X, which is slated to arrive next year. But AMD also teased a Zen CPU roadmap going out to Zen 8.
July 24th, 2026 — Source

AMD working on new X3D V-cache mobile chip for gaming laptops, leaker claims — Ryzen 7 9800HX3D could launch with 8 cores, 16 threads, and 96MB cache
A mobile Ryzen 7 9800HX3D may be coming.
July 24th, 2026 — Source

ASUS Accelerates Enterprise AI at Scale with 6th-Gen AMD EPYC Server CPUs
ASUS today announced its groundbreaking new server lineup powered by the AMD EPYC 9006 processors, engineered to deliver unmatched performance for the most demanding intensive enterprise workloads. This advanced portfolio introduces two highly optimized series with efficiency-optimized AMD EPYC SP8 server CPU, the flagship dual-socket ASUS RS700A/720A for extreme compute density and the single-socket ASUS RS500A/520A for superior space efficiency and deployment flexibility.
July 24th, 2026 — Source

Intel 14A Node Goes Into Risk Production in 2H 2027, Volume Production in 2028
Intel reported one of its largest quarterly growth results last night, with Q2 2026 revenue reaching $16.1 billion and generating strong cash flow. However, a key highlight from the company's earnings call was the discussion about the 14A node and its production schedule. According to Intel's CEO, Lip-Bu Tan, "With encouraging progress from external customers and increased demand for our internal products, we remain on track for 14A risk production for our internal products in the second half of 2027. We decided in Q2 to fully commit to a high-volume ramp in 2028."
July 24th, 2026 — Source

Intel commits to 14A mass production in 2028 as its sales rise 25% year-over-year
Intel on Thursday published its financial results for the second quarter of 2026, posting revenue of $16.1 billion — a 25% rise year-over-year — amid high demand for client and data center products. The company also said that due to extraordinary demand for its own CPUs, it will initiate mass production using its 14A (1.4nm-class) fabrication technology in 2028, which is in line with TSMC's plans for its A14 process technology.
July 24th, 2026 — Source

Intel Confirms HyperThreading Returns Starting With Coral Rapids In 2028
Hyper-Threading is what Intel calls its implementation of what is more academically known as "Simultaneous Multi-Threading" (SMT). This describes a method where a single processor core can interleave processing of two or more separate program threads, usually delivering an overall performance uplift on multi-threaded tasks. Intel killed off Hyper-Threading in its consumer CPUs with the Core Ultra 200 series, and the next-generation "Diamond Rapids" CPUs, the Xeon 7 family, won't have it either.
July 24th, 2026 — Source

Intel Confirms SMT Will Return with Coral Rapids Xeon CPUs in 2028
Intel will restore simultaneous multithreading to its server processor lineup with Coral Rapids, the architecture expected to power the Xeon 8 generation in 2028. CEO Lip-Bu Tan confirmed the plan while discussing Intel's upcoming Clearwater Forest, Diamond Rapids and Coral Rapids products. According to Tan, the company is working to improve both single-threaded and multithreaded performance, with hardware multithreading returning in Coral Rapids. Intel has gradually reduced its use of Hyper-Threading rather than removing it from every product at once. The hybrid architecture introduced with 12th-generation Core processors retained Hyper-Threading on the larger Performance-cores, while the smaller Efficient-cores processed one software thread each.
July 24th, 2026 — Source

Intel Reaffirms: Multithreading Returns in 2028 with "Coral Rapids"
In recent years, Intel has shifted away from traditional multithreading in its CPU core designs. This change began with the 12th-Gen Core CPUs when Intel started moving away from Hyper-Threading. At the same time, the company transitioned to asymmetrical CPU designs, initially enabling SMT only on performance cores. On the consumer side, Intel completely abandoned Hyper-Threading with the Core Ultra 200 series but still maintains it in the P-Core Xeon 6 "Granite Rapids" CPU family, which features up to 128 P-Cores and 256 threads.
July 24th, 2026 — Source

Jonsbo CR-3000V2 Combines Dual Towers With Six Direct-Touch Heatpipes
Jonsbo has introduced the CR-3000V2, a dual-tower processor air cooler available with either a black or white finish. The model combines two aluminum fin stacks, six direct-touch heatpipes, two differently tuned 120 mm fans, and an illuminated infinity-mirror top cover. The assembled cooler measures 120 × 135 × 160 mm. Its 160 mm height means that it should fit many conventional mid-tower cases, although clearance should be checked carefully in narrower enclosures. Jonsbo specifies support for memory modules measuring up to 44 mm tall.
July 24th, 2026 — Source

MiTAC Computing Advances Agentic AI Infrastructure with 6th Gen AMD EPYC Server CPUs
MiTAC Computing Technology Corp., a global leader in high-performance, energy-efficient server solutions and a subsidiary of MiTAC Holdings Corporation (TWSE:3706), is highlighting its latest agentic AI infrastructure at AMD Advancing AI. MiTAC's showcase focuses on its premier exhibition lineup, featuring its latest liquid-cooled and air-cooled AI servers and next-generation multi-node platforms built on the new 6th Gen AMD EPYC Server CPUs. As part of the launch, MiTAC is introducing a portfolio of next-generation platforms designed to help customers scale AI, cloud, HPC and enterprise workloads with greater performance, efficiency and flexibility.
July 24th, 2026 — Source

Computer — Processors — July 23rd, 2026

AMD and Cerebras partner on low-latency, high-throughput AI inference — EPYC processors in Helios rack-scale infrastructure paired with Cerebras' Wafer-Scale Engine (WSE) solutions
AMD and Cerebras Systems on Thursday announced plans to develop a platform that would combine AMD's EPYC processors in Helios rack-scale infrastructure with Cerebras' Wafer-Scale Engine (WSE) solutions. Together, the new systems promise to combine low latency of AMD's CPUs and Instinct GPUs with high throughput of Cerebras's Wafer Scale Engines (WSE) processors.
July 23rd, 2026 — Source or Source

AMD Announces 6th Gen EPYC Server Processors Powered by "Zen 6" Microarchitecture
AMD today announced the 6th Gen EPYC "Venice" server processors powered by the "Zen 6" CPU microarchitecture. The family includes a set of four distinct product lines, the EPYC 9006 (Socket SP7) for mainline servers with market leadership in core-counts and performance; the EPYC 9006 (Socket SP8) for enterprises with optimized performance per node; EPYC 9006X SP7 for high performance computing accelerated by larger CPU caches; and the EPYC 9006 LP "Verano" processors for AI host nodes powered by LPDDR memory.
July 23rd, 2026 — Source

AMD EPYC 9006 LP is the Company's Answer to NVIDIA Vera CPU
AMD EPYC 9006 "Venice-LP" is a purpose-built enterprise processors for rack-scale AI solutions. It is designed with the exact same system philosophy as NVIDIA's Grace and Vera CPUs—to handle serial processing loads and the OS stack for AI GPU servers with bandwidth-heavy network stacks. While NVIDIA uses specialized Arm CPU cores, AMD remains an x86 loyalist, and designed "Venice-LP" around its latest "Zen 6" microarchitecture.
July 23rd, 2026 — Source

AMD EPYC 9006 (Venice) Server CPUs Announced - Scale to 256 Zen 6 Cores
AMD has formally detailed the sixth-generation EPYC 9006 server processor portfolio at Advancing AI 2026. The range includes models for dense CPU computing, general enterprise servers, high-performance computing and host nodes used in GPU-accelerated AI systems. At the top of the portfolio is the EPYC 9006 SP7 platform, offering configurations with as many as 256 cores and 512 threads. AMD expects the highest-core-count models to be used for densely consolidated services, virtual machines, containers and isolated environments in which AI agents can execute code and coordinate tasks.
July 23rd, 2026 — Source

AMD EPYC Venice CPUs Stomp NVIDIA's Vera With 20% Faster Single-Core & 2.2x Higher Throughput With Up to 256 "Zen 6" Cores, 203 Billion Transistors & Over 5 GHz+ Clocks
AMD has officially launched its EPYC Venice CPU family, spanning several chips, with performance leadership in Agentic AI with Zen 6 cores.
July 23rd, 2026 — Source

AMD EPYC Verano "Highest Frequency" & Venice-X "3D V-Cache" CPUs Launch Next Year, Tackling Agentic AI & HPC-Oriented Workloads With Zen 6
AMD has confirmed that its EPYC Verano and 3D V-Cache boosted Venice-X CPUs will launch next year as Zen 6 tackles a broad range of HPC & AI workloads.
July 23rd, 2026 — Source

AMD Says It Now Controls Nearly Half Of The Data Center CPU Market, And Its Total Compute TAM Will Reach $2 Trillion By 2030
AMD is predictably cheerful about its AI-boosted prospects, declaring in a decidedly sunny tone that it now controls nearly half of the data center CPU market, as its compute-related Total Addressable Market (TAM) scales to a whopping $2 trillion by 2030.
July 23rd, 2026 — Source

AMD Ships Helios AI Rack With EPYC 9006 CPUs, Instinct MI400X GPUs And More At Advancing AI 2026
Today's the day AMD is launching its Zen 6 processor architecture. However, unlike all previous new Zen core launches, this time around it's coming to servers first in the form of the EPYC 9006 series of CPUs. That's not all, though. AMD is also launching both the Instinct MI400 family of GPUs as well as the Helios rack-scale AI solution that wraps both EPYC and Instinct up into an extremely powerful rack-scale package.
July 23rd, 2026 — Source

AMD's 256-core Epyc 9996 'Venice' claims up to a 3.4x jump over Intel Xeon competition, 20% over Nvidia Vera -- Zen 6 comes with up to 1024MB of L3, 16-channel memory, and 5GHz+ clock speeds
AMD is finally providing some details on its first Zen 6 CPU, which it has been teasing for over a year. The Epyc 9996 is a 256-core / 512-thread chip, packing AMD's new Zen 6 architecture, and it's the first to launch in what AMD describes as a "broad portfolio" for Venice. In addition to claiming significant performance advantages over the impending Nvidia Vera and Intel's Xeon 6, AMD says it will continue to build out the Venice range with bespoke designs over the next year.
July 23rd, 2026 — Source

AMD's Venice-X CPU launches in 2027 with 1152 MB of 3D V-Cache, 96 cores, and 5.15 GHz boost clock -- Zen 6 CPU for high-performance computing comes with major pillars of Venice
It's the same cache amount and core count as Genoa-X, but with far faster cores.
July 23rd, 2026 — Source

ASRock Rack Unveils Next-Generation Server Portfolio Powered by 6th Gen AMD EPYC Processors
ASRock Rack Inc., a leading innovative server company, today announced support for the newly-launched 6th Gen AMD EPYC 9006 Series processors, unveiled this week at AMD Advancing AI 2026 in San Francisco. ASRock Rack will showcase its upcoming server platforms optimized for the new processor generation at the event, demonstrating its commitment to delivering advanced infrastructure for enterprise AI, cloud, and HPC workloads.
July 23rd, 2026 — Source

Geekbench 7 Launches With New CPU Tests and Ryzen 7 7700 Baseline
Geekbench 7 has officially launched as the newest stable release of the cross-platform CPU benchmarking tool, which last saw a full release in 2023 with Geekbench 6. It is available for download for Android, iOS, Linux, macOS, and Windows, and the release notes detail a handful of new benchmarks that have been added to measure more diverse workloads.
July 23rd, 2026 — Source or Source

Giga Computing Accelerates Enterprise AI at Scale with 6th Gen AMD EPYC Server CPUs
Giga Computing, a subsidiary of GIGABYTE, is a global provider of advanced computing solutions that power the next generation of HPC, AI inference, 5G/edge, and cloud computing, today announced support for 6th Gen AMD EPYC Server CPUs across its server lineup, further expanding its portfolio of systems designed for demanding workloads. Now, at AMD Advancing AI 2026 in San Francisco, Giga Computing is debuting its first server for the new AMD EPYC 9006 platform.
July 23rd, 2026 — Source

Intel and AMD sign long-term server CPU deals with Chinese customers as prices jump over 40%, report claims — agreements purportedly guarantee purchase volumes for about a year without fixing prices
Intel and AMD are signing longer-term purchase commitments with Chinese server customers for data center processors, according to a new Reuters report that cites two people familiar with the talks. Prices for some server CPU products in China have climbed more than 40% since the start of the year and are still rising by over 10% month-on-month in some cases, one of the people said. Most of the agreements guarantee purchase volumes for about a year without fixing prices, and neither company responded to the publication's requests for comment.
July 23rd, 2026 — Source or Source

Nvidia reveals Vera CPU details, claims its custom Olympus cores outperform AMD Epyc Turin
The 88-core Arm chip boasts up to 1.8x the performance in select agentic AI workloads
July 23rd, 2026 — Source

OWC Announces OWC Express 4M2 Ultra Thunderbolt 5 NVMe RAID Solution
Other World Computing (OWC), a trusted leader in high-performance storage, memory, connectivity, software, and accessories that empower creative and business professionals to maximize performance, enhance reliability, and streamline workflows, today announced the launch of its OWC Express 4M2 Ultra, the fastest compact ready-to-run Thunderbolt 5 NVMe RAID solution, in 4 TB, 8 TB, 16 TB, and 32 TB capacities.
July 23rd, 2026 — Source

Supermicro Introduces New Server Portfolio with 6th Gen AMD EPYC 9006 Series CPUs, Delivering 1.7x Generational Performance Improvements
Super Micro Computer, Inc., an AI, Enterprise, Storage, and 5G/Edge Total IT Solution Provider featuring Data Center Building Block Solutions (DCBBS), today announced its next-generation H15 server portfolio powered by 6th Gen AMD EPYC 9006 Series CPUs, optimized for next generation GPUs including AMD Instinct, and connected by AMD Pensando networking. With up to 256 cores and 512 threads, H15 systems meet the growing compute demands of cloud, enterprise, storage, high-performance computing (HPC), and agentic AI workloads. With breakthrough 1.7x generational CPU performance improvement1, expanded memory and I/O bandwidth, and industry-leading compute density, customers are now able to run more concurrent AI agents, accelerate enterprise applications, and maximize host-node performance while operating within existing power envelopes.
July 23rd, 2026 — Source

Thermalright expands Royal Pretor lineup with display-equipped air coolers
Thermalright has expanded its CPU cooling lineup with the introduction of the Royal Pretor 130 Vision and Royal Pretor 130 Digital dual-tower air coolers. Both models build upon the existing Royal Pretor 130 design by adding integrated top-mounted displays for real-time hardware monitoring and customisation.
July 23rd, 2026 — Source

Computer — Processors — July 22nd, 2026

AMD Launches Zen 6 With EPYC "Venice" — 256 Cores on TSMC 2nm
AMD's first Zen 6 silicon is a server part, and it arrives with a core count nobody else can currently match.
July 22nd, 2026 — Source

AMD reveals EPYC Venice layout with 256 Zen 6 cores and two I/O dies
AMD EPYC Venice banner confirms 16-core CCXs and 32-core CCDs
July 22nd, 2026 — Source

AMD Ryzen 7 7700X3D Review
AMD is not finished with Zen 4 just yet. The Ryzen 7 7700X3D is the company's latest 3D V-Cache-enabled processor, arriving four years after the first Zen 4 desktop CPUs and three years after the launch of the now-legendary 7800X3D.
July 22nd, 2026 — Source

AMD's Zen 6 EPYC Venice Pictured as a 256-Core Monster, Massive Twin I/O Dies & First 2nm HPC Chip To Enter Volume Ramp
AMD has showcased its next-generation EPYC Venice CPU at the Advancing AI event, featuring a phenomenal core count of 256 based on Zen 6.
July 22nd, 2026 — Source

NVIDIA Details Vera Arm CPU Featuring New Olympus Core and 3.4 TB/s Fabric
NVIDIA has shared a comprehensive technical overview of its upcoming Vera processor, revealing the architectural design behind its new custom Armv9.2-based Olympus CPU core. The processor has been developed for enterprise computing, artificial intelligence, and large-scale data center deployments, where it can function independently or as part of NVIDIA's NVL rack-scale infrastructure alongside the company's GPU accelerators. The Olympus core introduces a significantly redesigned execution pipeline divided into four primary functional blocks: the front end, mid-core, execution engine, and cache subsystem. At the front end, NVIDIA employs a neural branch prediction engine working together with a 10-wide instruction decoder to keep execution resources supplied with instructions during workloads that frequently change execution paths. According to NVIDIA, this is particularly beneficial for AI runtimes, software compilation, large databases, and other enterprise applications characterized by unpredictable branching behavior.
July 22nd, 2026 — Source

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TSMC plans up to 10% price increases on advanced and mature nodes starting in 2027
Price hikes could affect 7nm chips as well as older 12nm, 16nm, and 28nm nodes
July 22nd, 2026 — Source

Watch The AMD "Advancing AI 2026" Event Live Here -- Next-Gen Zen 6 EPYC CPUs, Instinct MI400 Series & Helios AI Rack Launch
AMD's Advancing AI 2026 event will be the center stage for the company's next-gen AI portfolio, which includes Zen 6 EPYC and the Instinct MI400 series, powering the Helios AI rack.
July 22nd, 2026 — Source

Computer — Processors — July 16th, 2026

Alphacool Unveils New CPU+VRM Monoblocks for MSI, GIGABYTE, and ASUS
Alphacool International GmbH from Braunschweig is a pioneer in PC liquid cooling technology. With one of the industry's most comprehensive product portfolios and over 20 years of experience, Alphacool is once again expanding its lineup with new Apex Monoblocks. The Monoblocks combine outstanding cooling performance with an elegant design precisely tailored to each compatible motherboard. In addition to the CPU, the voltage regulators (VRMs) and the M.2 NVMe SSD located below the CPU socket are actively cooled, providing comprehensive liquid cooling for all key thermal zones of the motherboard.
July 16th, 2026 — Source

AMD Prepares For Ryzen AI MAX PRO 400 Launch With ROCm 7.14 Support
Team Red has laid the foundation for the upcoming Gorgon Halo Pro series before the chips arrive on the market officially.
July 16th, 2026 — Source

AMD ROCm 7.14 adds Gorgon Halo support before Ryzen AI Max PRO 400 systems launch
Ryzen AI Max PRO 400 gets ROCm support before HP and Lenovo systems arrive
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D
The "new" Ryzen 7 7700X3D is between 4% and 7% slower than the 7800X3D, depending on the game and test conditions. Given that it clocks up to 10% lower in core-heavy workloads, a performance reduction of around 7% in CPU-limited gaming scenarios is a reasonable expectation.
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D 4.5 GHz "3D V-Cache" CPU Review: The Budget X3D Champ For AM5
AMD's AM5 platform has been a solid entry, featuring some of the best chips on the market and a wide variety of entry-level and high-end options to select from.
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D is exclusive to Newegg in North America — $329 CPU won't be available at other vendors until at least Q4
Not exactly the best value.
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D review
AMD's X3D processors have steadily become the benchmark for gaming performance, but they have traditionally occupied the upper end of the company's desktop lineup. With the introduction of the Ryzen 7 7700X3D, AMD is changing that strategy by bringing its first-generation 3D V-Cache technology to a significantly lower price point. Launching at $329, the Ryzen 7 7700X3D is designed to lower the barrier to entry for enthusiasts who want the gaming advantages of the X3D family without investing in the more expensive Ryzen 7 7800X3D or newer Ryzen 9000-series processors.
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D Review Roundup
AMD has lifted the review embargo for the Ryzen 7 7700X3D, and the first independent tests are now available. The new eight-core Zen 4 processor brings 3D V-Cache to a lower price point within the AM5 lineup.
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D review: A slower 7800X3D, but not necessarily a cheaper one
$330 is too expensive when the 7800X3D is already approaching that price.
July 16th, 2026 — Source

AMD Ryzen 7 7700X3D Review: Zen 4 in 2026?!
When AMD announced the Ryzen 7 7700X3D at Computex 2026 we were baffled. This CPU uses Zen 4 technology that launched early in 2022 and is slightly slower than the Ryzen 7 7800X3D that we reviewed in 2023. Furthermore it requires the use of DDR5 memory which currently sells for crazy high prices and that makes the idea of saving a small amount of money on your CPU fairly pointless. Wait until the end of the video and you will find there is a real kick in the pants.
July 16th, 2026 — Source or Watch Video

Popular AMD Ryzen 7800X3D just got a not-so-cheaper, and highly exclusive substitute
AMD launches new AM5-based Ryzen 7700X3D gaming processor, which should be slightly slower than the popular Ryzen 7800X3D.
July 16th, 2026 — Source

Computer — Processors — July 12th, 2026

Apple's failed self-driving car program left a legacy of powerful AI chips
The company is accelerating development of the M7 Ultra, which could support up to 1.5TB of RAM.
July 12th, 2026 — Source

Computer — Processors — July 11th, 2026

Redditor orders Ryzen 7 7800X3D, receives 9800X3D instead
Buyer pays $350 for Ryzen 7 7800X3D, gets 9800X3D
July 11th, 2026 — Source

Computer — Processors — July 10th, 2026

Intel Dunlow platform spotted with 28-core Nova Lake-S Xeon and LGA1954 socket
Intel Dunlow Xeon leak points to 28-core hybrid Nova Lake-S CPU
July 10th, 2026 — Source

Meta Starts Making Its Own AI Chips in September — and It's Coming for Nvidia's Cut
The MTIA silicon will never land in your gaming rig, but the scramble behind it is a big part of why your RAM costs what it does.
July 10th, 2026 — Source

While the U.S. flip-flops on chip sanctions, China is building its own chip supply market — export controls are creating conditions for a Sino-Russian chip trade alliance
07.13.2013
July 10th, 2026 — Source

Zen 6 Gets a Date: July 22 — and the Servers Grab It Before Your Ryzen Does
AMD has finally put a date on Zen 6, and it isn't the one enthusiasts were hoping for. The company will introduce its next-generation CPU architecture at the Advancing AI 2026 event in San Francisco on July 22 and 23 — but the first chip to carry it is a data-center part, not a Ryzen. CTO Mark Papermaster confirmed the schedule in an interview at the Paris AI Summit, and AMD's own event page now lists the two-day show.
July 10th, 2026 — Source

Computer — Processors — July 9th, 2026

AMD expands Ryzen 200 and Ryzen 100 with 11 Hawk Point SKUs
AMD adds Zen4 Hawk Point processors to Ryzen 100 series
July 9th, 2026 — Source or Source

AMD Revives Zen 2 With The Ryzen 7 4700LE, An 8-Core Chip That Drops Integrated Graphics
AMD Quietly Launches Zen 2-Based Ryzen 7 4700LE Processor With Up To 4.2 GHz Boost Clock; Reserved for OEM Only
July 9th, 2026 — Source

AMD Zen6 Medusa Point 10-core APU beats Ryzen AI 9 HX 370 in Geekbench by 22%
AMD Plum-MDS1 platform appears with faster 10-core Zen 6 APU benchmark
July 9th, 2026 — Source

New Chieftec Iceberg Pro 360 AIO series features interlocking fans and VRM cooling
Chieftec has introduced the Iceberg Pro 360 series, a new lineup of 360mm all-in-one liquid CPU coolers featuring an integrated centrifugal VRM fan built directly into the pump housing.
July 9th, 2026 — Source or Watch Video

Computer — Processors — July 8th, 2026

AMD's Next-Gen Medusa Point "10-Core" CPU Beats Strix "10-Core" By 29% In Single-Core & 22% In Multi-Core While Running At Just 2.0 GHz
AMD's Medusa Point "Zen 6" APUs have leaked out once again at Geekbench, showcasing even higher performance than earlier.
July 8th, 2026 — Source

AVX-512 Returns With Intel's Nova Lake — And the E-Cores Finally Get It Too
A Linux kernel patch quietly commits Intel to full 512-bit execution on both core types. Five years after Alder Lake killed it, the instruction set is coming home.
July 8th, 2026 — Source

Light-powered chip harvests energy, computes and senses chemicals in one stack
Most contemporary portable electronics, including laptops, smartphones and smart watches, are powered by batteries that need to be recharged daily or every few days. Over the past decade, however, some engineers have been exploring the possibility of developing battery-free electronic devices that autonomously derive electricity from renewable sources, such as sunlight, indoor lighting or heat.
July 8th, 2026 — Source

Nvidia touts Vera CPU's single-threaded performance as its agentic AI advantage, reveals next-gen 'Rigel' Arm CPU cores — frames chip as a 'max single-threaded CPU at scale,' not a parallel monster
AI agents, like humans, demand high single-threaded performance
July 8th, 2026 — Source

SiPearl's long-awaited Rhea CPU finally gets in the lab, opening the door for Europe's first sovereign HPC CPU — 'availability of Rhea1 is scheduled for end of 2026' SiPearl VP says, following long development process
A giant step forward for the whole HPC industry in Europe.
July 8th, 2026 — Source

Computer — Processors — July 4th, 2026

Huawei Reveals Hybrid Bonding Process For The Kirin 2026's 3D Stacking Design In New Paper To Intensify Competition; Perks Include Better Efficiency & Bandwidth
Being limited to older-generation DUV equipment hasn't deterred Huawei's efforts to develop and mass produce competitive chipsets, as the Kirin 2026 will be a prime example of the company's next-generation packaging. Now, in the latest paper, the Chinese giant has detailed how a hybrid bonding process will allow for SoCs to flaunt a 3D stacking approach, which is the first step of removing one of the major obstacles of mobile silicon innovation; lack of access to advanced lithography.
July 4th, 2026 — Source

Noctua Confirms NL-LC1 Chromax.Black AIO Series; Should Arrive By The End Of This Year
The company confirmed it in an unusual way, but it seems legit, and as per the announcement, the coolers should arrive soon.
July 4th, 2026 — Source

Windows guru uses 19th-century Stirling Engine tech for auxiliary cooling on AMD Threadripper 3970X system — waste heat energy spins the $40 engine's flywheel
Patented in 1816, the Stirling Engine is now more typically found in solar power, CHP, and submarine applications than in computer chipset cooling.
July 4th, 2026 — Source

Computer — Processors — July 2nd, 2026

Intel Expected To Restart Supply Of 10th, 12th, 13th, And 14th Gen Processors In Mainland China
Intel will reportedly focus more on the previous-gen processors to fulfill the current demand in the PC market.
July 2nd, 2026 — Intel Expected To Restart Supply Of 10th, 12th, 13th, And 14th Gen Processors In Mainland China
Intel will reportedly focus more on the previous-gen processors to fulfill the current demand in the PC market.
July 2nd, 2026 — Source

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Intel Quietly Raises Suggested Pricing for Core Ultra 200S Plus Desktop Processors
Intel has quietly increased the suggested retail pricing for its recently introduced Core Ultra 200S Plus desktop processors, with MSRP adjustments ranging from $30 to $50 depending on the model. The updated pricing was first spotted by X user @harukaze5719, who noted the changes on Intel's product listings. According to the report, tray (OEM) versions remain $10 less expensive than their boxed retail counterparts. The Core Ultra 200S Plus family was initially introduced in March 2026 as a refresh of Intel's Arrow Lake desktop lineup.
July 2nd, 2026 — Source or Source

Intel reportedly restarts 13th and 14th Gen Core CPU production for China DIY market
Intel LGA1700 platform may see wider CPU supply as DDR4 demand rises
July 2nd, 2026 — Source or Source

Intel's Only Winning CPUs Just Got Pricier, As The $50 Core Ultra Plus Hike Threatens Its Slim Comeback
Unlike the non-Plus variants, the Core Ultra 200S Plus CPUs are witnessing a good demand, but Intel just made them more expensive for the consumers.
July 2nd, 2026 — Source

Computer — Processors — June 28th, 2026

AIDA64 adds preliminary support for AMD Zen 6 Olympic Ridge and Mustang Peak CPUs
AMD Olympic Ridge and Mustang Peak Zen 6 CPUs listed by AIDA64
June 28th, 2026 — Source

China's Loongson launches homegrown 16-core server CPU built on LoongArch architecture — 40W chip with DDR4 ECC and 32 PCIe lanes targets cheap SMB file, database, and web servers
Support for China's local software and hardware ecosystem also appears to be a selling point
June 28th, 2026 — Source

Computer — Processors — June 27th, 2026

Intel Nova Lake Rumored to Reach 474W PL2 Boost Power
A series of new leaks suggests Intel's upcoming Nova Lake desktop processors could significantly increase peak power consumption compared to the current Arrow Lake generation. According to information shared by leakers LC Tech Leaks and Jaykihn, the highest-end Nova Lake processors featuring dual compute tiles may support a PL2 (Power Level 2) limit of up to 474W. PL2 represents the maximum power a processor can draw during short boost periods rather than sustained workloads. The reported 474W PL2 applies only to flagship dual-compute-tile models. Intel is also expected to introduce more affordable Nova Lake variants built around a single compute tile, offering fewer CPU cores and lower power requirements.
June 27th, 2026 — Source

Intel's next-gen 52-core Nova Lake CPU could pull up to 474W — high-end LGA1954 motherboards may need three 8-pin power connectors to feed the monster
A power-hungry flagship awaits.
June 27th, 2026 — Source

Computer — Processors — June 26th, 2026

AMD Ryzen 7 5800X3D versus Intel Core i7-14700K faceoff — A new battle for DDR4 supremacy in 2026
AMD Zen 3 is back, but can it keep up with Raptor Lake Refresh?
June 26th, 2026 — Source

IBM unveils sub-1-nanometer chip architecture that stacks 100 billion transistors onto a fingernail-sized processor
It's a research milestone for now, but the company expects it to become an industry standard within a decade
June 26th, 2026 — Source

Intel Nova Lake Dual-Tile CPUs Reportedly Feature Up To 474W PL2 Power Limit
Intel's Nova Lake flagship may temporarily consume up to 474W under heavy boost workloads.
June 26th, 2026 — Source

Computer — Processors — June 23rd, 2026

Intel's Raptor Lake Returns on Mobile as Core 200 HX
Look out for Core 200 gaming laptops using cheaper DDR4 to compete on price.
June 23rd, 2026 — Source

Nearfield Instruments raises a record $380M chip round
Nearfield Instruments, a Rotterdam firm that inspects chips at the atomic scale, has raised $380mn at a $1.6bn valuation. It is the largest deep-tech round in Dutch history, and sovereign funds are paying close attention.
June 23rd, 2026 — Source

Computer — Processors — June 22nd, 2026

AMD Restores TSME Memory Encryption on Ryzen Consumer Processors
AMD has confirmed that it will restore Transparent Secure Memory Encryption (TSME) support on consumer Ryzen processors after previously removing the feature through AGESA firmware updates. The company says the decision was made following feedback from users and the broader enthusiast community, many of whom questioned the removal of a security capability that had been available on Ryzen platforms for years. The issue first surfaced earlier this year when motherboard vendors began distributing BIOS updates based on newer AGESA releases. Users noticed that TSME, a hardware-based memory encryption feature, was no longer available on consumer Ryzen processors.
June 22nd, 2026 — Source

Google is spending billions to turn its TPU chips into a real challenger to Nvidia
Google backs $3.2 billion data center deal to get its chips into Anthropic's hands, mirroring Nvidia's playbook
June 22nd, 2026 — Source

Intel and AMD are teaming up to make x86 CPUs better at AI, without needing a GPU
The new ACE spec won't replace GPUs, but will help with some inference, edge computing, and latency-sensitive workloads
June 22nd, 2026 — Source

Intel Raptor Lake Next Revives 24-Core HX Mobile Flagship For 2027, But Quietly Drops vPro From The Lineup
Intel's upcoming Refresh of the Raptor Lake will include a new family of HX SKUs, including 6+8, 8+12, and 8+16 variants.
June 22nd, 2026 — Source

JEDEC Approves SPHBM4 to Break HBM's Costly Packaging Bottleneck, Retaining HBM4-level Speeds With Standard Packages
SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies.
June 22nd, 2026 — Source

June 2026 AIO CPU Cooler Round Up Multi Review
Today we're going big on AIO coolers -- seven of them in fact! We've got new hardware from ASRock, Cooler Master, CPS PCCOOLER, DeepCool, Enermax and Sudokoo to look at, all featuring integrated pump-mounted displays and targeting a wide range of price points. In this multi-review, we'll be looking at thermals, noise, build quality and value for money to find out which ones are genuinely impressive, and which ones are just flashy-looking screens with a pump attached.
June 22nd, 2026 — Source or Watch Video

Leaked Zen 6 Threadripper 6 Details Include New TR6 Socket, PCIe 6 Support
Based on TSMC 2nm, the new chips are codenamed Mustang Peak.
June 22nd, 2026 — Source

Modder cools RTX 3060 with countertop ice machine, slashing gaming temps by up to 62%
Condensation remains the biggest problem with the build
June 22nd, 2026 — Source

Computer — Processors — June 20th, 2026

AMD Reverses Course On Removing TSME From Ryzen Chips; Will Reinstate The Feature Through A New BIOS Update
The company has decided to restore the memory encryption feature on consumer Ryzen CPUs after the backlash
June 20th, 2026 — Source

Intel and AMD's new ACE CPU extensions bring an efficient AI-oriented instruction set to x86 — a new design makes matrix multiplication more power- and density-efficient
Most all you hear about "running an AI model" involves a GPU of some sort, but not every AI task is suited to that hardware. Smaller models or single-user latency-sensitive operations can benefit from running on the CPU instead, as it avoids the overhead of shuffling data to and from the GPU. There are also many situations where there is no GPU available to begin with, or it's a meek integrated affair with limited capabilities. Intel and AMD have recently released the full specification for the ACE CPU extensions that make it easier and more power-efficient to run the aforementioned AI tasks on x86 processors.
June 20th, 2026 — Source

Sound waves could power a new kind of chip inspired by the human brain
Neuromorphic computing is a computing approach that mimics how the human brain works. Our gray matter is a marvel of nature, capable of handling huge volumes of data with incredible energy efficiency. While modern AI hardware is becoming better at processing complex tasks, it consumes vast amounts of energy.
June 20th, 2026 — Source

Standard Snapdragon 8 Elite Gen 6 To Share One Similarity With Snapdragon 8 Elite Gen 5, But That Won't Make It Any Less Expensive
A ton of attention is being focused on the Snapdragon 8 Elite Gen 6 Pro, but only a modicum of it is being diverted to the standard Snapdragon 8 Elite Gen 6. After a torrent of leaks surrounding Qualcomm's top-end SoC, some fresh information has leaked involving the company's other 2nm chipset, with details revealing that it'll share a similarity with the Snapdragon 8 Elite Gen 5. However, don't count on this as positive news, because Android phone makers will still be forced to pay a hefty premium for the silicon.
June 20th, 2026 — Source

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
June 20th, 2026 — Source

Computer — Processors — June 19th, 2026

AMD and Intel arm x86 against the AI gap with ACE, baking matrix-multiply engines & low-precision formats straight into future CPUs
ACE, the upcoming set of x86 Extensions defined by both AMD & Intel, has seen the latest spec release, focusing on AI acceleration.
June 19th, 2026 — Source

ASUS Unveils ROG Strix LC IV and SLC IV AIO Coolers With Wireless Display
ASUS has announced its latest generation of ROG Strix all-in-one liquid coolers, the ROG Strix LC IV and ROG Strix SLC IV series. The new products focus heavily on aesthetics and customization, introducing a wireless display implementation that removes the need for visible cables running from the CPU block to the motherboard. The most distinctive model in the lineup is the ROG Strix SLC IV. It incorporates a detachable 6.67-inch curved AMOLED display with a resolution of 2400 × 1080 and a refresh rate of 60Hz. The screen can display real-time system information, custom graphics, animations, wallpapers, and hardware monitoring data. By communicating wirelessly with the cooling unit, the display avoids the additional wiring commonly associated with display-equipped AIO coolers.
June 19th, 2026 — Source

First PassMark Numbers For Intel Core Ultra 7 270HX Plus Put It Ahead Of Ultra 9 275HX In Both Single And Multi-Threaded Performance
The newest Arrow Lake-HX chip was just benchmarked in PassMark, revealing the true prowess of chip.
June 19th, 2026 — Source

Intel Core Ultra 7 270HX Plus Appears in PassMark, Nearly Matches Flagship Ultra 9 285HX
Intel's upcoming Core Ultra 7 270HX Plus mobile processor has surfaced in PassMark benchmark results, and the numbers are raising eyebrows. Despite featuring fewer cores than Intel's higher-end Ultra 9 models, the new Arrow Lake-HX Plus chip manages to outperform the Core Ultra 9 275HX in both single-threaded and multi-threaded tests. According to benchmark data spotted by X user x86deadandback, the Core Ultra 7 270HX Plus achieved a PassMark score of 4,908 points in the single-threaded test and 56,088 points in the multi-threaded benchmark.
June 19th, 2026 — Source

MSI MPG CoreLiquid P22 360 Review
Across the Board Improvement
June 19th, 2026 — Source

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer
EUV-printed 28nm gates and 94% working devices, all on standard production tooling.
June 19th, 2026 — Source

Qualcomm Is Copying Samsung Exynos 2600's Heat Path Block For Snapdragon 8 Elite Gen 6 Pro, But Has Botched The Implementation
Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600's novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so.
June 19th, 2026 — Source

Snapdragon 8 Elite Gen 6 Pro Will Only Have Two Versions, With Block Diagrams Serving As Concrete Evidence, But Binned Parts Are Expected
A previous leak revealing that there could be potentially six versions of the Snapdragon 8 Elite Gen 6 Pro has been clarified by new findings showing the block diagrams of Qualcomm's first 2nm chipset. To minimize the confusion, the San Diego firm is prepping just two variants, one with LPDDR5X RAM support, while the top-end one will offer LPDDR6. However, don't count out Qualcomm introducing binned models of the Snapdragon 8 Elite Gen 6 Pro, because the way its handset business is hurting, it'll need to adopt the "Apple" approach.
June 19th, 2026 — Source

Thermal Grizzly Launches Duronaut Pro and Hydronaut Pro Thermal Paste
Compared to their non-pro variants, Duronaut Pro and Hydronaut Pro offer increased thermal conductivity while otherwise meeting the specific requirements of their predecessors. Duronaut Pro was developed for particularly high long-term stability, while Hydronaut Pro can be used as a thermal paste in industrial systems thanks to its silicone-free carrier structure.
June 19th, 2026 — Source or Source

Thermal Grizzly New Duronaut Pro and Hydronaut Pro Now Available
Compared to their non-pro variants, Duronaut Pro and Hydronaut Pro offer increased thermal conductivity while otherwise meeting the specific requirements of their predecessors. Duronaut Pro was developed for particularly high long-term stability, while Hydronaut Pro can be used as a thermal paste in industrial systems thanks to its silicone-free carrier structure.
June 19th, 2026 — Source

Computer — Processors — June 16th, 2026

AMD Reportedly Removes TSME Memory Encryption Support from Ryzen CPUs
A newly surfaced report suggests AMD has quietly disabled Transparent Secure Memory Encryption (TSME) support on consumer Ryzen processors through its AGESA 1.2.7.0 firmware release. The change was not publicly highlighted in release notes but was discovered following months of testing by users and motherboard engineers. TSME is a hardware-based memory security technology integrated into AMD processors. The feature automatically encrypts all data written to system memory and decrypts it when accessed, using a dedicated AES engine built into the CPU. Because the process operates transparently, applications and operating systems require no modifications. The technology is primarily intended to protect sensitive information against physical attacks such as memory extraction or cold-boot attacks.
June 16th, 2026 — Source

AMD takes over MEXT for memory tiering tech that enables flash to appear as DRAM to applications — tech to 'address growing memory constraints' in the data center
AMD gains a team of experienced engineers too.
June 16th, 2026 — Source

AMD Zen 6 "Olympic Ridge" desktop CPUs rumored to add NPU and drop iGPU
AMD Zen 6 "Olympic Ridge" desktop CPUs rumored to add NPU and drop integrated graphics.
June 16th, 2026 — Source

AMD's massive SP7 socket for EPYC Venice and Intel's gargantuan 9,324-pin socket for Diamond Rapids appear at Computex — SP7 and LGA9324-1 sockets will power the next generation of AI servers
Dwarf today's server sockets.
June 16th, 2026 — Source

AMD's Zen 6 Desktop Chips May Trade Integrated Graphics For AI NPUs
AMD is reportedly planning a major change for its next-generation Zen 6 desktop processors, trading basic video diagnostics for localized AI processing. Based on the leak, the upcoming 2027 CPU lineup, codenamed "Olympic Ridge," will introduce an integrated NPU directly onto the processor's I/O die, making it the first mainstream desktop lineup from AMD to feature dedicated hardware for machine learning workloads without being classified as an APU. To accommodate this new silicon, AMD could completely eliminate the iGPU altogether. Huh?
June 16th, 2026 — Source

Intel's one-two punch plan in desktop CPUs is taking shape — Z990 spotted, Nova Lake detailed, 'Raptor Lake Next' teased
Intel's upcoming plans were a big topic at Computex. This is what we learned.
June 16th, 2026 — Source

MSI MPG Coreliquid P22 360 Review: Low noise, strong performance, budget price
MSI delivers an AIO with top-tier cooling performance and a 2.1-inch IPS display for $129.99
June 16th, 2026 — Source

Noctua Enters Liquid Cooling After Years Of Air Dominance, NL-LC1 AIOs Start At $219
Noctua's first-ever AIO coolers have hit the shelves, including the 240mm, 360mm, and 420mm AIO editions.
June 16th, 2026 — Source

Noctua Introduces NL-LC1 All-in-One Liquid Coolers
Noctua today introduced its first all-in-one liquid CPU coolers. With first-class cooling performance, superb quietness of operation and industry-leading reliability, the new NL-LC1 series brings classic Noctua virtues to the world of closed-loop liquid cooling.
June 16th, 2026 — Source

Noctua Introduces NL-LC1 Series All-in-One Liquid CPU Coolers
Noctua today introduced its first all-in-one liquid CPU coolers. With first-class cooling performance, superb quietness of operation and industry-leading reliability, the new NL-LC1 series brings classic Noctua virtues to the world of closed-loop liquid cooling. "The performance headroom of liquid cooling has always been tempting to us, but we first had to make sure that acoustics and reliability met the strict standards that customers expect from a Noctua product," said Roland Mossig, CEO of Noctua.
June 16th, 2026 — Source

Noctua NL-LC1-24 liquid cooler review
Noctua entering the all-in-one liquid cooling market is not a small move. For years, the company has been almost synonymous with premium air cooling, acoustically optimized fans, and mounting systems that tend to outlive multiple CPU generations. With the NL-LC1-24, Noctua takes that same design philosophy and applies it to a compact 240mm closed-loop liquid cooler. This is not positioned as a flashy RGB showcase product or a screen-equipped pump block designed to dominate a tempered-glass side panel. Instead, the NL-LC1-24 is very much a Noctua product: sober, technical, acoustic-first, and built around the idea that cooling performance only matters when the noise profile remains civilized.
June 16th, 2026 — Source or Source

There's no such thing as an agentic CPU
AI agents are a general-purpose workload no different from any other
June 16th, 2026 — Source

Thermal Grizzly's New DeltaMate CPU Block MPII Is Gorgeous and Priced For 2026
Meaning anyone who wants anything nice needs to pay through the nose for it.
June 16th, 2026 — Source

Computer — Processors — June 15th, 2026

AMD Quietly Revives 7-Year-Old Zen+ Architecture With New Ryzen 3 3100U And Ryzen 5 3501U Laptop Chips
After a long time, AMD launches a Zen+ chip, featuring just two cores without hyperthreading, which appears to be targeting entry-level laptops.
June 15th, 2026 — Source

Asetek lists LGA-1954 support for Emma V3 Gen10 AIO platform
Intel's next desktop socket appears on another cooler vendor page
June 15th, 2026 — Source

Samsung And Elon Musk Partner Up Again, This Time For The 4th-Generation Neuralink Chip Under The 4nm Process, TSMC Seemingly Dropped
The development of Elon Musk's fourth-generation Neuralink chip is already underway as Samsung looks to strengthen the bond between the two. The newest iteration belonging to the neurotechnology company is expected to have unique characteristics thanks to its ability to enable bidirectional communication between the brain and computing devices.
June 15th, 2026 — Source

Samsung Eyes BOE Display Panels For The Base Galaxy S27 To Dodge Memory Chip Inflation, But Risks Green Display Lines
Samsung is trying to cut corners wherever possible to eke out cost savings in the face of a historic surge in memory chip prices. Now, the latest tidbit sees the base Galaxy S27 variant adopting OLED screens from China's BOE, potentially unleashing quality control issues.
June 15th, 2026 — Source

Thermal Grizzly Launches DeltaMate MPII CPU Blocks for AM5 and LGA1851
Thermal Grizzly has introduced the DeltaMate MPII CPU water block series for custom liquid cooling systems. The new blocks are positioned for recent AMD and Intel desktop platforms and use a construction focused on metal components, fine cold-plate machining, and a visible coolant chamber. Both models use a nickel-plated copper cold plate, a nickel-plated brass housing, and standard G1/4-inch ports. The viewing window is made from borosilicate glass, while the outer cover is anodized aluminum. Thermal Grizzly also includes ARGB lighting, which co
June 15th, 2026 — Source or Source or Source

Computer — Processors — June 10th, 2026

AMD fires back at Nvidia, claiming 256-core Zen 6 'Venice' CPU beats Vera by 3.3x in rack-level performance — company shares first estimated EPYC Venice benchmarks
Mind the footnotes on this one.
June 10th, 2026 — Source

AMD Says EPYC Turin Already Crushes NVIDIA Vera by 2.37x in Agentic AI, With Zen 6 Venice Pushing the Lead Past 3.3x
Agentic AI is pushing all major manufacturers to accelerate their CPU development as they race to drive multi-GW AI factories. The three major manufacturers involved in this race include AMD, Intel, & NVIDIA. Others, such as Arm, Qualcomm, and Broadcom, are also working on their own Agentic AI CPUs, but they have yet to start supplying their latest chips to AI firms.
June 10th, 2026 — Source

AMD Venice EPYC 256-Core Zen 6 Rack Benchmark Shows 100kW Performance Scaling
AMD has published early performance data for its next-generation EPYC processor family, codenamed Venice. The new server CPU generation is based on the Zen 6 architecture and a 2nm-class process node, with AMD using a 256-core configuration to demonstrate rack-level performance scaling under a fixed 100kW power budget. Rather than presenting only a conventional single-processor benchmark, AMD compares complete rack-level throughput. The test uses SPEC CPU 2017 and normalizes NVIDIA Vera to a baseline score of 1.0.
June 10th, 2026 — Source

Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
June 10th, 2026 — Source

NextSilicon to Productize Arbel RISC-V Core Into 64-Core Enterprise Processor for AI and HPC
NextSilicon, a leader in next-generation computing solutions for AI and high-performance computing (HPC), today announced plans to productize its Arbel RISC-V core into a 64-core and a 128-core, enterprise-grade processor suited to deliver ultra-speed performance for agentic tools, expected to be available in early 2028. Following an October preview, the company is now sharing expanded technical detail and a roadmap shaped by early customer and partner feedback. This announcement coincides with NextSilicon's presentation at the RISC-V Summit.
June 10th, 2026 — Source

Computer — Processors — June 8th, 2026

Alleged Intel Nova Lake-S Processor Leak Reveals New LGA1954 Package
A photograph claimed to show the underside of Intel's upcoming Nova Lake-S desktop processor has surfaced online, offering what may be the first physical look at the company's next-generation Core Ultra 400S platform. The image, posted by X user PoTAToOOOO, allegedly depicts a processor designed for Intel's forthcoming FCLGA1954 socket, although neither the image nor its authenticity has been confirmed by Intel. The leaked photo focuses on the backside of the processor package rather than the heatspreader. According to the source, the front of the chip reportedly resembles Intel's Alder Lake-era desktop processors, but the underside tells a different story. The package appears to feature a revised electrical layout and a noticeably different alignment notch position compared to recent Intel desktop CPUs.
June 8th, 2026 — Source

AMD rejects Ryzen 9 7950X3D warranty claim after CPU swelling
Ryzen warranty claims are getting harder
June 8th, 2026 — Source

AMD's Radeon RDNA 5 Gaming GPUs Slip to Late 2027 or Early 2028 as Memory Shortages Choke the PC Market
The Radeon RX 9000 GPUs based on the RDNA 4 graphics architecture launched last year. This year, AMD launched the Radeon RX 9070 GRE for gamers, still based on the RDNA 4 architecture. While the new card aims to provide gamers with a good 1440p solution, the majority of those who have been waiting for next-generation solutions from Team Red will have to wait quite a while.
June 8th, 2026 — Source

Bulging Ryzen 9 7950X3D Puts AMD's Warranty Policy In The Spotlight
A Ryzen 9 7950X3D failure reported by a Taiwanese user is drawing attention after AMD allegedly denied the warranty claim despite the processor still being within its three-year warranty period at the time of failure. The incident first surfaced on Taiwan's PTT bulletin board system, where the user claimed his system suddenly shut down after an audible popping sound while sitting idle. According to the report, the processor later exhibited visible swelling, or "substrate deformation," while the system also experienced BIOS corruption and other instability issues. The user states that AMD rejected the RMA request, citing physical damage to the processor.
June 8th, 2026 — Source

Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90% — 8-inch wafers produced without conventional optical lithography
Technology may help circumvent US export restrictions
June 8th, 2026 — Source

CPU-Z download v2.20.2
CPUID has released CPU-Z 2.20.1, updating its Windows system information utility with additional hardware detection for recent and upcoming AMD, Intel, graphics, and memory platforms. CPU-Z remains a freeware utility used to identify processor, motherboard, chipset, memory, SPD, cache, and live frequency information from within Windows. The new release is primarily a detection update. AMD additions include Ryzen 7 7700X3D, Ryzen 9 9950X3D2, Ryzen PRO Granite Ridge processors, Ryzen AI Max and Ryzen AI Max PRO Gorgon Halo models, several Ryzen AI Gorgon Point entries, and Ryzen AI Max+ 392. These entries broaden CPU-Z coverage across desktop, professional, and AI-focused mobile platforms.
June 8th, 2026 — Source

DeepCool Showcases Curved Screen AIO And Flagship Assassin V Vision Air Cooler With Dedicated Display
DeepCool had some innovative CPU coolers at its booth, including low-profile, mid-range, and flagship offerings for enthusiasts.
June 8th, 2026 — Source

Demand for data center CPUs has surged, and AI agents are responsible -- why the CPU to GPU ratio is more important than ever for hyperscalers
While most of the attention has been on GPUs, CPUs have continued to maintain their relevance -- and they're starting to attract more attention.
June 8th, 2026 — Source

Intel adds 7 more games to Binary Optimization Tool for Core Ultra 300 & 200 series
Intel claims up to 27% FPS gain with Binary Optimization Tool
June 8th, 2026 — Source

Intel Arc G3 handheld chips added to CPU-Z 2.20.2
CPU-Z gets another small update, this time for Intel Arc G3
June 8th, 2026 — Source

Intel expands new game-boosting iBOT software with seven more games, up to a 27% improvement — Team Blue claims 12% average jump in newly-supported titles
Some strange game choices, but iBOT is expanding.
June 8th, 2026 — Source

Intel introduced 'the first processor in the x86 series and the first 8086 microprocessor' on this day in 1978 — CPU was designed as a temporary substitute for the delayed iAPX 432 project
Should we expect a new 8086 anniversary CPU from Intel two years from now?
June 8th, 2026 — Source

Intel Might Double Wildcat Lake P-Cores in 2027 Refresh
Hyping up quad-cores like it's 2016 again.
June 8th, 2026 — Source

Intel Nova Lake-S "LGA 1954" Desktop CPU Pictured For The First Time
The first purported image of an Intel Nova Lake-S Desktop CPU for the LGA 1954 socket has leaked online.
June 8th, 2026 — Source

Intel Socket LGA1954 for "Nova Lake" Pictured in the Flesh, Confirms 2L ILM Design
Here is the first picture of Intel's next-generation desktop Socket LGA1954. We had only seen concept renders of the socket, until now. A successor to the current LGA1851, LGA1954 will seat Core Ultra "Nova Lake" desktop processors that introduce significantly higher CPU core counts and cache sizes to the desktop platform, dialing up compute power available to the segment. A key design change with LGA1954 over LGA1851 is its 2-lever ILM (independent loading mechanism), similar to Intel's HEDT and server sockets.
June 8th, 2026 — Source

May 2026 Steam Hardware Survey: AMD Hits 45% CPU Share, Windows 11 Crosses 74%, and the RTX 3060 Refuses to Die
Valve published the May 2026 Steam Hardware Survey a few days late after brief server issues, but the data was worth waiting for. AMD has reached 44.97% CPU share on Windows gaming PCs, its highest figure yet on the platform. Intel sits at 55.02%, down 0.79 points from April. AMD has been steadily chipping away at Intel's installed base for over a year, and AMD's own senior marketing director Saša Marinković made sure to celebrate the milestone publicly on X. For context, AMD held 43.34% of the Windows CPU share on Steam as recently as January 2026, meaning Team Red has added nearly 1.7 percentage points in just five months.
June 8th, 2026 — Source

Ultra-thin MoS₂ computer packs 1,400 transistors onto one chip
The rapid advancement and diffusion of artificial intelligence (AI) systems, such as the machine learning models underpinning the functioning of ChatGPT, Gemini and similar platforms, have posed new demands on the electronics engineering industry. In fact, these systems are computationally intensive and consume substantial power, particularly when running on existing devices.
June 8th, 2026 — Source

Computer — Processors — June 7th, 2026

AMD reaches almost 45% CPU share in the latest Steam Hardware Survey for Windows gaming PCs — Ryzen is steadily gaining ground against Intel's legacy domination
The CPU market has never been this fierce.
June 7th, 2026 — Source

Intel adds iGPU-less mobile chips to Core 200H lineup — Raptor Lake-based Core 7 230H and Core 5 205H sport disabled graphics for small form factor desktop boards
Intel is continuing to pump out new Raptor Lake CPUs
June 7th, 2026 — Source

Ludicrous overclock slams 1.7 volts into 6700K in an attempt to stop CPU from bottlenecking an RTX 3080 — 5.2 GHz on aging four-core pushes GPU utilization from 60% to 74%
The 6700K is a decade-old chip but still puts up decent performance numbers in games.
June 7th, 2026 — Source

Computer — Processors — June 6th, 2026

AMD Boasts About Hitting 45% CPU Share According To The Latest Steam Hardware Survey
The latest Steam Hardware Survey is out, and it has been one of the rare times to see AMD coming close to a 50% share for its CPUs.
June 6th, 2026 — Source

Intel lists Core 7 230H and Core 5 205H with disabled graphics
Intel confirms Core 7 230H and Core 5 205H as Raptor Lake mobile CPUs
June 6th, 2026 — Source

Intel Nova Lake Desktop CPU Whispers: Early 2027 Launch, 52-Core Power/Thermal Details, Multi-Core Overclocking & Z990/Z970 Boards at Computex
Intel Nova Lake Desktop CPUs are the next big platform upgrade for the consumer segment, offering up to 52 cores.
June 6th, 2026 — Source

Intel Revives Raptor Lake Again With Core 7 230H And Core 5 205H, But Strips Out The Integrated Graphics Entirely
Just like AMD, Intel keeps releasing refreshed Raptor Lake CPUs, but this time, both CPUs are devoid of any integrated graphics.
June 6th, 2026 — Source

NVIDIA RTX Spark versus Apple M5 Pro: The Unified Architecture Battle
Announced earlier this week at Computex, NVIDIA's RTX Spark has finally been revealed after what seems like years of leaks and rumors concerning the "N1/N1X". These chips are the consumer versions of the GB10 Superchip found in the NVIDIA DGX Spark that was released last October. That means you get the same 20 Arm CPU cores on board which, despite their branding are not the same design as NVIDIA's Grace server CPUs, the same 48-core Blackwell GPU, and the same LPDDR5X memory that are found in the DGX Spark, at least in the top-tier flagship variant of the chip with all of its engines enabled.
June 6th, 2026 — Source

TRYX Debuts Holographic and Panoramic V2 CPU Cooler Series at Computex 2026
TRYX brought two distinct AIO families to Computex 2026, with the headline being the HOLO, a 360 mm cooler that uses a holographic projection system on the pump-head. The HOLO uses a precision beam-splitter and a high-brightness LCD inside the pump housing to project a floating holographic image with apparent spatial depth inside a translucent chamber. The image can be rotated within the case to adjust the visual angle. Content is handled through the KANALI software, which supports preset libraries, user-uploaded content and live Giphy integration.
June 6th, 2026 — Source

Computer — Processors — June 5th, 2026

Intel Wildcat Lake Refresh reportedly moves to 8 cores, replacing cancelled 6-core Nova Lake
Intel reportedly plans 4+0+4 Wildcat Lake Refresh for budget laptops
June 5th, 2026 — Source

Intel will reportedly upgrade its Wildcat Lake refresh to an 8-core config next year, leak claims — top-end silicon tipped to feature 4 P-cores and 4 LP-E cores as part of 'Core 400' series
Wildcat Lake is seemingly due for a big upgrade next year.
June 5th, 2026 — Source

NVIDIA's RTX Spark chip could give Windows its true Apple Silicon moment
Arm CPU cores, a powerful GPU and gobs of unified RAM? That sounds familiar!
June 5th, 2026 — Source

Zalman Shows CNPS-inspired ZET-series CPU Coolers and Slender Companion Screens
Remember Zalman Computer Noise Prevention System (CNPS) series coolers from 20 years ago, with their distinctive Ω-shaped design where copper heat pipes would loop through a toroidal arrangement of copper fins, ventilated by a fan on one end? Zalman is keeping the spirit fo that design alive with its latest ZET series CPU coolers. These look the same, barrel-shaped when viewed from outside their shrouds, but inside, the aluminium fins are stacked in a tower-type shape. The shroud ensured that all the airflow passes through the fin-stack, and there's no bleed airflow.
June 5th, 2026 — Source

Computer — Processors — May 30th, 2026

3D silicon circuits bring denser computer chips closer to reality
By stacking transistors on top of one another, rather than laying them side by side on a flat chip, many electronic engineers are hopeful that vast amounts of computing power could be packed into tiny spaces, all while cutting energy use. So far, however, the ability to build these monolithic 3D integrated circuits has proven stubbornly difficult, largely because the fabrication processes required can damage the layers already in place.
May 30th, 2026 — Source

Huawei Researchers Claim 2D Parallel Computing Chip
Chinese researchers, working with Huawei, say they have built the world's first parallel processor using a two-dimensional (2D) semiconductor material called molybdenum disulfide.
May 30th, 2026 — Source

New 3D silicon chip breakthrough could extend Moore's Law for years
As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long blocked the production of true 3D chips.
May 30th, 2026 — Source

Nvidia's first consumer CPU in over a decade is coming -- and it has RTX cores built in
Microsoft, Nvidia, and Arm tease "new era of PC" at Computex
May 30th, 2026 — Source or Watch Video

Computer — Processors — May 29th, 2026

Acer Launches New Swift Air 14 Powered by Latest Intel Core Series 3 Processors
Acer today introduced two new Swift laptops—the Acer Swift Air 14 and the Acer Swift Spin 14 AI. Both Windows 11 PCs with dedicated NPUs, the thin-and-light devices feature the latest technology and powerful on-device capabilities to run AI workloads and offer exclusive AI experiences.
May 29th, 2026 — Source

Apollo and Blackstone shop a $36bn debt deal to buy Anthropic its chips
The financing would buy Google's TPUs through a special-purpose vehicle and lease them to Anthropic, with Broadcom standing behind the senior debt.
May 29th, 2026 — Source

Exynos 2600's Heat Pass Block Performs Better Than A Liquid-Nitrogen-Cooled Snapdragon 8 Elite Gen 5, Enabling Practical Uses For Future SoCs
A vapor chamber in a premium smartphone has almost become a necessity these days if chipsets are expected to perform at their optimum levels. Thankfully, Samsung went a step further with its Exynos 2600 by introducing its Heat Pass Block (HPB) technology, which drops a copper heatsink on top of the SoC die to help with heat transfer. Now, it appears that this approach has several practical uses, as tests show that even a Snapdragon 8 Elite Gen 5 with liquid-nitrogen cooling cannot perform as well, not to mention that it's far too dangerous.
May 29th, 2026 — Source

Noctua teases quiet AIO pump ahead of Computex
Noctua may be ready to launch its first CPU liquid cooler
May 29th, 2026 — Source

Computer — Processors — May 28th, 2026

ByteDance is building its own CPUs on Arm and RISC-V to feed its AI infrastructure
The TikTok parent is developing custom data-centre processors on two parallel architectures as Intel and AMD push prices up 10-35% a quarter and US export controls bite.
May 28th, 2026 — Source

Intel Arc G3 CPU Family Officially Released for Handheld Gaming PCs
Following a series of leaks about an upcoming Intel Panther Lake CPU for gaming handhelds, the hardware giant has officially announced the Intel Arc G3 CPU series, which features the powerful Arc B390 iGPU and optimizations for the Windows Xbox mode that started rolling out to gaming handhelds and Windows PCs alike not too long ago. Both new CPUs are based on the same 14-core CPU design—with 2 P-Cores, 8 E-Cores, and 4 LP E-Cores—but the Arc G3 CPU has a 100 MHz lower max Turbo frequency and a less powerful Arc B370 iGPU. The Arc G3 Extreme and the Arc G3 have already been confirmed as coming to the new Acer Predator Atlas 8 gaming handheld, slated to launch in October 2026.
May 28th, 2026 — Source

Intel Arc G3 Handheld Chips Bring Panther Lake to Portable Gaming
Intel is preparing a dedicated processor lineup for gaming handhelds with the new Arc G3 and Arc G3 Extreme. These chips are based on the Panther Lake architecture, already associated with Intel's Core Ultra 300 series, but the configuration is clearly aimed at portable Windows gaming devices rather than standard notebooks. Both processors use a CPU layout with two performance cores, eight efficiency cores, and four low-power efficiency cores. This gives the platform a mix of responsive foreground performance and lower-power operation for background tasks. The Arc G3 reaches up to 4.6 GHz on its P-cores, while the Arc G3 Extreme increases that to 4.7 GHz.
May 28th, 2026 — Source or Source

New metamaterial guides vibrations along predefined paths
Researchers designed microfabricated silicon chip patterns that guide vibrations along set paths, enabling energy harvesting or signal processing without electricity.
May 28th, 2026 — Source

Qualcomm Snapdragon C is official, and it's taking aim at MacBook Neo and Chromebooks: New low-end ARM chip brings all day battery life to $300 Windows 11 devices
Qualcomm has unveiled its new entry-level ARM-based SoC for Windows 11 devices that will begin shipping later this year on devices that cost as low as $300.
May 28th, 2026 — Source

Samsung Exynos 2600 SoC Annotated, Showcases 3-tier CPU, AMD RDNA 4 iGPU
We begin our tour with the CPU. Samsung designed the Exynos 2600 with a 3-tiered heterogenous multicore design, and a 1X+3P+6E core configuration. Leading it is one C1-Ultra extreme core that ticks at up to 3.80 GHz, offers the highest IPC, and comes with 3 MB of dedicated L2 cache. Next to it are three C1-Pro performance cores, which run at up to 3.25 GHz, and handle most performance-heavy workloads. Each C1-Pro core has 1 MB of dedicated L2 cache. Trailing these are six other C1-Pro cores, which are purposed to serve as efficiency cores. Their clock speed only runs up to 2.75 GHz, and have a more aggressive power-management scheme.
May 28th, 2026 — Source

Scythe Intros the Magoroku Dual Fin-stack Air CPU Cooler
Scythe today introduced the Magoroku CPU cooler (model: SCMR-1000). This is a large, dual fin-stack (D-type) air cooler. It uses a nickel-plated copper base from which six 6 mm-thick heatpipes pass through, conveying heat to two fin-stacks on both ends. The fin-stacks are topped by matte black steel plates. Scythe includes two Wonder Tornado 120 mm fans with this cooler.
May 28th, 2026 — Source

Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing strategies and IP
While TSMC and Samsung chase 2nm, the three largest mature-node foundries are spending billions to expand capacity at 22nm and above.
May 28th, 2026 — Source

ZALMAN Intros ZM-STC11 Silicone-based Thermal Paste
ZALMAN today introduced the ZM-STC11, a silicone-based thermal compound. It is composed mainly of dimethylpolysiloxane, zinc oxide, and aluminium oxide. The star-attraction here is its claimed thermal conductivity of 18 W/mK, making it suitable for high-end CPU and VGA cooler applications. Its viscosity is measured at 2.6 g/cm³, which it holds between its operational temperature range of -40 °C to 150 °C. Another impressive claim by its makers is a rated service life of up to 10 years. ZALMAN is selling the compound in 2 g syringes, the package includes a cleaning wipe and a spatula. The company didn't reveal pricing.
May 28th, 2026 — Source

Computer — Processors — May 23rd, 2026

AMD Ryzen 7 5800X3D AM4 Anniversary Edition Appears at Retail
A special edition version of AMD's Ryzen 7 5800X3D processor has appeared online through Indian retailer 99deals.in, suggesting a commemorative release celebrating the tenth anniversary of the AM4 platform. The processor is currently listed at approximately $317 USD, and customer activity on the retailer page indicates that some units may already be shipping. The product is listed as the "Ryzen 7 5800X3D AM4 10th Anniversary Edition," though the underlying hardware appears unchanged from the standard retail model.
May 23rd, 2026 — Source

Intel's Premium Lunar Lake Laptops Crash To $600 In China, Undercutting Budget Wildcat Lake Models They Were Meant To Sit Above
Laptops with both types of Intel chips are now at their cheapest, competing to go as low as they can in mainland China.
May 23rd, 2026 — Source

NVIDIA's Vera CPU Rumored To Crush Intel And AMD x86 Chips By 1.5X At Computex
A new report from GF Securities (via SeekingAlpha) claims NVIDIA is gearing up to use its June 1st Computex keynote to pitch its upcoming Arm-based Vera CPU as an x86 killer. The financial analysts claim NVIDIA will boast that Vera delivers up to "1.5x faster speeds, 2x the performance, and 4x the density per rack," as compared to traditional x86 alternatives from AMD and Intel.
May 23rd, 2026 — Source

Computer — Processors — May 22nd, 2026

AMD announces Ryzen AI Max PRO 400 series processors for AI platforms
AMD has introduced the Ryzen AI Max 400 series of processors for local AI development platforms. Serving as an architecture refresh to the previous Ryzen AI Max (PRO) 300 series Strix Halo hardware, the new silicon combines Zen 5 CPU cores, RDNA 3.5 integrated graphics, a dedicated NPU, and AMD PRO enterprise management features. Consumer-targeted iterations of these processors are scheduled to debut later this year.
May 22nd, 2026 — Source

AMD Radeon Adrenalin 26.5.2 (Polaris and Vega) driver download
AMD has officially shifted its Polaris and Vega graphics architectures into a legacy support phase with the release of Radeon Software Adrenalin Edition 26.5.2. While the move does not completely end driver support, it changes the focus of future updates. Instead of frequent game-ready optimizations and feature rollouts, AMD will now provide maintenance-oriented releases centered around stability, compatibility, and security fixes for older Radeon hardware. The transition covers several well-known Radeon graphics card families that remained relevant in the PC market for nearly a decade.
May 22nd, 2026 — Source

AMD Updates "Polaris" and "Vega" GPU Drivers With Adrenalin Edition 26.5.2 Version
AMD has released a new GPU driver update for its older "Polaris" and "Vega" GPU architectures, which are now almost a decade old. The latest Adrenalin Edition 26.5.2 drivers, released a few days ago, are specifically designed for these two architectures, which were AMD's popular gaming GPUs before the RDNA 1.0 generation. Interestingly, the Adrenalin Edition 26.5.2 driver update for "Polaris" and "Vega" GPU architectures includes only a single fix: resolving an application crash issue in Apex Legends on Radeon RX 400/500 series graphics cards.
May 22nd, 2026 — Source

AMD's 256 core Epyc Venice enters production on TSMC's 2nm node
The Zen 6 server chip promises major gains in AI throughput, memory bandwidth, and power efficiency
May 22nd, 2026 — Source

BeQuiet Dark Rock Pro 6 CPU Cooler Review
be quiet! Dark Rock Pro 6 Review -- Silent High-End Air Cooling Refined
May 22nd, 2026 — Source

Intel Titan Lake Rumored for All P-Cores, Hammer Lake to Return Hyper-Threading
Intel's next-generation desktop platform is apparently going to persist for approximately three and a half full CPU generations if you include the mobile-only Titan Lake. That's just one of the major details released by serial leaker Moore's Law is Dead in a new video that also includes the claims that upcoming Intel CPUs will not only skip E-cores (as we know them) but also that we'll see the return of Intel's Hyper-Threading SMT technology in a few generations.
May 22nd, 2026 — Source

Intel's Razor Lake Just Got Its First Display Partner As Tianma Rolls Out A 2.8K Panel That Idles At 30Hz To Save Battery
The Intel Razor Lake isn't coming anytime soon, but it's great to see display manufacturers already working on products that are Razor Lake-ready.
May 22nd, 2026 — Source

Lian Li Intros HydroShift II OLED Curved 360 AIO with Motorized 2K OLED Curved Screen
LIAN LI Industrial Co., Ltd., a leading manufacturer of chassis and PC accessories, launches the HydroShift II OLED Curved 360, an all-in-one liquid cooler that features a 6.67-inch 2K curved OLED display with motorized dual-axis adjustment. The display supports full-screen, split-view, triple-split, secondary-screen, and off-mode clock layouts, while a magnetic hot-swappable module with pogo-pin connector simplifies installation and reduces handling risk during assembly. The HydroShift II OLED Curved 360 also maintains LIAN LI's signature clean, tubeless appearance through side-mounted tubing, hidden wiring, and adjustable tube routing, while its slim 24 mm-thick 360 mm radiator improves compatibility across a wide range of cases.
May 22nd, 2026 — Source or Source

LIAN LI Launches HydroShift II OLED Curved 360 AIO Featuring Motorized 2K OLED Curved Screen
Lian Li HydroShift II OLED Curved 360 launches globally from $279.99
May 22nd, 2026 — Source

Lian Li Unveils HydroShift II 360 AIO with a Motorized 2K OLED Display
Motorized standing desks like Herman Miller's new Coyl and Lian Li's DK-07 Wood are commonplace these days, but an all-in-one liquid cooler with a motorized display? Not much, though also not completely unaccounted for—meet Lian Li's new HydroShift II OLED Curved series. Offered in black and white trim, Lian Li's newest AIOs boast a 6.67-inch display with motorized controls.
May 22nd, 2026 — Source

Computer — Processors — May 21st, 2026

AMD Announces Production Ramp of Next-Generation AMD EPYC Processor "Venice" on TSMC 2nm Process Technology
AMD today announced that its next-generation AMD EPYC processor, codenamed "Venice," is ramping production in Taiwan on TSMC's advanced 2 nm process technology, with future plans to ramp production at TSMC's Arizona fabrication facility. The milestone in the execution of the AMD data center CPU roadmap demonstrates continued progress toward delivering the leadership performance and energy efficiency required for next-generation cloud, enterprise and AI infrastructure. "Venice" is the first high-performance computing (HPC) product in the industry to enter production on TSMC's advanced 2 nm process technology.
May 21st, 2026 — Source

AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap
Intel's competing P-core Xeon won't arrive until 2027 at the earliest.
May 21st, 2026 — Source

AMD EPYC Venice Enters Production on TSMC 2nm Process
AMD has announced that its next-generation EPYC processor, codenamed Venice, is ramping production in Taiwan on TSMC's advanced 2nm process technology. The company also plans to ramp production at TSMC's Arizona fabrication facility at a later stage, giving the platform a broader advanced manufacturing footprint. Venice is the next major step in AMD's data center CPU roadmap and is aimed at cloud, enterprise, HPC, and AI infrastructure.
May 21st, 2026 — Source

AMD Ramps 2nm EPYC Venice CPUs on TSMC as Intel Teases 10A and Beyond
AMD announced it has begun ramping production of its 6th Gen EPYC processors, codenamed Venice, on TSMC's 2-nanometer manufacturing process. Initially being made in Taiwan, AMD says it will later shift some production to the TSMC's expanding Arizona fab site. Meanwhile, Intel CEO Lip-Bu Tan is teasing its own future roadmap that includes its 10A and 7A nodes. Folks, the chip wars are heating up.
May 21st, 2026 — Source

AMD Ryzen AI MAX PRO 400 launches in third quarter, only MAX+ 495 gets updated Radeon 8065S graphics
AMD confirms Ryzen AI Max PRO 400 lineup, only three SKUs
May 21st, 2026 — Source

Intel 14A Node Enters Risk Production in 2028, 10A and 7A Nodes on the Roadmap
Intel CEO Lip-Bu Tan spoke at the J.P. Morgan TMT Conference, providing more details about the company's roadmap for future node developments. According to Lip-Bu Tan, Intel now forecasts the 14A node risk production run in 2028, with high-volume manufacturing in 2029. This is expected to coincide with major customers ramping up their designs and starting to ship 14A silicon worldwide. Intel plans to utilize the node both internally and offer it to third-party customers, who will consume High-NA EUV exposed wafers at scale.
May 21st, 2026 — Source

IRAA doping could reshape organic semiconductors with cleaner, faster charge control
Semiconductors are an indispensable part of modern-day technologies ranging from computers and smartphones to solar panels and LED lighting. Their ability to control the flow of electrical charge makes them essential for how devices generate, process, and use energy.
May 21st, 2026 — Source

Leaked Cinebench Run Shows Intel's Core Ultra 7 251HX Crushing The Core i9 14900HX In Efficiency, Despite Trailing Its Own Sibling
The newest Core Ultra Series 2 chip offers superior raw performance at lower power consumption vs Raptor Lake Refresh's flagship chip.
May 21st, 2026 — Source

SAPPHIRE Radeon RX 9070 XT NITRO+ PhantomLink Review - RDNA 4's Beast Mode
SAPPHIRE's Radeon RX 9070 XT NITRO+ PhantomLink offers a true hidden-cable look, with GC-HPWR support, and fantastic 1440p and 4K gaming performance.
May 21st, 2026 — Source

The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond
Every major hyperscaler now designs its own AI silicon, and the collective investment is accelerating.
May 21st, 2026 — Source

Computer — Processors — May 18th, 2026

Intel Core 7 350 Closes The Gap On Apple A19 Pro In PassMark Debut, Beating It In Multi-Thread, While Losing Single-Core By 18%
The Wildcat Lake appears to be doing pretty well in both single and multi-threaded operations, and the latest results don't lie.
May 18th, 2026 — Source

TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone
TetraMem Inc., a Silicon Valley-based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22 nm multi-level RRAM-based analog IMC system-on-chip (SoC).
May 18th, 2026 — Source

Thermal Grizzly Releases New De-Lidded Intel Core Ultra 7 270K Plus CPUs
The Intel Core Ultra 7 270K Plus belongs to the Arrow Lake Refresh for Intel socket LGA1851 and delivers solid performance. With overclocking, the 270K Plus even surpasses the Intel Core Ultra 9 285K, the former Arrow Lake flagship. And it does so with a significantly better price-performance ratio. The best everyday temperatures for both processors are achieved with a direct-die water block in combination with liquid metal as the thermal interface material (TIM) and a custom water-cooling loop with as much radiator surface area as possible.
May 18th, 2026 — Source

Why AI-assisted coding is the 3D printing of the software world [Q&A]
Just as 3D printing has revolutionized prototyping but not (yet) replaced mass production, coding assistants are accelerating high-fidelity prototypes and rapid iteration -- but not replacing the role of humans and teamwork.
May 18th, 2026 — Source

Computer — Processors — May 17th, 2026

Memtest86+ 8.10 adds better Intel Panther Lake support
Memtest86+ 8.10 improves memory testing on Intel Lunar Lake and Panther Lake
May 17th, 2026 — Source

Researchers built a switch 1,000 times faster than today's AI chips, and it barely generates any heat
University of Tokyo's antiferromagnetic spintronic switch operates at picosecond speeds
May 17th, 2026 — Source

Computer — Processors — May 16th, 2026

AMD Radeon RX 7600 Loads Forza Horizon 6 in 4 Seconds Instead of 90, as Microsoft's Advanced Shader Delivery Tech Lands on RDNA 3 GPUs
Lower Load Times & Less Stutters Made Possible On AMD Radeon RX 7000, RX 8000, RX 9000 GPUs With Microsoft's Expanded Advanced Shader Delivery Tech Support
May 16th, 2026 — Source

"I'm totally sold on Snapdragon X2": I spent a month with Qualcomm's latest chip — here's why you shouldn't believe the detractors
I spent a month with a Snapdragon X2 laptop — My first full-time experience went way better than I ever imagined
May 16th, 2026 — Source

Intel Core i9-14900KF Achieves 9.2 GHz, The Fastest CPU Frequency Ever Recorded
Intel's Core i9-14900KF has become the first CPU to break past the 9.2 GHz clock frequency limit, a world record speed.
May 16th, 2026 — Source

Intel Core i9-14900KF reaches 9.2 GHz in new CPU frequency world record
Intel Core i9-14900KF reaches 9.2 GHz overclock, beating previous world record
May 16th, 2026 — Source

Intel Core Ultra 5 250K Plus vs AMD Ryzen 5 7600X3D faceoff — Battle for the fastest mid-range gaming CPU
Arrow Lake Refresh takes on AMD's budget X3D chip.
May 16th, 2026 — Source

Intel Panther Lake R appears in Linux patch as ruggedized Panther Lake variant
Intel appears to be preparing a ruggedized version of Panther Lake for industrial and embedded systems.
May 16th, 2026 — Source

The Core Ultra 7 270K was too good, so Intel scrapped the flagship Core Ultra 9 290K Plus — benchmarks of the 290K prototype find slim 2% faster performance in gaming and applications
The Core Ultra 9 290K Plus just wouldn't have made sense.
May 16th, 2026 — Source

Computer — Processors — May 15th, 2026

Exynos 2700 To Receive Premium Treatment From Samsung As Update Drops Claims Of Company Abandoning Its 2nm SoC's Advanced Packaging
Samsung was considering removing Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700 as part of its cost-cutting strategy to make its upcoming Galaxy S27 series more affordable for the masses amid the DRAM shortage. Fortunately, a new rumor has dispelled these claims, stating that the Korean giant fully intends to treat its next 2nm chipset with the best in-house technologies possible to raise the competitive bar.
May 15th, 2026 — Source

Intel Razor Lake-AX detailed in new rumor
New rumors suggest that Intel's upcoming "Razor Lake-AX" processors will utilise on-package memory and high-core-count integrated graphics. If confirmed, this would mark a strategic shift for Intel, which previously stated that the on-package memory design seen in Lunar Lake (Core Ultra 200V) was a "one-off" due to cost and margin complexities.
May 15th, 2026 — Source

Thermal Grizzly starts selling delidded Intel Core Ultra 7 270K Plus with warranty for $525
Thermal Grizzly launches delidded Core Ultra 7 270K Plus at $525
May 15th, 2026 — Source or Source

Computer — Processors — May 14th, 2026

AMD reaches 46% of server x86 CPU revenue — Intel still controls 70% of the consumer PC market share
The first quarter of 2026 was quite favorable for AMD as the company managed to increase its unit share on the market of client systems and skyrocketed its share in servers past 33%, according to Mercury Research. In addition, the company's revenue shares set records across client and server market segments, so AMD now controls 38.1% of all x86 CPU market value and 46.2% of all x86 server CPU revenue share. Perhaps an alarming sign is that the company's desktop PC unit and revenue shares declined sequentially, though they are up year-over-year (YoY).
May 14th, 2026 — Source

CPU-Z download v2.20
CPUID has released CPU-Z 2.20, the latest version of its freeware hardware identification utility for Windows x86 and x64 systems. The update focuses on expanded processor, graphics, and memory detection rather than changes to the interface or operating model. CPU-Z remains a lightweight tool for identifying core system components. It reports CPU name and model number, codename, process, package, cache levels, motherboard, chipset, memory type, memory size, timings, SPD module information, and real-time frequency data for individual CPU cores and memory. Windows 11 is supported.
May 14th, 2026 — Source

CPUID Adds AMD Gorgon Halo Support To CPU-Z; Intel Wildcat Lake And Bartlett Lake Also Receive Support
Several newly released and upcoming hardware are now added to the CPU-Z database, allowing better reporting in the software.
May 14th, 2026 — Source

Intel Razor Lake-AX reportedly has 16 or 32 Xe3 graphics cores
Intel Razor Lake-AX large APU rumor now points to 32 Xe3 cores
May 14th, 2026 — Source

Ryzen Pro 9000 Expansion Brings AMD's 3D V-Cache to Mainstream Workstations
For the first time ever, AMD is bringing 3D V-Cache to its Ryzen Pro processors with the expansion of its Ryzen Pro 9000 series to drive what the chip designer says is a new era of workstation-class performance. Two of the six new models feature 3D V-Cache, including the Ryzen 9 Pro 9965X3D and Ryzen 7 Pro 9755X3D.
May 14th, 2026 — Source

Computer — Processors — May 11th, 2026

Intel Core Ultra 7 270K Plus CPU RAM Performance -- 7200MTs-8800MTs
How does the new Intel Core Ultra 7 270K Plus perform as you scale up the RAM speed? With Intel's new Core Ultra 200S Plus series of CPUs recently launched, the highest officially supported memory speed has now been moved up to 7200MT/s. However, it doesn't stop there; these CPUs can support high-speed CUDIMM memory. So MSI sent over for us a couple of high-speed RAM kits from Kingston to test them out, and see how performance scales in benchmarks, and games as we climb our way up to 8800MT/s on the Intel Core Ultra 7 270K Plus.
May 11th, 2026 — Source

Computer — Processors — May 10th, 2026

AMD Ryzen 9 9950X3D2 vs Ryzen 9 9950X3D faceoff — How far does dual cache take you?
More cache, largely similar performance.
May 10th, 2026 — Source

Computer — Processors — May 9th, 2026

AMD prepares CPPC HighestFreq support to report CPU boost clocks directly to the OS
AMD prepares CPPC HighestFreq support to report CPU boost clocks directly to the OS
May 9th, 2026 — Source

AMD's New CPPC HighestFreq Ends OS Frequency Guesswork, Letting Windows And Linux See True Ryzen Boost Clocks
The upcoming ACPI support could allow OS like Windows and Linux read CPU frequencies directly without having to estimate them for optimal performance.
May 9th, 2026 — Source

MaxSun launches MoDT motherboards with Intel Core 200H Raptor Lake CPUs
MaxSun adds new DDR4 MoDT motherboards with Intel Core 200H CPUs
May 9th, 2026 — Source

Computer — Processors — May 8th, 2026

Avalue Launches ECM-PTL 3.5 Micro Module with Intel Core Ultra Series 3 Processors
Avalue Technology Inc., a provider specializing in industrial computer solutions, announces the launch of its next-generation value Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, announces the launch of its next-generation ECM-PTL 3.5" Micro Module, powered by the latest Intel Core Ultra Series 3 processors. Purpose-built for AI-driven edge computing and industrial automation, ECM-PTL brings AI PC architecture to the edge, delivering powerful AI acceleration, enhanced energy efficiency, and advanced heterogeneous computing capabilities.
May 8th, 2026 — Source

Memristor chip merges memory and computing, cutting AI power use by more than half
With a simple click, your hastily taken photo sharpens, a garbled voice message turns into polished text and a chatbot drafts an email in perfect prose. Today's digital tools, enhanced by artificial intelligence (AI), seem to perform magic on demand.
May 8th, 2026 — Source

Computer — Processors — May 7th, 2026

AMD Eyes Samsung 2nm Tech As Alternative In Tackling Wafer Supply Constraints With Talks In "Advanced Stages"
AMD is in advanced talks with Samsung to utilize the company's 2nm technology to produce its next-gen AI CPUs and accelerators.
May 7th, 2026 — Source

AMD preps SR-IOV support for next-gen Ryzen AI XDNA NPUs
AMD Medusa-era Ryzen AI NPUs may support SR-IOV
May 7th, 2026 — Source

AMD Ryzen 7 PRO 9755 Surfaces in Benchmark Leak with 8 Cores for Business PCs
AMD is getting ready to expand its modest lineup of Ryzen PRO 9000 series Zen 5 processors for the enterprise, according to multiple recent leaks. The latest one highlights a not-yet-announced Ryzen 7 PRO 9755 processor with the same core and thread configuration as AMD's existing Ryzen 7 PRO 9745, but with presumably faster clocks.
May 7th, 2026 — Source

AMD's next Epyc server chip debuts this year with 256 cores and 70% better performance
Looking ahead: AMD's Zen 6 architecture is set to debut later this year with the Epyc Venice server processors. The company's CEO recently outlined AMD's ambitions for the lineup and hinted at its broader strategy for future data center processors. Her comments also appeared to offer an early glimpse at what could become the foundation for Zen 7.
May 7th, 2026 — Source

Arm Doubles AGI CPU Revenue Forecast to $2 Billion by 2028 as OpenAI, Cerebras, and Hyperscalers Pile Into Agentic AI Orders
Arm's AGI CPU has seen explosive demand amidst the Agentic AI boom, as the company now reports double the revenue by 2028.
May 7th, 2026 — Source

EU hits snooze on AI Act rules after industry backlash
Brussels says it's simplification, critics may call it retreat
May 7th, 2026 — Source

Intel Core Ultra 5 225 review: Arrow Lake's forgotten CPU needs a price cut
Arrow Lake Refresh isn't pushing down prices the way it should.
May 7th, 2026 — Source

Qualcomm Snapdragon 6 and 4 Gen 5 Debut with Faster Gaming and UI Enhancements
Qualcomm just widened its mobile roadmap with two new chips that aim to make cheaper phones feel less cheap. The Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 promise faster app launches, better gaming, and longer battery life, while pushing Wi‑Fi 7 and newer AI features deeper into the midrange and entry tiers.
May 7th, 2026 — Source

Qualcomm Unveils Snapdragon 6 and 4 Gen 5 Mid-Range Mobile Chips
Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 introduce Snapdragon Smooth Motion UI to enhance device interactions with seamless, lag-free navigation. Snapdragon 6 Gen 5 delivers 20% faster app launches and 18% less screen stutter for more immersive and reliable performance. Focused on the essentials, Snapdragon 4 Gen 5 enables smooth, all‑day responsiveness with 43% faster app launches and 25% less screen stutter.
May 7th, 2026 — Source

Computer — Processors — May 4th, 2026

AMD Ryzen 9 PRO 9965X3D spotted on Passmark — company's first PRO chip with 3D V-Cache also bumps the lineup up to 16 cores
The strongest Ryzen PRO SKU till date?
May 4th, 2026 — Source

AMD Ryzen 9 PRO 9965X3D: 16-Core Leak Reveals 3D V-Cache Enterprise Expansion
Once again, there is evidence to suggest that AMD is readying a Ryzen 9 PRO 9965X3D processor for the enterprise segment. After breaking cover in a shipping manifest earlier this year, the unreleased PRO model has made yet another appearance, this time in a PassMark benchmark run. Assuming it's a legitimate run, the chip marks a couple of first for AMD's PRO lineup.
May 4th, 2026 — Source

AMD Ryzen AI 5 435G APU breaks cover in early benchmarks — six-core Zen 5 chip goes head-to-head with the Ryzen 5 8600G for budget PC builders
AMD has already unveiled its latest Ryzen AI 400 desktop processors. These new Zen 5 chips are available exclusively to OEMs, but they still compete with today's best CPUs. Early benchmarks for the Ryzen AI 5 435G, shared by Gray, indicate that the Ryzen AI 400 series is on the verge of release and could shake up the budget desktop market.
May 4th, 2026 — Source

AMD Ryzen AI 5 435G non-PRO appears on Geekbench, performance close to Ryzen 5 8600G
AMD Ryzen AI 5 435G appears with 6 cores and Radeon 840M graphics
May 4th, 2026 — Source

AMD Ryzen AI Max+ PRO 495 APU could arrive with 192GB of unified memory — leaked PassMark benchmarks suggest modest update over Strix Halo
AMD is potentially working on introducing a new flagship APU as the Ryzen AI Max+ PRO 495 was recently listed on PassMark's benchmark database. The unconfirmed chip is expected to be a part of the company's upcoming "Gorgon Halo" lineup and a successor to the existing Strix Halo flagship, the Ryzen AI Max+ PRO 395. It is worth mentioning that the primary difference between the PRO and non-PRO variants is the target market.
May 4th, 2026 — Source

AMD Ryzen AI Max+ PRO 495 "Gorgon Halo" APU Appears with Radeon 8065S
AMD's upcoming APU refresh with the Ryzen AI Max 400 series is divided into "Gorgon Point" and "Gorgon Halo." Today, we see one of the first "Gorgon Halo" APUs appearing in online benchmark databases. The AMD Ryzen AI Max+ PRO 495 "Gorgon Halo" APU, featuring 16 cores and 32 threads based on the current "Zen 5" CPU architecture, has landed in the PassMark testing database. These cores can reach a boost frequency of up to 5.2 GHz, which is about a 100 MHz improvement over the current "Strix Halo" APU generation.
May 4th, 2026 — Source

AMD's Entry-Level Ryzen AI 5 435G Matches Ryzen 5 8600G in Leaked Benchmark, Despite Running Well Below Its Boost Clock
AMD's upcoming Ryzen AI 5 435G Desktop APU has leaked out, showcasing benchmark performance similar to Ryzen 8000G APUs.
May 4th, 2026 — Source

AMD's Server CPU Revenue Set To Surge 80% This Year, With An Estimated 1.9M AI GPUs Shipping By 2027
AMD's immense success for its CPUs and GPUs in the AI segments will be a key driver for the company in the current year & the years ahead.
May 4th, 2026 — Source

First benchmarks emerge for AMD Ryzen AI 5 435G AM5 desktop APU
A benchmark entry for AMD's Ryzen AI 5 435G has appeared in the Geekbench database, marking the first public performance data for the upcoming Ryzen AI 400 desktop series.
May 4th, 2026 — Source

Intel Core 9 273PQE with 12 P-cores beats Core i9-14900K in several gaming tests
Core 9 273PQE gaming tests show up to 10% lead over Core i9-14900K
May 4th, 2026 — Source

Computer — Processors — April 27th, 2026

AMD EXPO 1.2 Enables CUDIMM DDR5 Memory Support On Next-Gen Ryzen CPUs, Current CPUs Only Support "Bypass" Mode
AMD is enabling CUDIMM DDR5 memory support with new AGESA updates & upcoming EXPO 1.2 tech, but only next-gen Ryzen CPUs will enable it.
April 27th, 2026 — Source

China's LineShine Supercomputer To Hit 2 ExaFlops With 47,000 CPUs and Zero Reliance on Foreign Chips
China has unveiled its new supercomputer, called LineShine, in Shenzen, which will deliver 2 ExaFlops of compute performance.
April 27th, 2026 — Source

Intel Core 5 320 "Wildcat Lake" laptop beats Apple A19 chip in mulit-core test
Intel Wildcat Lake reaches 15,222 points in Multi-core PassMark test, but lags behind Apple A19 Pro in single-core
April 27th, 2026 — Source

Intel Is Now Selling CPU Dies It Used to Throw in the Trash, as AI Demand Turns Scrap Into Profits
Intel is not only rolling right now, but also operating smartly, driving its revenue up by salvaging CPU dies and selling them off to hungry AI customers.
April 27th, 2026 — Source

Kingston Launches DC3000ME 30.72 TB U.2 NVMe Gen 5 SSD
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the launch of the Kingston DC3000ME Gen 5 U.2 NVMe SSD with a new high-capacity 30.72TB1 option, expanding the DC3000ME family to address the growing storage density and performance demands of modern data centers.
April 27th, 2026 — Source

Kingston Pushes Enterprise Storage Ceiling With 30.72 TB Gen 5.0 SSD Hitting 14 GB/s as AI Data Centers Scale
Kingston has launched a large capacity Gen 5.0 U.2 SSD for data centers, featuring up to 14 GB/s of sequential read speeds.
April 27th, 2026 — Source

Noctua Drops Public CAD Files For Its Fans, But Quietly Tweaked The Blade Geometry To Block 3D-Printed Clones
After Noctua announced its fan 3D CAD models for public usage, it clarified that these aren't meant for 3d printing.
April 27th, 2026 — Source

Stable nanomagnets under extreme laser heat could speed up data storage
For the first time, researchers have mapped how the boundaries of magnetic nanostructures behave on extremely short timescales. The work shows that these boundaries are much more stable than previously thought.
April 27th, 2026 — Source

TerraMaster Launches Waterproof and Crush Resistant D1 SSD Rugged Enclosure
The Professional storage brand TerraMaster today officially introduces the all-new rugged portable SSD enclosure—D1 SSD. Designed for users who demand both data security and high-speed performance, the D1 SSD features an aircraft-grade all-metal chassis, IP67 water and dust resistance, and 1.2-ton crush resistance. Combined with high-speed data transfer, silent cooling, and broad platform compatibility, it becomes an ideal storage companion for photographers, outdoor professionals, and mobile workers.
April 27th, 2026 — Source

Computer — Processors — April 26th, 2026

AMD Ryzen 5 7600X3D review: An unbeatable value gaming CPU
There isn't another gaming CPU at this price that can match the Ryzen 5 7600X3D's prowess.
April 24th, 2026 — Source

AMD Ryzen 9 9950X3D2 appears in Amazon's top 10 CPU best sellers
Despite mixed reviews, AMD's most expensive AM5 desktop CPU briefly appeared among Amazon's top 10 best-selling CPUs
April 24th, 2026 — Source

AMD Ryzen 9 9950X3D2 Reaches Amazon's Top 10 Best-Selling CPUs Despite High Price
The Ryzen 9 9950X3D2 launched with a suggested price of $899 and is currently in tenth place in the sales ranking. What stands out the most is that this chip, built with double-stacked 3D V-Cache, is more popular than any current Intel processor.
April 24th, 2026 — Source

Intel Has a New Plan to Compete With AMD's Ryzen X3D Gaming CPUs
Intel has decided to completely change its CPU roadmap for the next five years in the desktop PC market. The company now has one clear goal: to take back the gaming performance lead and compete directly with AMD's successful Ryzen X3D processors.
April 24th, 2026 — Source

Intel reportedly says it boosted yields by selling what would normally be 'scrap' or 'low-expectation' CPUs — customers more willing to accept lesser chips due to overwhelming CPU demand
Companies are buying everything — even somewhat defective chips.
April 24th, 2026 — Source

Intel's upcoming Xeon 7 'Diamond Rapids' server CPUs reportedly delayed to 2027 — Next-gen Coral Rapids lineup lands 2028 but can be accelerated, according to new leak
A shakeup in Intel's future Xeon families.
April 24th, 2026 — Source

Russian-Chinese Irtysh CPU runs The Witcher 3 at 22-38 FPS with Radeon RX 9060 XT
The Witcher 3 runs on exotic Irtysh CPU
April 24th, 2026 — Source

Computer — Processors — April 24th, 2026

AMD launched a monster chip. But Intel made the bigger splash
Intel is finally rethinking who 'enthusiast' hardware is for.
April 24th, 2026 — Source

AMD's Flagship Ryzen 9 9950X3D2 Outsells Every Intel CPU On Amazon As X3D Chips Dominate Top 10
The newly launched flagship CPU has already entered the top 10 best-selling CPUs on Amazon and could eventually move up on the chart.
April 24th, 2026 — Source

ASRock presents Ryzen 9 9950X3D2 as an overclocking CPU
Not gaming, not workstation, but an overclocking CPU, thinks ASRock
April 24th, 2026 — Source

CPU requirements for AI workloads are multiplying, driving intensifying shortages and price hikes — Intel already shifting production from consumer chips to Xeon as inference workloads drive server CPU ratios back toward parity with GPUs
Intel says CPU-to-GPU deployment ratios have tightened from 1:8 to 1:4, and could reach 1:1.
April 24th, 2026 — Source

Intel beats expectations for the sixth straight quarter as AI demand for CPUs surges
Q1 revenue of $13.6 billion beat the $12.4 billion consensus by 9.4%. Data Centre and AI revenue rose 22% to $5.1 billion. Non-GAAP EPS of $0.29 beat the 1-cent consensus by a factor of 29. The stock is up more than 80% this year. Intel is working with Elon Musk on his planned Terafab chip facility.
April 24th, 2026 — Source

Intel bets the farm on AI inference to drag CPU back to the top table
Chipzilla hopes agents, robots, and edge devices make CPUs cool again... now it has to build the chips
April 24th, 2026 — Source

Intel Crushes Earnings as Stock Soars on Xeon CPU and Foundry AI Demand
Intel's share price is surging ahead of today's opening bell after the chip maker posted financial results for its first quarter of fiscal 2026. For the sixth quarter in a row, Intel's earnings beat expectations, this time with Intel posting $13.6 billion in Q1 revenue for a 7% year-over-year gain, including $5.1 billion from its Data Center and AI (DCAI) segment.
April 24th, 2026 — Source

Intel Says Software Optimization Limits E-Core Gaming Performance Gains
Intel has addressed ongoing discussions around gaming performance on its hybrid CPUs, with Vice President Robert Hallock stating that the gap with Advanced Micro Devices is primarily driven by software limitations rather than hardware design. According to Hallock, efficiency cores are not responsible for reduced gaming performance, despite claims suggesting that disabling them can improve results. Intel's internal observations indicate that enabling or disabling E-cores typically results in only marginal differences, around one percent.
April 24th, 2026 — Source

Intel stock jumps 28%, setting a record, after it posts strong Q1 with rising forecasts — Intel says yields are improving faster than expected with new nodes
Intel's results beat forecasts and expectations.
April 24th, 2026 — Source

Intel Z970 Chipset for "Nova Lake-S" to Cover Much of the B860 Motherboard Segment
Intel's upcoming "Nova Lake" Core Ultra 400 series processors will introduce not only a new CPU platform and socket but also a new motherboard chipset segmentation, unlike anything we have seen from Team Blue. According to a well-known leaker, Jaykihn, the new Z970 chipset platform is set to take over much of the space currently reserved for B860 motherboards. Meanwhile, B960 is expected to be positioned lower in the lineup as a value-focused option, often used by Intel's OEM partners for all-in-one builds or mini-PCs.
April 24th, 2026 — Source

Intel's CPU supply is recovering just in time for the agentic AI wave
The CPU shortage is improving, but you might not see the effects quite yet.
April 24th, 2026 — Source

Meta Is Adding Tens of Millions of AWS Graviton Cores To Its Compute Portfolio As Agentic AI Becomes "Almost As Big a CPU Story As A GPU Story"
Meta has partnered with Amazon's AWS to bring tens of millions of Graviton CPU cores to its AI compute portfolio for Agentic AI.
April 24th, 2026 — Source

NEO Semiconductor's revolutionary 3D X-DRAM for AI processors has passed proof-of-concept validation — company secures funding to develop next-gen memory HBM alternative
Next-gen memory designed as a lower-cost, lower-power HBM alternative for AI workloads
April 24th, 2026 — Source

Qualcomm's Datacenter CPU Rumor Comes Just In Time As Agentic AI Goes In Hyperdrive Mode
Qualcomm is rumored to be preparing a brand new datacenter CPU, which will be just in time to power growing Agentic AI needs.
April 24th, 2026 — Source

Computer — Processors — April 23rd, 2026

AI model automates etch profile analysis for faster MEMS manufacturing
A physics-constrained AI model called VLSet-AE automates feature extraction from DRIE cross-sections with 96 percent accuracy, replacing slow manual SEM analysis in MEMS fabrication.
April 23rd, 2026 — Source

Alphacool Announces New Apex Manifold 360
Alphacool International GmbH from Braunschweig is a pioneer in PC water-cooling technology. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is once again expanding its portfolio with the new Apex Manifold 360 mm.
April 23rd, 2026 — Source or Source

Cooler Master debuts minimalist Atmos II Stealth AIO
Cooler Master is expanding its AIO cooling lineup with the MasterLiquid Atmos II Stealth series, available in both 240mm and 360mm configurations. This new iteration strips away the flashy RGB lighting in favour of a clean, professional aesthetic that blends into modern minimalist builds.
April 23rd, 2026 — Source

First Intel Wildcat Lake laptop spotted in the wild, geared to compete with MacBook Neo — features an aluminum chassis with 11W fanless mode
Wildcat Lake is Intel's new budget lineup intended for entry-level and edge.
April 23rd, 2026 — Source

Intel Core Ultra 5 250K Plus versus Intel Core Ultra 5 245K CPU Review
The Intel Core Ultra 5 250K Plus was launched alongside the Intel Core Ultra 7 270K Plus on March 26th, 2026. Both of these new CPUs are part of the new Intel Core Ultra 200S Plus desktop CPU series "Arrow Lake Refresh" launched for current generation socket LGA1851 motherboards.
April 23rd, 2026 — Source

Intel's Z970 Chipset Will Cover Both the Z890 High-End and B860 Mainstream Tiers for Nova Lake
Intel's upcoming Z970 motherboards for Nova Lake-S Desktop CPUs will replace both high-end Z890 and mainstream B860 options.
April 23rd, 2026 — Source

More Intel CPUs Could Be Overclockable in Future Generations
Alongside more cores, bigger cache, and better socket longevity, Intel is listening to gamers more than ever.
April 23rd, 2026 — Source

TSMC Maps Out A13 "1.3nm" & A12 "1.2nm" Nodes For 2029, Sidesteps ASML's Priciest EUV Tools For Now
TSMC has presented its latest technology roadmap through 2029, bringing advanced processes such as A13 and A12 by 2029.
April 23rd, 2026 — Source

TSMC Says Low-NA EUV Will Carry It Further, Delaying High-NA Adoption
Yesterday, TSMC unveiled its latest A13 node preview at the North America Technology Symposium, highlighting the company's ongoing developments. However, the most significant news isn't about a new node but the technology behind it. TSMC announced it would rely on older ASML Low-NA EUV tools instead of the more expensive High-NA EUV scanners.
April 23rd, 2026 — Source

Where to buy AMD's Ryzen 9 9950X3D2 — more L3 cache and dual 3D V-cache-stacked CCDs
Updates on where to find the AMD Ryzen 9 9950X3D2 at your favorite retailer
April 23rd, 2026 — Source

Computer — Processors — April 21st, 2026

AMD Ryzen 9 9950X3D2 Dual Edition processor review
208MB Cache Monster Redefines Desktop Performance
April 21st, 2026 — Source

AMD Ryzen 9 9950X3D2 Dual Edition Review
When AMD announced the Ryzen 9 9950X3D at CES 2025 we immediately demanded a version with 3D V-Cache on both chiplets, and we even suggested the name 'Ryzen 9 Lisa Su Edition'. A full year later and we finally have the CPU that we wanted and it comes with a clanger of a name, 'AMD Ryzen 9 9950X3D2 Dual Edition'. Let's park that thought, dive into the silicon and see what AMD has created.
April 21st, 2026 — Source or Watch Video

AMD Ryzen 9 9950X3D2 Dual Edition Review: Rising A Bit Higher
AMD's Ryzen 9000 series desktop processors are by now well into the second half of their lifecycle as AMD's leading-edge desktop chips. With a complete product stack in play -- ranging from 6 up to 16 CPU cores on a single chip -- In most generations, this would be where AMD would stand pat on their chip lineup, tweak prices, and otherwise ride out the rest of the generation with a fully ramped and readily available product family.
April 21st, 2026 — Source

AMD Ryzen 9 9950X3D2 Review Roundup
AMD's Ryzen 9 9950X3D2 is a new top-end AM5 desktop processor built around a dual 3D V-Cache design. It features 16 Zen 5 cores, 32 threads, up to 5.6 GHz boost, a 200W TDP, and 208MB of total cache, split between 192MB of L3 and 16MB of L2.
April 21st, 2026 — Source

AMD Ryzen 9 9950X3D2 review: More cache, more cash
A terrible value, but one of the most unique CPUs we've ever reviewed.
April 21st, 2026 — Source

AMD Ryzen 9 9950X3D2 Review: Twice the 3D V-Cache
The New Ryzen Flagship, Benchmarked
April 21st, 2026 — Source

AMD's Ryzen 9 9950X3D2 Dual Edition tested: Gratuitous overkill with a price to match
Ever since AMD's cache-stacked Ryzen 7 5800X3D closed the gap with Intel in gaming, folks have wondered: if one V-Cache chiplet is good, surely two must be better. With the launch of the Ryzen 9 9950X3D2 Dual Edition (DE), we finally have our answer.
April 21st, 2026 — Source

Intel hints at unlocked budget CPUs, Robert Hallock says more OC SKUs are planned
Intel may bring CPU overclocking to lower-priced desktop chips
April 21st, 2026 — Source

Intel Will No Longer Limit Overclocking To High-End SKUs, Plans To Include More Unlocked CPUs With Future Lineups
Intel's Unlocked CPUs have been restricted to high-end desktop models, but that is about to change as the company plans overclocking support on more SKUs.
April 21st, 2026 — Source

Computer — Processors — April 17th, 2026

AMD Reportedly Plans Ryzen 7 5800X3D Anniversary Edition Comeback for AM4
AMD may be preparing to reintroduce the Ryzen 7 5800X3D processor, according to recent leak information suggesting the chip will return as part of an anniversary edition lineup. While the company has not confirmed the plan, the leak points toward a re-release of the original 2022 processor without any hardware changes. The move would mark a notable extension of the AM4 platform lifecycle, which continues to see strong user adoption. The Ryzen 7 5800X3D originally gained attention as AMD's first desktop processor to feature 3D V-Cache technology.
April 17th, 2026 — Source

AMD Ryzen 7 5800X3D 10 Year AM4 Anniversary Edition Spotted
It's real, and if you have been waiting to upgrade your AM4 system, you will soon be able to upgrade to the fastest gaming processor in the Ryzen 5000 lineup.
April 17th, 2026 — Source

AMD Ryzen 7 5800X3D 10th AM4 Anniversary Edition box appears in new leak
AMD Ryzen 7 5800X3D return leak now includes retail box image
April 17th, 2026 — Source

AMD Ryzen 7 5800X3D AM4 10th Anniversary Edition Box Pictured
Here's the first picture of the retail package of the AMD Ryzen 7 5800X3D AM4 10th Anniversary Edition desktop processor. This is essentially a fresh production run of the Ryzen 7 5800X3D that was originally launched in 2022 in response to Intel's 12th Gen Core "Alder Lake" series launch, and discontinued in 2023 once the company had completed launch of its Ryzen 7000 series "Zen 4" processors. AMD is commemorating 10 years of the Socket AM4 platform with the fastest processor for gaming on this socket. Existence of this processor was leaked earlier this week. We'd known that it's the same exact chip as the one from 2022, with the same OPN, but in a retail box with special box-art.
April 17th, 2026 — Source

AMD Zen 7 Leak Reveals Major IPC Gains And Huge Cache Upgrades
Whatever you think of Moore's Law is Dead, he's just dropped a massive new leak seemingly revealing tons of supposed details about AMD's upcoming Zen 7 architecture and the products that will be based on it. As always, take these leaks with a grain of salt, but if the details hold true, Team Red is preparing a generational leap that relies heavily on advanced 3D stacking, bleeding-edge silicon, and monumental amounts of cache.
April 17th, 2026 — Source

ASRock Expands AIO Cooling Lineup with Challenger LCD and Pro Series Models
ASRock has announced a new series of all-in-one liquid CPU coolers, introducing a total of nine models under its Challenger and Pro product families. The lineup is scheduled to launch on April 24, 2026, and will be available in multiple configurations, including 240 mm and 360 mm radiator sizes. The new products target mainstream desktop users, offering both feature-rich and simplified cooling solutions. The Challenger series forms the centerpiece of this release, particularly the Challenger Digital variants that integrate a 3-inch LCD panel.
April 17th, 2026 — Source

Intel Arc GPU Graphics Drivers 101.8724 WHQL Released
Intel today released its latest Arc GPU graphics drivers with the version 101.8724 WHQL bringing support for new hardware and new games. Yesterday, the company launched its Core Series 3 "Wildcat Lake" processors with up to six CPU cores and two Xe3 GPU cores. Expected to land in over 70 different laptop designs, Intel today enabled full gaming support with the Arc GPU driver update.
April 17th, 2026 — Source

Intel Core Series 3 debuts with up to 6 cores
Intel has announced a new round of Core Series 3 processors for laptops. Aimed at entry-level mainstream laptops and edge computing, these new CPUs use Intel's 18A process node, along with Cougar Cove and Darkmont cores, delivering 40 TOPS of AI performance. Systems from OEM partners are scheduled for release starting this month.
April 17th, 2026 — Source

Intel Hires Senior Samsung Executive to Lead New Foundry Deals
One of the senior executives from Samsung Foundry, Shawn Han, has officially joined Intel Foundry to help secure new customer deals. With over 30 years of experience in the semiconductor industry, Shawn Han has worked through many node designs, transitions to new technologies, and has observed shifts in customer behaviors and trends. He joined Samsung in 1996 as a senior engineer in the Technology Development team, working on multiple nodes, and holds a PhD in Material Science and Engineering from Iowa State University. Over the years, he rose to the position of Executive Vice President at Samsung, where he was responsible for Samsung's U.S. Foundry business, focusing on attracting new customers and securing deals.
April 17th, 2026 — Source

Intel launches Core 7 245HX, first non-Ultra Arrow Lake-HX part
Intel quietly launches Core 7 245HX, specs match Core Ultra 5 235HX
April 17th, 2026 — Source

Intel Wildcat Lake Promises Performance for Entry-Level Laptops
It could help Windows laptops compete more favorably with the ultra-affordable MacBook Neo.
April 17th, 2026 — Source

Intel's new Wildcat Lake chips take aim at the MacBook Neo with AI as the differentiator
Intel has launched its Core Series 3 processors, codenamed Wildcat Lake, in what amounts to a direct response to the MacBook Neo. The new chips, announced on 16 April, target the same budget laptop segment that Apple redefined last month with its $599 machine, and they arrive with a familiar pitch: more choice, more AI capability, and the full weight of the Windows ecosystem behind them.
April 17th, 2026 — Source

Computer — Processors — April 14th, 2026

Intel may bring 12 Xe3P graphics to desktop with new Nova Lake SoC SKU
Intel reportedly considers Nova Lake desktop SoC with 12 Xe3P graphics, gaming-focused chip without discrete GPU
April 14th, 2026 — Source

New terahertz technique lets engineers see inside running processors in real time
Modified lab equipment can map transistor activity inside a live processor without touching it
April 14th, 2026 — Source

Computer — Processors — April 13th, 2026

Huge Intel Nova Lake Leak: Core Ultra 400 Series Packs Up to 52 Cores
If you read this site regularly, you'll already be well-informed about Intel's upcoming Nova Lake family of processors; at least, as well-informed as it's possible to be from early leaks and rumors. We have another such leak on the news desk today, this time coming from Videocardz, which has exclusively leaked what it calls a "preliminary SKU list" for the Core Ultra 400 series. Indeed, this is Nova Lake-S, the next desktop CPU family from Intel.
April 13th, 2026 — Source

Intel Core Ultra "Nova Lake-S" Desktop Core Configurations Surface
CPU core configurations of Intel's next-generation Core Ultra Series 4 "Nova Lake-S" desktop processors were leaked to the web by VideoCardz. These processors will remain disaggregated, tile-based chips, much like current Core Ultra Series 2 "Arrow Lake-S," but Intel will probably rearrange components around the various tiles. These chips will also introduce low-power island E-cores (LPE-cores) to the socketed desktop platform. The new processors will be designed for Socket LGA1954, which will be significantly different from the current LGA1851, while retaining cooler compatibility.
April 13th, 2026 — Source

This Insane 15-Fan Noctua Superdome Slashes Gaming Temps By 20C
The owner of YouTube channel Major Hardware is showing off a cooling mod that incorporates no less than 15 Noctua fans assembled into a 'Superdome' of cooling power, and it works remarkably well. How well? Compared to using a traditional tempered glass side panel, the superdome mod kitted with over a dozen fans knocked temps down by around 20°C. Impressive!
April 13th, 2026 — Source

TSMC To Rule The 2nm Market With An Iron Fist, As Samsung Falters In Its Progress, Next-Generation Process Yields Dropping To Subpar Levels
Samsung may have entered the 2nm race with TSMC, but it is far from competing with its rival on an even playing field, despite being considered a viable option for many customers. According to the latest report, the South Korean foundry has hit a progression barrier with its 2nm GAA technology, with the latest estimate stating that its yields remain in the mid-50 percent range. What's worse is that the figure is expected to drop to 40 percent once back-end processes are completed. In short, the 60 percent yields of its 2nm GAA process may not have been accurate.
April 13th, 2026 — Source

We Tested Every Ryzen 5 and 7 X3D CPU: From 5800X3D to 9800X3D
Gaming's Greatest CPUs
April 13th, 2026 — Source

Why we spent 50+ hours retesting Intel's Core Ultra 270K Plus and 250K Plus
The results didn't add up at first, but the 270K Plus and 250K Plus really do punch above their weight class.
April 13th, 2026 — Source

Computer — Processors — April 11th, 2026

Intel Core Ultra 7 270K Plus versus Ryzen 7 9700X faceoff — a new midrange CPU champ emerges
Both around $300, but two very different CPUs.
April 11th, 2026 — Source

Computer — Processors — April 9th, 2026

AMD confirms $899 price tag for Ryzen 9 9950X3D2 Dual Edition
A couple of weeks ago, AMD officially announced the Ryzen 9 9950X3D2 Dual Edition processor, combining two stacks of 3D V-Cache in one chip. This is going to be AMD's top-end Ryzen desktop processor, so we expected it to be expensive, but the exact cost remained elusive. That changed this week with AMD revealing an $899 price tag.
April 9th, 2026 — Source

Dimensity 9600 Pro Specifications Leak Point Towards A Major Flagship Chipset Release To Challenge Both Apple & Qualcomm This Year
MediaTek appears to go 'all out' with the Dimensity 9600 Pro, as its first 2nm chipset's specifications have been revealed, highlighting that the company's best silicon is yet to be introduced. By leveraging TSMC's latest and greatest N2P node, the Taiwanese fabless semiconductor manufacturer has not just targeted a higher frequency but has also changed the CPU cluster and paired this configuration with a new GPU. In short, we're getting one blockbuster of an upgrade later this year, at least on paper.
April 9th, 2026 — Source

Geekbench 6.7 adds Intel BOT detection to spoof out 'unrealistic' CPU scores — Benchmark runs with BOT enabled will be marked as invalid
Panther Lake & Arrow Lake Refresh chips affected
April 9th, 2026 — Source

Google wants more Intel inside ... its datacenters, taps Chipzilla for more SmartNICs
Custom ASIC biz now running at a $1B annual pace for Intel
April 9th, 2026 — Source

Instructions Per CPU Clock Cycle: Apple's A19 Pro Chip Beats Dimensity 9500 By 13%, Snapdragon 8 Elite Gen 5 By 10%, And Exynos 2600 By 6%
We all know Apple's A-series chips are some of the most efficient consumer-grade processors in the market, with the new A19 Pro chip also meticulously adhering to this well-established pattern.
April 9th, 2026 — Source

Intel and Google announce multi-year chip deal — Google will deploy Intel Xeon with custom IPUs for next-gen AI, cloud infrastructure
Intel and Google on Thursday announced a multi-year collaboration under which Google will continue deploying Intel Xeon platforms for its next generation of AI and cloud infrastructure. These platforms will rely not only on Intel's upcoming Xeon CPUs, but also on custom infrastructure processing units (IPUs) co-designed by Intel and Google. The announcement comes amid the accelerating adoption of custom Arm-based processors for AI workloads.
April 9th, 2026 — Source or Source or Source

Intel developing two-lever retention mechanism for LGA 1954 socket, according to new leak — Premium Nova Lake-S motherboards will feature 2L-ILM sockets
Previously, the LGA 2011 socket used a dual-lever design.
April 9th, 2026 — Source

Intel Nova Lake to Introduce Dual CPU Socket Retaining Arms
It will reportedly flatten IHS contact, improving thermal transfer for lower operating temperatures.
April 9th, 2026 — Source

Intel Nova Lake will reportedly use a dual-lever socket for improved cooler contact
For a long time now, Intel's CPU sockets have used a single-lever system to lock the chip into place. Apparently for the next generation Nova Lake chips, Intel will go back to embracing a dual-lever mechanism, which will also allow Intel to make the IHS on top of the CPU flatter.
April 9th, 2026 — Source

Intel "Nova Lake-S" Uses 2L-ILM Socket for Better CPU Cooler Contact
In the latest series of leaks about Intel's upcoming "Nova Lake" chips, we learn that the desktop "Nova Lake-S" designs will feature a new socket mounting and independent loading mechanism (ILM). According to exclusive information from VideoCardz, the NVL-S desktop designs on the LGA-1954 socket will include a new 2L-ILM socket mechanism to improve contact with CPU coolers. Given that Intel's upcoming NVL-S desktop processors will have up to 52 high-frequency, power-hungry cores, a better mounting mechanism is definitely needed. This 2L-ILM is a two-level independent loading mechanism, using one lever on each side of the CPU to secure it into the LGA-1954 socket. Applying pressure on both sides of the socket ensures improved flatness while the locking mechanism does its job.
April 9th, 2026 — Source

Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited, EMIB-T is preparing for advanced AI accelerator designs
Intel CFO hints at "billions per year" in packaging deals as CoWoS-L is fully booked.
April 9th, 2026 — Source

TSMC's Chipmaking Edge Is So Strong That Competitors Are Fighting to Work with Its Supply Chain Partners, Viewing Them as a Winning Bet
TSMC's dominance over the semiconductor industry also stems from how disciplined its supply chain partners have become, and rivals are now looking to capitalize on this edge.
April 9th, 2026 — Source

Computer — Processors — April 8th, 2026

AMD Ryzen 9 9950X3D2 gets official $899 MSRP, 29% above 9950X3D
AMD has now confirmed the official MSRP for its Ryzen 9 9950X3D2 Dual Edition processor. According to a post by David McAfee, AMD's VP and GM of Ryzen CPU and Radeon graphics, the new flagship desktop CPU will be available on April 22 for $899.
April 8th, 2026 — Source

AMD Ryzen 9 9950X3D2 listed at £830 in the UK, retailer says pricing NDA has lifted
According to a post by Overclockers UK staff member Gibbo on the retailer's official forums, AMD's Ryzen 9 9950X3D2 Dual Edition is currently being priced at £829 including VAT in the UK. Gibbo said the pricing NDA is up today, but added that AMD still has not provided a confirmed MSRP.
April 8th, 2026 — Source

ASUS increases Qualcomm Snapdragon X2 Elite laptop prices just hours after reviews go live
Snapdragon X2 Elite laptops see sudden price increase of up to $350 higher after launch reviews
April 8th, 2026 — Source

Exynos 2700 Undergoing Early Testing To Provide A More Polished Experience Over Exynos 2600, As SoC Gets Spotted In New Leak
The Exynos 2600 may have ushered in the first step towards Samsung obtaining self-reliance in smartphone chipset development, but there is still significant room for improvement, as issues lingering with the company's first 2nm GAA SoC could be addressed by its immediate successor, the Exynos 2700. This may explain why the latter has been spotted in the latest Geekbench listing, indicating that Samsung wishes to put the silicon through some early paces to introduce better optimization ahead of its launch in the Galaxy S27 series.
April 8th, 2026 — Source

Intel and SambaNova Advance Agentic AI with Xeon 6
SambaNova today announced the next phase of its collaboration with Intel: a heterogeneous hardware solution that combines GPUs for prefill, Intel Xeon 6 processors as both host and "action" CPUs, and SambaNova RDUs for decode to deliver premium inference for the most demanding Agentic AI applications. The design will be made available in H2 2026 to enterprises, cloud providers, and sovereign AI programs that want to run coding agents and other agentic workloads at scale.
April 8th, 2026 — Source

Intel's Nova Lake-S lineup may include 44-core CPU
The roadmap for Intel's next-generation Nova Lake-S desktop processors is becoming clearer. According to the latest reports, Intel has revised its Core Ultra 9 Nova Lake-S desktop configurations, bumping the core count of the 42-core dual-compute-tile SKUs to 44 cores.
April 8th, 2026 — Source

"Raptor Lake will continue to be abundantly available": Intel exec makes a case for its older chips as RAM prices soar, but are they actually worth buying in 2026?
With RAM prices still stuck in orbit, older CPUs that support DDR4 RAM are becoming ever more attractive. Intel clearly wants to take advantage.
April 8th, 2026 — Source

Computer — Processors — April 6th, 2026

AMD Ryzen 9 9950X3D2 Early Retail Listings Point To Steep $1,000 Price
A handful of online retailers have jumped the gun and posted product pages for AMD's Ryzen 9 9950X3D2 processor, and if the attached prices are accurate, the upcoming flagship will command in the neighborhood of $1,000 when it officially releases to retail on April 22. Of course, we won't actually know for sure until (A) the chip actually releases in two-plus weeks, or (B) AMD announces the price beforehand.
April 6th, 2026 — Source

Canadian Listings of Ryzen 9 9950X3D2 Indicate Near-$1000 US Pricing
Canadian online retailers have started putting up early listings of the AMD Ryzen 9 9950X3D2 Dual Edition desktop processor, which was launched earlier this month, but without a price announcement. The processor will start selling from April 22, 2026. Ahead of this date, Canadian retailers, ShopRBC and PC-Canada, listed the processor. ShopRBC listed it for CAD $1,375, while PC-Canada had it up for CAD $1,374.
April 6th, 2026 — Source

Intel confirms our leak, Core Ultra X9 378H Panther Lake CPU launched
Intel adds another 16-core CPU with Arc B390 graphics
April 6th, 2026 — Source

Intel Core Ultra 7 251HX Debuts With 18 CPU Cores And Cut-Down 3-Core Xe GPU
Intel's Core Ultra 271HX mobile processor based on Arrow Lake-HX is now official, with Intel confirming the chip's existence after it was spotted in gaming laptop listings last month. That also means we have confirmation on the newest Arrow Lake-HX part's specifications, which slots between the Core Ultra 5 245HX with 14 cores (6P + 8E) and Core Ultra 7 255HX with 20 cores (8P + 12E).
April 6th, 2026 — Source

Intel Nova Lake uses Xe3 and Xe3P graphics, no elements of Xe4
Jaykihn clarifies Intel Nova Lake has no Xe4 parts, only Xe3 and Xe3P
April 6th, 2026 — Source

Intel says Raptor Lake is "not going anywhere", hints at more DDR4/DDR5 hybrid boards
Intel points to longer Raptor Lake life
April 6th, 2026 — Source

Intel Says Raptor Lake Will Remain a "Big" Part of Its Strategy
In an interview with Club386, Robert Hallock, Intel's VP and General Manager of Technical Marketing for the Client Segment, said that the company will continue to back its Raptor Lake processors and that they are not going anywhere.
April 6th, 2026 — Source

Intel Serpent Lake Could Feature Nvidia RTX Integrated Graphics
Future Intel SoCs known as Serpent Lake could mark a major turning point by integrating, for the first time, an Nvidia RTX integrated GPU, combining Intel's x86 computing power with the graphics architecture of the green team.
April 6th, 2026 — Source

Intel Serpent Lake SoCs To Feature NVIDIA RTX GPU Tile, Next-Gen P-Core uArch is Copper Shark
Intel Serpent Lake CPUs are expected to be the first to utilize an NVIDIA RTX GPU tile, while Copper Shark is revealed as a next-gen P-Core architecture.
April 6th, 2026 — Source

Intel To Continue Focus On Raptor Lake CPUs & Hybrid DDR5/DDR4 Motherboards As PC Building Costs Rise
Intel has said that it will continue to focus on Raptor Lake CPUs, as it is a core part of its PC strategy, as the costs to build a PC continue to rise.
April 6th, 2026 — Source

Nova Lake Wins on IPC, Zen 6 on Frequency: Rumor
This will make for a spicy face-off later this year.
April 6th, 2026 — Source

Razor Lake-AX to use socket larger than current desktop series, Intel's next-gen chip with big graphics
Intel Razor Lake-AX with BGA4326 socket -- potential AMD Halo and Apple M Pro+ series competitor
April 6th, 2026 — Source

Display Driver Uninstaller (DDU) download version 18.1.5.2
Download Display Driver Uninstaller DDU (official) - The latest release of Display Driver Uninstaller (DDU), version 18.1.5.2 The popular tool Display Driver Uninstaller (DDU) has just been updated. This utility is widely used by PC enthusiasts and technicians for completely removing graphics drivers and related files when switching between GPUs or troubleshooting driver issues. The new release focuses on improving driver cleanup, especially for AMD hardware, and includes some important fixes for Windows configurations.
April 6th, 2026 — Source

DLSS 5 announcement video taken offline by Italian TV copyright block
DLSS5 can't catch a break: YouTube blocks NVIDIA DLSS 5 launch video in some countries after La7 match
April 6th, 2026 — Source or Source

Intel Launches Core Ultra 7 251HX Arrow Lake Processors with 18 CPU Cores and 3 Xe GPU Cores
Intel has quietly added the Core Ultra 7 251HX to its Arrow Lake HX lineup, skipping any formal announcement. The chip simply appeared on the Intel website a few weeks after it surfaced in Lenovo Legion 5i 2026 and MSI Raider 16 HX listings. The 251HX is an 18-core, 18-thread part with 6 Performance cores and 12 Efficient cores, slotting between the Core Ultra 5 245HX and the Core Ultra 7 255HX. Compared to the 255HX, it drops two P-cores and loses two threads, but keeps the same 12 E-cores and 30 MB of Smart Cache.
April 6th, 2026 — Source

Intel Nova Lake CPUs Feature Xe3 Graphics & Xe3P Display/Media Engines
Intel Nova Lake CPUs will feature Xe3 graphics and not Xe4 as previously expected, but will offer Xe3P Media & Display engines.
April 6th, 2026 — Source

Intel "Nova Lake" to Use Xe3 Graphics and Xe3P Display/Media Engine
Intel's upcoming "Nova Lake" CPU generation, part of the Core Ultra 400 series, will be a major refresh of the company's P and E-core hybrid design. While many specifications have been largely leaked, the exact integrated GPU configuration remained a mystery until now. One of the most reliable Intel leakers, Jaykihn, has revealed that Intel plans to use the Xe3 generation of graphics, which is found in the current "Panther Lake" Arc B300 series of integrated GPUs. The display and media engine will come from the Xe3P "Crescent Island."
April 6th, 2026 — Source

NVIDIA Pascal turns 10, the architecture that gave us GeForce GTX 1080 Ti
NVIDIA Pascal turns 10, from Tesla P100 to GeForce GTX 1080 Ti
April 6th, 2026 — Source

Computer — Processors — April 3rd, 2026

EK recommends water cooling for AMD's 200W Ryzen 9 9950X3D2, says air cooling may leave performance on the table
Water cooling company says liquid cooling is recommended for AMD's first 200W desktop CPU
April 3rd, 2026 — Source

Intel Core 9 273PQE User Finally Succeeds To Boot Into Windows Using Consumer-Grade Z790 Motherboard
After patching the BIOS, the user managed to make the Bartlett Lake P-core-only chip work on the conventional LGA 1700 platform.
April 3rd, 2026 — Source

Intel May Raise Consumer CPU Prices by Up to 30% in 2026
Intel could raise the prices of its consumer processors by as much as 30% during 2026, according to new information coming from the supply chain. If confirmed, this would be bad news for the PC gaming market, and especially for Intel, which had started to regain some interest with its new Core Ultra 200S Plus chips and the growing expectations around Arrow Lake Refresh.
April 3rd, 2026 — Source or Source

Intel Nova Lake-AX leak shows massive socket and 48 Xe cores
Early details on Intel Nova Lake-AX have surfaced through shipping manifest data, pointing to a processor design that differs significantly from typical mobile or desktop configurations. The leak highlights a combination of a large integrated GPU and an unusually large socket, suggesting a platform aimed at high-performance or workstation-class use. One of the most notable specifications is the integrated graphics subsystem. According to the manifest, Nova Lake-AX may feature up to 384 execution units, equivalent to 48 Xe cores.
April 3rd, 2026 — Source

Modder Gets Intel Core 9 273PQE Bartlett Lake Chip to Boot to Windows
The USB stumbling block has been hurdled. Benchmarking comes next.
April 3rd, 2026 — Source

Report claims Arm chips will power 90% of AI servers based on custom processors in 2029 — x86 and RISC-V on the outside looking in
Should AMD and Intel get more flexible?
April 3rd, 2026 — Source

Slay the Spire 2 Beta Patch 0.102.0 Released
The Slay the Spire 2 development team has pushed out a significant update to the ongoing beta, bringing with it a hefty list of balance changes and a fundamental rework of the Ascension system. Patch v0.102.00 focuses heavily on refining the experience for the Silent and the Necrobinder, while also addressing mechanics that felt a bit too random or opaque for high-level players.
April 3rd, 2026 — Source

Computer — Processors — April 2nd, 2026

Alphacool Announces New APEX Series CPU+VRM Monoblocks
Alphacool International GmbH from Braunschweig is a pioneer in PC water-cooling technology. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is once again expanding its portfolio with the long-awaited Apex Monoblocks. The monoblocks combine high cooling performance with an elegant design that is perfectly matched to the respective motherboard. In addition to the CPU, they also cool the voltage regulators (VRMs) and the M.2 NVMe SSD located below the CPU socket. This allows the waterblock to cover all key motherboard components.
April 2nd, 2026 — Source or Source

AMD Details Upcoming Zen 6 PQOS Extensions: Advanced Bandwidth and Privilege Controls
Imagine you're a web hosting vendor leasing out specific number of CPU cores of a large core-count processor. You'd want to specify QoS limits on the shared L3 cache performance for those cores, so they don't hamper performance of other tenants. AMD this week released a technical document detailing the Platform Quality of Service (PQOS) ISA extensions for its next-generation Zen 6 microarchitecture. These ISA enhancements provide sysadmins and cloud providers with greater control over processor and memory subsystem performance.
April 2nd, 2026 — Source

AMD Instinct MI355X Breaks 1M Tokens Per Second in MLPerf
Advanced Micro Devices has published its MLPerf Inference 6.0 results, showcasing the capabilities of its Instinct MI355X accelerator in both single-node and large-scale cluster environments. Rather than focusing on a single benchmark metric, the submission emphasizes a broader evaluation of inference performance, including throughput, scaling efficiency, workload diversity, and reproducibility across partner systems. The Instinct MI355X is based on AMD's CDNA 4 architecture and manufactured on a 3 nm process, integrating approximately 185 billion transistors.
April 2nd, 2026 — Source

ASUS Pro WS W890-SAGE Review (w/ Xeon 696X!)
Intel has launched their range of Xeon 600 Workstation processors along with a new W890 chipset so it's time for a review to see how the new technology performs. We put the ASUS Pro WS W890-SAGE through its paces with an Engineering Sample of the 64-core Xeon 696X and discovered a few unexpected results.
April 2nd, 2026 — Source or Watch Video

Breakthrough Memory Chip Can Withstand Extreme Heat Hotter Than Molten Lava
Researchers at the University of Southern California have developed a memory chip that remains fully functional at 700° Celsius (1,300° Fahrenheit), which is at the lower threshold of molten lava. Published in the Science journal, this development is a step towards a robust solution for deploying electronics in extreme environments.
April 2nd, 2026 — Source

Core Ultra 400HX leak points to 8P 16E and 6P 8E notebook chips
A fresh leak has outlined what may be Intel's upcoming Core Ultra 400HX "Nova Lake-HX" mobile processor lineup, and the configuration split is immediately interesting for anyone tracking next-generation gaming notebooks and mobile workstations. Rather than launching around a single die strategy, Intel reportedly has two separate HX-class CPU layouts in the works. The top part is said to feature 8 performance cores, 16 efficiency cores, and 4 low-power efficiency cores, while a second performance-tier model scales that back to 6 performance cores, 8 efficiency cores, and 4 low-power efficiency cores.
April 2nd, 2026 — Source

DeepCool LT360 Vision ARGB AIO cooler arrives with massive 4.5-inch IPS flip-screen
We've seen a lot of AIO CPU coolers with screens integrated into the CPU block. DeepCool is looking to make this the centrepiece of your build with the new LT360 Vision ARGB, which mounts a massive 4.5-inch IPS screen onto the cooler.
April 2nd, 2026 — Source

Just as Intel's CPUs Looked Promising With Arrow Lake Refresh, Fresh Price Hikes Might Put Them Out of Reach for Gamers
Intel is reportedly preparing extensive price hikes for its consumer CPU lineup this year, at a time when the firm's offering started to look a bit better with the newer Core Ultra 200S Plus SKUs.
April 2nd, 2026 — Source

Intel BOT Optimization Tool Uses Vectorization, Raises Benchmark Fairness Questions
Intel's Binary Optimization Tool (BOT) has come under scrutiny following a technical analysis conducted by Geekbench, which examined how the software impacts benchmark performance. The investigation shows that BOT operates by transforming scalar instructions into vectorized operations, effectively restructuring workloads to improve execution efficiency. At the core of the optimization is instruction-level vectorization. Scalar instructions, which process one data element at a time, are converted into vector instructions capable of handling multiple data elements simultaneously.
April 2nd, 2026 — Source

Intel buys back 49% stake in Ireland Fab Joint Venture — takes full control over Fab 34
One less SCIP deal for Intel?
April 2nd, 2026 — Source

Intel Nova Lake-AX Listed With Massive LGA 4326 Socket In Shipping Manifest, Hinting At Desktop-Class Halo Rival
The leak suggests Intel's enthusiast-grade Nova Lake-AX lineup will use a much larger platform than expected.
April 2nd, 2026 — Source

This chip keeps working at 700°C, surviving lava-like heat
A USC team demonstrates a memristor device that keeps working far beyond current thermal limits
April 2nd, 2026 — Source

MechWarrior dev Piranha Games reportedly affected by redundancies
Former worker cites "economic restructuring" as the reason for cuts
April 2nd, 2026 — Source

TSMC's US Expansion Plans Grow More Aggressive With Twelve Planned Arizona Fabs, as Sole Reliance on Taiwan Appears to Be a 'Dead End'
TSMC's US fab network is growing at an unprecedented pace, and according to a new report, the chip giant is eager to build a 'GigaFab' cluster in Arizona that rivals Taiwan's output.
April 2nd, 2026 — Source

Computer — Processors — April 1st, 2026

Arm to sell its new AGI CPU in China — 'we would expect the demand for this product to be just as strong in China as it is in the rest of the world'
Despite sanctions that limit IP licensing.
April 1st, 2026 — Source

Computer — Processors — March 31st, 2026

Arm says agentic AI needs a new kind of CPU. Intel's DC chief isn't buying it
Cores it's got what agents crave
March 31st, 2026 — Source

Geekbench says Intel BOT rewrites benchmark code, Geekbench 6.7 will detect optimized runs
Geekbench 6.7 will detect Intel BOT
March 31st, 2026 — Source

Japan's Most Ambitious Chip Project Surfaces as Fujitsu Pairs With Rapidus to Build One of the World's First 1.4nm Chips
Japan's semiconductor ambitions have surged in the past few years, and now the leading manufacturer, Fujitsu, intends to partner with Rapidus to build cutting-edge tech.
March 31st, 2026 — Source

Modder Boots Bartlett Lake Core 9 CPU on Z790 Using AI-Guided BIOS Mod
A hardware enthusiast has demonstrated that Intel's Bartlett Lake-based Core 9 273PQE processor can be made to run on a consumer Z790 motherboard, despite lacking official platform support. The processor, which features a 12 performance-core configuration without efficiency cores, is designed primarily for embedded and edge computing scenarios. While it uses the same LGA1700 socket as mainstream desktop CPUs, Intel does not validate it for use on 600- and 700-series consumer chipsets, largely due to missing firmware support. In this case, the user bypassed those limitations by modifying the motherboard BIOS and injecting the required CPU microcode.
March 31st, 2026 — Source

Modder gets Intel's OEM-only 'Bartlett Lake' CPU to post on a regular Asus Z790 motherboard — BIOS was edited by Claude AI to make Core Ultra 9 273QPE boot
It hasn't gone past the POST screen yet, however.
March 31st, 2026 — Source

Noctua AIO coolers reportedly pass validation, on track for Q2 launch
Asetek confirms Noctua AIO coolers finished validation
March 31st, 2026 — Source

Noctua and Asetek Announce Flagship AIO Liquid Coolers Complete PVT Phase, Targeted for Q2-2026 Launch
Since the announcement of their collaboration at Computex 2025, Noctua, a leading quiet PC cooling brand, and Asetek, a pioneer in all-in-one (AIO) liquid cooling, have continued to advance their flagship AIO liquid coolers. The products have now successfully completed the Production Validation Test (PVT) phase, confirming performance and manufacturing readiness ahead of the planned Q2 2026 launch.
March 31st, 2026 — Source or Source

TSMC Can't Keep Up With AI Demand, Leaving Samsung And Its 2nm Process the World's Only Alternative
The success garnered by TSMC has turned into a double-edged sword for both the world's biggest foundry and its customers, as the manufacturer's 3nm supply has become so constrained that only long-term and loyal customers like Apple are given priority. During this demand and supply disparity, Samsung emerges as the savior for those who are unable to secure orders from their 'go-to' manufacturer, with the Korean giant's second-generation 2nm GAA process, also known as SF2P, serving as the ideal alternative.
March 31st, 2026 — Source

User Orders AMD Stock Heatsink, Finds Ryzen 5 8400F Processor Inside The Box
If it had been the other way around, I would still have been happy, but not everyone is that lucky.
March 31st, 2026 — Source

Computer — Processors — March 24th, 2026

AMD Ryzen 5 9600X hits $182 two days before Ultra 5 250K Plus launch
AMD cuts Ryzen 5 9600X to $181.95
March 24th, 2026 — Source

Intel Core Ultra 5 250K Plus review: The new best $200 CPU
Intel's Core Ultra 5 250K Plus matches the competition in gaming and absolutely runs circles around other chips in applications.
March 24th, 2026 — Source

Intel Core Ultra 5 250K Plus Review: They Did It
Core Ultra 250K Plus versus 9600X versus 5800X3D
March 24th, 2026 — Source

Intel Core Ultra 7 270K Plus review: Back from the brink
Unbelievable productivity performance at an even more unbelievable price -- shame gaming still takes a backseat.
March 24th, 2026 — Source

Intel Core Ultra 7 270K Plus vs Ryzen 9700X: The First Benchmarks Are In
Intel's latest release in the 200S series, the Core Ultra 200S Plus, offers a glimpse into the balance between performance and efficiency in modern CPUs. Built on the Aero Lake architecture, this processor features a 24-core setup, including 8 performance cores reaching up to 5.44 GHz and 16 efficiency cores clocked at 4.7 GHz. As noted by ETA Prime, its integration with Intel's application optimization software (APO) has demonstrated measurable improvements in gaming performance. For example, allowing APO in titles like Cyberpunk 2077 and Shadow of the Tomb Raider resulted in higher frame rates, highlighting its potential for gamers and multitaskers alike.
March 24th, 2026 — Source

New detector chip compresses X-ray data 100- to 200-fold in real time
Every second, scientific experiments produce a flood of data—so much that transmitting and analyzing it can slow down even the most advanced research. To help scientists better manage this data deluge, researchers at the U.S. Department of Energy's (DOE) Argonne National Laboratory have developed a new computer chip that rapidly compresses and processes the huge amounts of data generated by advanced X-ray detectors, like those at the Advanced Photon Source (APS), a DOE Office of Science user facility at Argonne. By compressing data right at the source, like shrinking a movie or song to make it easier to send, this technology makes experiments faster, more efficient, and more insightful than ever.
March 24th, 2026 — Source

OCCT v16.1 goes stable with Intel Arrow Lake Refresh CPU tuning support
OCCT v16.1 for Core Ultra 200S and 200S Plus
March 24th, 2026 — Source

Thermal Grizzly Introduces New Mycro Pro RGB CPU Water Blocks, DeltaMate MPII CPU Coolers Coming in Summer
Starting today, two new CPU water blocks from Thermal Grizzly are available: the AM5 Mycro Pro RGB and the Intel 1851 Mycro Pro RGB. The coolers consist of a nickel-plated copper base plate, a cooler plate made of tempered acrylic glass, an acrylic jet plate for flow optimization, and a cover made of anodized aluminium. The inlet and outlet ports with G1/4-inch threads are each located in the acrylic glass. A filter in the form of a fine-mesh screen is located at the inlet port. The design of the cooler is identical to that of the Mycro Direct-Die coolers.
March 24th, 2026 — Source

Thermal Grizzly Launches Mycro Pro RGB CPU Water Blocks
Starting today, two new CPU water blocks from Thermal Grizzly are available: the AM5 Mycro Pro RGB and the Intel 1851 Mycro Pro RGB. The coolers consist of a nickel-plated copper base plate, a cooler plate made of tempered acrylic glass, an acrylic jet plate for flow optimization, and a cover made of anodized aluminum. The inlet and outlet ports with G1/4-inch threads are each located in the acrylic glass. A filter in the form of a fine-mesh screen is located at the inlet port. The design of the cooler is identical to that of the Mycro Direct-Die coolers.
March 24th, 2026 — Source

Thermal pads with in-built vapor-chambers claim 50 to 80 times better thermal conductivity than normal thermal pads — 1,200 W/m-K "Vapor-Pad" from Xerendipity designed to replace traditional TIM in a CPU
The company also showed off a non-metal vapor chamber for phones.
March 24th, 2026 — Source

Computer — Processors — March 22nd, 2026

AI data centers need faster links: A mass-producible optical microchip could help
Researchers at Karlsruhe Institute of Technology (KIT) and ecole Polytechnique Federale de Lausanne (EPFL) present a novel component that enables very fast, economical, and reliable data transmission thanks to an advanced manufacturing technology. Their new electro-optical modulator transmits data efficiently through fiber-optic cables and can be manufactured inexpensively in large quantities on standard semiconductor wafers. This is important, as AI applications and growing data traffic are pushing data centers and fiber-optic networks to their performing limits.
March 22nd, 2026 — Source

AMD Ryzen 9 9950X3D2 Spotted In CPU-Z; Specs Show 128 MB Of L3 Cache?
We know the Ryzen 9 9950X3D2 exists, but is this a real sample? Ryzen 9950X3D2 should bring much higher L3 cache, but the CPU-Z's listing appears to be incorrect.
March 22nd, 2026 — Source

Intel Bartlett Lake Core 9 273PQE Gets Benchmarked On PassMark; 22% Lower Multi-Threaded Performance Than i9-14900K At Half The Core Count
Intel's P-Core only flagship Bartlett Lake chip was benchmarked in PassMark for the first time, and despite fewer cores, it still delivers amazing scores.
March 22nd, 2026 — Source

Intel compares Core Ultra 200S Plus to Ryzen 9600X and 9700X, gaming uplift stays small
Intel Core Ultra 200S Plus is aimed at creators, not gaming
March 22nd, 2026 — Source

Intel Core 9 273PQE shows up on PassMark with 12 P-cores
Intel Core 9 273PQE SCORES 4,655 single-thread score on PassMark
March 22nd, 2026 — Source

Intel Core Ultra 3 205 shows up at French retailer with €158 price
Entry-level Arrow Lake for desktops incoming
March 22nd, 2026 — Source

Intel released its first Pentium chip on this day 33 years ago, came packing 3.1 million transistors — fifth-gen x86 chip built on an 800nm process
This iconic CPU also boasted Intel's first superscalar architecture, but wasn't without its issues.
March 22nd, 2026 — Source

Computer — Processors — March 21st, 2026

AMD's Secret Ryzen 9 9950X3D2 Dual 3D V-Cache CPU Is Real According To ASRock
There is plenty of reason to believe that AMD is getting ready to add a Ryzen 9 9950X3D2 processor to its lineup, and perhaps the most telling evidence yet is a press release by ASRock that shouts out the not-yet-released chip. According to ASRock, several of its socket AM5 motherboards "fully support the newly launched AMD Ryzen 9 9950X3D2."
March 21st, 2026 — Source

AMD's unreleased Ryzen 9 9950X3D2 officially announced by ASRock
AMD Ryzen 9 9950X3D2 is supposed by ASRock motherboards
March 21st, 2026 — Source

Intel may finally extend desktop CPU socket support to multiple generations
Intel's rumored LGA1954 socket could break the one-and-done cycle
March 21st, 2026 — Source

Qualcomm shuts door on Snapdragon X DSP headers open-sourcing, Linux support hopes fade
Qualcomm says no to open DSP headers for Snapdragon X
March 21st, 2026 — Source

Computer — Processors — March 20th, 2026

Intel Prepares 10 Percent CPU Price Increase Impacting Consumer PC Market
Intel is reportedly preparing to raise prices on its consumer processor lineup, with industry sources indicating a roughly 10 percent increase across its Core Ultra family. The adjustment is said to have been communicated to major OEM partners and is expected to affect a wide range of products, including desktop CPUs, mobile processors, and systems built around Intel platforms. As these processors form a key part of overall system cost, the impact is likely to extend beyond individual components and influence pricing across the broader PC market.
March 20th, 2026 — Source

Intel To Offer AMD-Like Desktop Socket Longetivity, Supporting Multiple CPU Generations
Future Intel Desktop sockets might support several generations of CPUs, as hinted by Robert Hallock in an interview with Club386.
March 20th, 2026 — Source

Thermal Grizzly adds new Mycro Pro CPU blocks for AMD and Intel systems
Thermal Grizzly has expanded its cooling lineup with two new CPU water blocks, the AM5 Mycro Pro RGB and the Intel 1851 Mycro Pro RGB, both built around the company's ultra‑fine 0.2mm microfin cold‑plate design. The blocks follow the layout of the existing Mycro Direct‑Die series but adapt it for standard CPU installations, pairing a nickel‑plated copper base with an acrylic top, anodised aluminium cover and integrated RGB lighting.
March 20th, 2026 — Source

Computer — Processors — March 18th, 2026

AMD Medusa Point leak shows 10-core Zen 6 APU beating Ryzen AI 9 365 in Geekbench multi-core
AMD Medusa Point Zen 6 APU appears again with higher Geekbench score
March 18th, 2026 — Source

AMD preparing Ryzen 7 9750X and Ryzen 5 9650X desktop CPUs with 120W TDP
AMD Ryzen 7 9750X and Ryzen 5 9650X leak with 120W TDP and higher clocks
March 18th, 2026 — Source

AMD Prepares Ryzen 7 9750X and 9650X Zen 5 Refresh CPUs
AMD is reportedly preparing two refreshed additions to its Ryzen 9000 desktop processor lineup, with the Ryzen 7 9750X and Ryzen 5 9650X expected to strengthen the company's standard Zen 5 offerings. These are not X3D parts, so there is no stacked cache involved. Instead, both processors appear to follow a simpler update path: higher clock speeds, increased default power targets, and a positioning strategy aimed at improving stock performance in the mainstream desktop segment.
March 18th, 2026 — Source

AMD Preps 120W "Zen 5" Refresh CPUs: Ryzen 7 9750X 8-Core & Ryzen 5 9650X 6-Core, Featuring Faster Clocks
AMD is preparing two brand new Ryzen 9000 "Zen 5" Refresh CPUs, the Ryzen 7 9750X & the Ryzen 5 9650X with 120W TDPs.
March 18th, 2026 — Source

AMD Readies Ryzen 7 9750X and Ryzen 5 9650X Desktop Processors with Increased TDP
AMD is preparing an update to its Ryzen 9000 series desktop processor lineup with the introduction of two new models, the Ryzen 7 9750X, and the Ryzen 5 9650X. Both these chips are non-X3D (lack 3D V-Cache), and implement the regular "Zen 5" CCD with 32 MB on-die L3 caches. The two are being designed with increased clock speeds and TDP, and their launch closely follows Intel's recent product stack refresh with the Core Ultra 7 270K Plus and Core Ultra 5 250K Plus.
March 18th, 2026 — Source

AMD reportedly strikes back with Zen 5 refresh to counter Intel's latest Arrow Lake Refresh CPUs — 65W Ryzen supercharged with 400 MHz base clock uplift and almost double the TDP
The only way to fight a refresh is with a refresh.
March 18th, 2026 — Source

AMD Rumored To Boost Clocks And TDPs With Ryzen 7 9750X And Ryzen 5 9650X
AMD saw Intel refresh its Arrow Lake processors with faster clock speeds, a new optimization trick, and claims of giving gaming a boost and may have said, 'Hold my beer'. According to a popular leaker on X with a positive track record, AMD is getting ready to release two new Zen 5 processor models, the Ryzen 7 9750X and Ryzen 5 9650X.
March 18th, 2026 — Source

Intel Core Ultra 3 205T Appears On PassMark For The First Time; Slighly Slower Than Ultra 5 225T In Multi-Threaded Test
The slowest Arrow Lake processor was just benchmarked on PassMark, revealing its true single and multi-core prowess.
March 18th, 2026 — Source

Intel's new Core Ultra 200HX Plus mobile CPUs include 290HX, 270HX Plus flagships — 8% faster gaming claims fall short of 15% boost promised by desktop Arrow Lake Refresh
No performance metrics for the 270HX Plus yet.
March 18th, 2026 — Source

It's not a binary choice. Independent boffin builds a ternary CPU on an FPGA
Three is the magic number as first off-the-shelf general-purpose ternary hardware since c 1965 lands
March 18th, 2026 — Source

Computer — Processors — March 16th, 2026

AMD Zen 6 Medusa Point CPU Spotted With 10 Cores And More L3 Cache
Another unreleased processor has found its way to Geekbench's benchmark database and according to the details in the listing, it is likely an early engineering sample of a Medusa Point APU based on AMD's next-generation Zen 6 architecture. While it's premature to draw any real conclusions (particularly performance), there are some interesting details in the listing.
March 16th, 2026 — Source

AMD Zen6 "Medusa Point" 10-core CPU leak confirms 32MB L3 Cache
One of the first Zen6 CPUs finally spotted on Geekbench
March 16th, 2026 — Source

First credible leak of an AMD Zen 6 processor pops up on Geekbench — ten-core CPU seems to have 32MB of L3 cache
The result itself isn't that meaningful, but it's notable in its very existence.
March 16th, 2026 — Source

Hydrogen-controlled AI semiconductor enables learning and memory in two-terminal device
A new neuromorphic device controls hydrogen ions to mimic synaptic learning and memory, achieved for the first time in a vertical two-terminal architecture.
March 16th, 2026 — Source

Intel's roadmaps examined — 14A, Nova Lake, Diamond Rapids & AI accelerator push
With Panther Lake now shipping and Clearwater Forest coming this year, Intel needs to prove 18A can scale.
March 16th, 2026 — Source

Mysterious 10-Core AMD "Ryzen 9" CPU With 32 MB L3 Cache Spotted On Plum Platform For Medusa Point APUs
A mysterious AMD Ryzen 9 CPU has been tested on the upcoming Medusa Point "Plum" platform in a new leak spotted at Geekbench.
March 16th, 2026 — Source

STMicro to deploy humanoid robots to its legacy fabs in Europe — over 100 humanoid robots to be used for routine and physically demanding tasks in fight for efficiency
STMicroelectronics is one of the long-standing European chipmakers that does not give up and keeps its fabs open and, more importantly, busy despite all odds. However, high-end pressure from leading chipmakers and emerging Chinese chipmakers on the low-end clearly has its impact, and so the company must find new ways to survive.
March 16th, 2026 — Source

Computer — Processors — March 13th, 2026

11-month old Russian outfit claims it has developed 16-core and 32-core chips, flaunts Cyrillic-badged processors — chips appear to be sanctions-swerving rebadged Chinese Loongson processors
Chinese Loongson 3C6000 CPUs now have heat spreaders with words in Cyrillic?
March 13th, 2026 — Source

NVIDIA's Blackwell B200 Chips Are Reportedly Accessible to China's ByteDance Through 'Rental' Compute Services
One of China's largest entities involved in the AI race, ByteDance, has reportedly secured access to NVIDIA's Blackwell chips through a Malaysian cloud computing provider.
March 13th, 2026 — Source

Computer — Processors — March 12th, 2026

Meta reveals four new MTIA chips built for AI inference — to be released on a six-month cadence
The chiplet-based accelerators are designed to run AI inference more efficiently than GPUs optimized for training workloads.
March 12, 2026 — Source

Meta's New AI Chips Reveal a Faster, More Self-Reliant Hardware Strategy
Meta unveils four new AI chips as it expands its in-house hardware push, aiming for more control over AI costs, rollout speed, and infrastructure.
March 12, 2026 — Source

OCCT v16.1 beta adds Intel Arrow Lake CPU tuning support, 200K+ supported as well
OCCT confirms Arrow Lake Refresh support, adds Arrow Lake tuning in v16.1 beta
March 12, 2026 — Source

Computer — Processors — March 11th, 2026

Ambitious semiconductor enthusiast builds DIY 'class 100 cleanroom' in his garden shed — contains a plasma etcher, vacuum furnace, and even custom software-driven lithography machine
Dr. Semiconductor teases that he will subsequently be showing off the 'crazy things that can be built' in the shed.
March 11, 2026 — Source

DIY chip lab turns backyard shed into Class 100 cleanroom with custom lithography system
The lab uses laminar airflow and positive pressure to control contamination
March 11, 2026 — Source

IBM and Lam Research team up on High NA EUV dry resist to push chip scaling past 1nm
Five-year collaboration targets nanostack devices and backside power delivery at sub-1nm nodes.
March 11, 2026 — Source

Intel announces $299 Core Ultra 7 270K Plus and $199 Core Ultra 5 250K Plus CPUs
Intel Arrow Lake Refresh official, but there's no 290K Plus
March 11, 2026 — Source

Intel announces Arrow Lake Refresh CPUs, claims 15% higher gaming performance and multi-threaded boost — Core Ultra 7 270K and Core Ultra 5 250K come with more cores, faster memory, and a price cut
Arrow Lake is suddenly looking a lot more attractive.
March 11, 2026 — Source

Intel confirms Core Ultra refresh rumors, announcing "the fastest desktop gaming processors" the brand "has ever built," and I hope this means long-term support for its current motherboard socket
Are we back? Intel announces the new Intel Core Ultra 200S Plus Desktop Processors
March 11, 2026 — Source

Intel Core Ultra 200 Plus CPUs Debut: More Cores, Faster Clocks, Better Gaming
If you don't have an Intel Arrow Lake Core Ultra desktop system, it may be because you opted to skip that generation due to Arrow Lake not showing a big enough gaming performance lift compared to Intel's previous generation chips. Well, fair enough, but Intel's new Core Ultra 200S Plus series processors have just arrived, and they may indeed address those concerns.
March 11, 2026 — Source

Intel finds its Zen undercutting AMD with Arrow Lake refresh
Intel has a new strategy for shoring up its eroding market share: Offering PC buyers more cores per dollar than arch-rival AMD in a refresh of its Arrow Lake range.
March 11, 2026 — Source

Intel Intros Core Ultra 250K and 270K Plus Chips Refreshing Desktop Arrow Lake for Enthusiasts
With Intel's latest-generation Panther Lake silicon (Core Ultra 3 series) being a mobile-only product generation, the task of carrying the torch for Intel's desktop product lineup falls to the company's existing Arrow Lake processors (Core Ultra 2 series) for a second year. A technologically solid but overall unexceptional processor lineup, Arrow Lake's desktop existence has often been overshadowed by Intel's internal problems as well as competition from stalwart rival AMD. None the less, for the next several months it is the best silicon Intel has on hand for the desktop market, and in order to continue driving sales over that time period Intel is giving Arrow Lake a refresh to improve its performance and competitive positioning.
March 11, 2026 — Source

Intel Launches "Arrow Lake Refresh": Core Ultra 5 250K Plus and Core Ultra 7 270K Plus, New Binary Optimization Tool
Intel today announced the Core Ultra 5 250K Plus and Core Ultra 7 270K Plus desktop processors in the Socket LGA1851 package. These chips are drop-in compatible with existing Intel 800-series chipset motherboards, with some boards needing UEFI firmware updates. Both chips are based on the current "Arrow Lake" microarchitecture, and are carved out of the "Arrow Lake-S" disaggregated silicon that uses TSMC N3B (3 nm) foundry node for its Compute tile containing the CPU cores, TSMC N5 (5 nm) for its Graphics tile, and TSMC N6 (6 nm) node for its SoC and I/O tiles.
March 11, 2026 — Source

Intel launches new Core Ultra 5 250K Plus and Core Ultra 7 270K Plus CPUs
Today Intel is expanding its desktop CPU portfolio with two new SKUs -- the Core Ultra 5 250K Plus and the Intel Core Ultra 7 270K Plus, bringing increased core counts and more performance.
March 11, 2026 — Source

Intel Refreshes Arrow Lake For Desktop With Core Ultra 5 250K Plus and Ultra 7 270K Plus
Intel has introduced two updated Arrow Lake-S desktop processors for the LGA1851 platform, adding the Core Ultra 5 250K Plus and Core Ultra 7 270K Plus to its current lineup. Rather than launching an all-new desktop generation, Intel is reworking the value and specification balance within the existing range by enabling more of the silicon and pairing it with improved platform support. Both processors remain compatible with Intel 800-series chipset motherboards, although some boards will need a firmware update before installation. The Core Ultra 5 250K Plus enters the market at $199 and replaces the Core Ultra 5 245K at that price point. It keeps the same six performance cores, but raises the efficient core count from eight to twelve, moving to a 6P+12E layout.
March 11, 2026 — Source

Intel rolls out XeSS 3.0 with multi-frame generation, but it's still locked to Windows
Smoother motion and sharper visuals, but native Linux support remains off the table
March 11, 2026 — Source

Intel Unveils Core Ultra 200S Plus Desktop CPUs
With More Cores, Faster Interconnects and New Optimization Tech
March 11, 2026 — Source

Intel Wildcat Lake Leak Points to 15W Budget AI PC Chip
Intel's upcoming Wildcat Lake processor has appeared again through leaked shipping information, giving a clearer look at what may become the company's next low-power platform for entry-level laptops and mini PCs. Based on recent coverage, the chip is expected to replace Alder Lake-N and Twin Lake in Intel's lower-power client stack while sitting below Panther Lake in the broader Core Ultra Series 3 family. The reported specifications are modest on paper, including a 15 W TDP, up to 1.5 GHz boost clock, and 6 MB of L3 cache, but the platform looks more significant once the surrounding architecture is taken into account.
March 11, 2026 — Source

Intel: New Core Ultra 270K Plus & 250K Plus demolish AMD Ryzen CPUs on Windows 11 25H2
Intel has come out guns blazing as it claims its latest Core Ultra 270K Plus and 250K Plus processors easily outdo AMD's equivalent parts.
March 11, 2026 — Source

Intel's cheaper, faster new Core Ultra CPUs still have a lot to prove
The "Plus" means it's better. Whether that's actually true of Intel's new 2026 desktop PC processors remains to be seen.
March 11, 2026 — Source

Intel's new desktop processors might appeal to PC gamers with its Core Ultra 200S Plus refresh — but the price is the real plot twist
Arrow Lake Refresh pivots back to gamers after years of AI‑centric messaging with "more performance and an unbeatable value".
March 11, 2026 — Source

The Evolution of CPU Architectures -- From Intel 4004 To Modern SoCs
CPUs are at the heart of every computing device, from phones and laptops to servers and game consoles. Over the last 50+ years, CPU architecture has undergone dramatic transformations, driven by the relentless pursuit of performance, energy efficiency, and new computing paradigms. This article focuses on how CPUs evolved at the architectural level, from the Intel 4004 — the world's first commercial CPU — through the innovations of the late 20th century like the x86 architecture, the parallel rise of RISC designs like ARM, and finally to today's heterogeneous multi-chiplet SoCs from the likes of Intel, AMD, and Apple.
March 11, 2026 — Source

Computer — Processors — March 5th, 2026

China's top chip execs claim ASML alternative 'small, fragmented, and weak' — Chinese industry titans call for national effort to invest in advanced chipmaking tools
Senior figures from SMIC, YMTC, and Naura have called for consolidated national action to close a gap that years of investment have failed to bridge.
March 5, 2026 — Source

'CPUs are cool again,' Intel and AMD reporting spikes in CPU demand due to agentic AI, shortages — Lisa Su says business exceeded expectations while Intel is looking at long-term agreements with potential customers
Are we staring down the barrel of an AI-driven CPU shortage?
March 5, 2026 — Source< or Source

Intel's 18A node debuts in the data center with the 288-core Xeon 6+
Clearwater Forest uses Darkmont efficiency cores and advanced 3D chip packaging
March 5, 2026 — Source

Photonic chips enable real time learning in spiking neural networks
A two-chip photonic neuromorphic system performs real time spiking reinforcement learning using only light, achieving GPU-class energy efficiency.
March 5, 2026 — Source or Source

Computer — Processors — March 4th, 2026

AMD Nerfs Ryzen AI 400 Desktop CPUs With Just 10-12 Usable PCIe Lanes
Looks like the new APU series will be better for mini PCs, as the number of PCIe lanes has been noticeably reduced.
March 4, 2026 — Source

Intel Chairman Frank Yeary retires, Craig Barrat to become the new chairman of the Board of Directors
Craig Barrat to become new chairman of Intel.
March 4, 2026 — Source

Intel's 288-Core 18A Xeon Targets 6G and Edge AI
At Mobile World Congress 2026, Intel formally introduced its next-generation Xeon 6+ processors, codenamed "Clearwater Forest", the first data center CPUs manufactured on the company's 18A fabrication process (1.8nm-class).
March 4, 2026 — Source

Intel's make-or-break 18A process node debuts for data center with 288-core Xeon 6+ CPU — multi-chip monster sports 12 channels of DDR5-8000, Foveros Direct 3D packaging tech
Intel unveils x86 CPU with the industry's highest core count.
March 4, 2026 — Source

Nvidia RTX 5070 mobile GPU looks set to get more VRAM despite global memory crisis — 8GB could be boosted to 12GB, according to new listings
Better late than never for a VRAM upgrade.
March 4, 2026 — Source

Recycle & Create Your Own Filament: Creality Filament Maker M1 & Shredder R1
The new soon to be launched Creality Filament Maker M1 and Shredder R1 have bee undersigned to provide a desktop system capable of transforming recycle plastic waste into reusable 3D printing filament. The process starts with the R1 Shredder, which breaks down failed prints and other plastic scraps into uniform pellets. These pellets are then processed by the M1 Filament Maker, which uses features like multi-zone temperature control to ensure consistent extrusion and reliable filament quality.
March 4, 2026 — Source

Samsung Accelerates The Development Of The Exynos 2700 Chip With Early Sampling
Now that Samsung has demonstrated its competence with the new Exynos 2600 chip, which has bested Qualcomm's Snapdragon 8 Elite Gen 5 chip in various benchmarks, especially the ones related to natural language understanding, object detection, and image classification, all the while maintaining an enviable thermal footprint, the South Korean behemoth is finally doubling down on its native silicon, with the sampling of the next-gen Exynos 2700 chip already underway.
March 4, 2026 — Source

Snapdragon X2 Elite Extreme X2E-96-100 CPU benchamrks match Qualcomm claims
Qualcomm Snapdragon X2 Elite Extreme hits Geekbench with early Zenbook A16 results
March 4, 2026 — Source

Computer — Processors — March 3rd, 2026

AMD AI 400 Brings NPUs to Pro Desktops With Mid-Zen 5 Refresh
Now you can have that Copilot PC that your boss wants for you.
March 3, 2026 — Source

AMD CEO Lisa Su Says Server CPU Demand "Far Exceeded" Expectations, Supply Now Tightening
AMD is seeing server CPU demand it didn't fully anticipate, with CEO Lisa Su describing it as having "far exceeded" her expectations. Speaking at the Morgan Stanley Technology, Media & Telecom Conference earlier today, Su outlined how the landscape has shifted as agentic AI applications have taken off, pushing CPUs back into the spotlight alongside accelerators. The CPU-to-GPU ratio in AI compute workloads has evolved dramatically over the past few months, and top customers reportedly told Su that CPU demand sitting alongside AI was "under-forecasted."
March 3, 2026 — Source

AMD Witnesses "Unexpected" CPU Demand From Customers as Agentic AI Accelerates Adoption; CEO Lisa Su Warns Supply Is Tightening
AMD's CEO has discussed the company's situation with enterprise demand for its server CPUs, and according to Lisa Su, Team Red faces 'unexpected' customer volume.
March 3, 2026 — Source

ASRock Industrial Launches the iEPF-11000S Series Platform with Intel Xeon 600 CPUs
ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI applications. Powered by Intel Xeon 600 processors with W890 chipset, the iEPF-11000S Series delivers professional grade CPU performance, support for up to four graphic cards, PCIe Gen 5 connectivity, and up to 2 TB of RDIMM/RDIMM-3DS DDR5 memory with ECC protection for mission-critical edge processes. Designed for versatility, the iEPF-11000S Series features a comprehensive I/O with multiple expansion slots, high-speed networking including 10 GbE, and advanced storage capabilities.
March 3, 2026 — Source

Intel 18A Xeon 6+ Clearwater Forest CPUs Debut With Up To 288 Cores
AMD isn't the only company launching non-mobile processors at Mobile World Congress 2026. Intel's got some hardware to show off today, too, in the form of the Xeon 6+ processors that we know better by their codename "Clearwater Forest". These chips are the successors to Sierra Forest, the all E-core Xeons that Intel launched back in 2024. Sporting the same Darkmont E-core architecture used in Panther Lake, these processors pack in up to 288 of the little guys as well as 576MB of last-level cache, 96 PCIe 5.0 lanes, and 12-channel DDR5-8000.
March 3, 2026 — Source

Intel Chairman Frank Yeary retires, Craig Barrat to become the new chairman of the Board of Directors
Craig Barrat to become new chairman of Intel.
March 3, 2026 — Source

Intel's make-or-break 18A process node debuts for data center with 288-core Xeon 6+ CPU — multi-chip monster sports 12 channels of DDR5-8000, Foveros Direct 3D packaging tech
Intel unveils x86 CPU with the industry's highest core count.
March 3, 2026 — Source

OCCT v16 adds System Tuning tool with Intel Granite Rapids support, Arrow Lake support in coming weeks
OCCT v16.0.1 now available, includes Intel CPU tuning and UI changes
March 3, 2026 — Source

Computer — Processors — March 2nd, 2026

Advancing vRAN Economics with AMD EPYC 8005 Server CPUs
Mobile operators moving toward open and virtualized RAN architectures are finding that the main challenges are economic, resource use in tight environments, automation, and long-term growth rather than technology readiness. vRAN offers clear benefits in flexibility and supplier options, but as deployments transition from pilot projects to commercial scale, operators need to address rising energy costs, the complexities of cloud-native operations, and the need for reliable performance across widely distributed infrastructure. The emphasis has shifted to making vRAN sustainable and cost-effective as it scales.
March 2, 2026 — Source

Akasa Launches 1U Low-Profile Vapor Chamber CPU Cooler
Akasa, a leading provider of thermal solutions, has launched the AK-CC7409BP01, a low-profile CPU cooler designed for thermally demanding, space-constrained environments. Compatible with Intel LGA1851 and LGA1700 sockets, the cooler integrates a copper vapor chamber heatsink and a UL-certified side blower fan to deliver reliable, sustained cooling at only 29.5 mm in height, making it well-suited to 1U servers, SFF systems and other applications where vertical clearance is limited.
March 2, 2026 — Source

AMD also launches Ryzen AI PRO 400 for mobile workstations: HX 475 with Radeon 890M iGPU
AMD intros Ryzen AI PRO 400 for laptops
March 2, 2026 — Source

AMD and Nutanix Announce Strategic Partnership for Open Agentic AI Infrastructure
AMD and Nutanix have formed a multi-year partnership to create an open, full-stack AI infrastructure platform. This collaboration aims to support agentic AI applications in data centers, hybrid cloud, and edge environments. The agreement seeks to deliver a production-ready, high-performance alternative to integrated AI stacks by using open standards and compatible software frameworks.
March 2, 2026 — Source

AMD announces Ryzen AI 400 desktop chips with Zen 5, RDNA 3.5, and an XDNA 2 NPU
Ryzen AI arrives on socketed AM5 desktops for the first time
March 2, 2026 — Source

AMD brings Ryzen AI 400G APUs to AM5 with Zen 5 (for system builders)
AMD has expanded its Socket AM5 desktop lineup with the Ryzen AI 400G series, based on the 4 nm "Gorgon Point" APU silicon. This marks AMD's second desktop APU generation for AM5 after the Ryzen 8000G family, but the focus is different this time around. Instead of centering the story on integrated graphics performance, Ryzen AI 400G is positioned around on-die AI acceleration, with an XDNA 2 NPU rated at 50 TOPS. AMD is effectively using the NPU as a defining feature for these parts, aligning them with the broader "AI PC" messaging that has been building across the industry.
March 2, 2026 — Source

AMD details new Ryzen AI 400 desktop APU series specs and performance
AMD has unveiled the Ryzen AI 400 series especially for desktop configurations. The company has shared details regarding specs and performance.
March 2, 2026 — Source

AMD details Ryzen AI 400 desktop with up to 8 cores, Radeon 860M graphics — APUs won't be available as boxed units, only in OEM systems
Still holding out hope for Ryzen 9000G.
March 2, 2026 — Source

AMD Expands Ryzen AI 400 Series to Desktop and Mobile Workstations
At Mobile World Congress 2026, AMD announced an expanded Ryzen AI portfolio with new desktop parts and broader mobile coverage, positioning the Ryzen AI 400 Series as a single platform spanning high-performance desktops, laptops, and mobile workstations.
March 2, 2026 — Source

AMD Gives Consumers and Businesses More AI PC Options with Expanded Ryzen™ AI 400 Series Portfolio
At Mobile World Congress 2026, AMD announced an expanded Ryzen™ AI portfolio with the launch of the AMD Ryzen™ AI 400 Series and Ryzen™ AI PRO 400 Series desktop processors. The new processors deliver powerful on-device AI acceleration and next-generation performance, enabling users to run AI applications and LLMs locally and tackle compute-intensive applications, including those for design and engineering, with ease. Additionally, AMD is expanding the Ryzen AI 400 Series mobile portfolio to include workstations.
March 2, 2026 — Source

AMD Launches Ryzen AI 400 and PRO 400 Desktop Chips
Amid a slew of telecom and commercial client announcements today designed to align with the opening of Mobile World Congress 2026, AMD is using the show as a backdrop to launch the desktop versions of their Ryzen AI 400 chips. First teased back during CES 2026, the company is finally giving them a proper launch at MWC, releasing both the traditional and Pro versions of the chips for the consumer and corporate desktop markets.
March 2, 2026 — Source

AMD Launches Ryzen AI 400 Series Processors for Mobile and Desktop
AMD announced an expanded Ryzen AI portfolio with the launch of the AMD Ryzen AI 400 Series and Ryzen AI PRO 400 Series desktop processors. The new processors deliver powerful on-device AI acceleration and next-generation performance, enabling users to run AI applications and LLMs locally and tackle compute-intensive applications, including those for design and engineering, with ease. Additionally, AMD is expanding the Ryzen AI 400 Series mobile portfolio to include workstations.
March 2, 2026 — Source

AMD launches Ryzen AI PRO 400G desktop APUs, iGPU tops out at Radeon 860M with 8 CUs
AMD brings Ryzen AI PRO 400 to AM5 desktops, iGPU stops at Radeon 860M, not Radeon 890M
March 2, 2026 — Source

AMD Opens A Bag Of Chips, Sorano Epics, Ryzen AI 400 And PRO 400
AMD is busy announcing new chips at the Mobile World Congress, including two new desktop processors called the Ryzen AI 400 and PRO 400 as well as an 84-core EPYC for telecom and edge applications. The Ryzen AI 400 desktop CPUs are similar to their mobile cousins and introduces RDNA 3.5 and XDNA 2 to the desktop. The does mean the weaker Gorgon Point Zen 5c architecture will lead to lower frequencies compared to the Ryzen 9000 series but the RDNA 3.5 GPU will lead to better onboard graphics performance.
March 2, 2026 — Source

AMD punts Ryzen AI 400 to business desktops and laptops
AMD's new Ryzen AI Pro 400 chip helps enable Copilot+ desktops, though just for businesses.
March 2, 2026 — Source

AMD Reveals Ryzen AI Pro 400 Series at MWC 2026
AMD used MWC 2026, which opened on March 2, to introduce the Ryzen AI Pro 400 series, a commercial processor family aimed at business laptops and compact desktops. The announcement is notable mostly because MWC is typically dominated by connectivity news, but AMD's focus here was client compute: CPU performance, integrated graphics capability, and on-device AI acceleration through an NPU. At the architectural level, Ryzen AI Pro 400 is described as a combination of Zen 5 CPU cores, RDNA 3.5 integrated graphics, and an XDNA 2 NPU.
March 2, 2026 — Source

AMD Ryzen 5 5500X3D Launches in China, Keeping AM4 Socket and "Zen 3" Generation Alive
AMD has expanded the availability of its Ryzen 5 5500X3D to the Chinese market, giving new life to a processor that first appeared in Latin America last year. There was no formal launch event or major announcement. Instead, the chip appeared through retail channels quietly, with a listing price of 1,199 RMB (roughly $175). At its core, the Ryzen 5 5500X3D is a six-core, 12-thread "Zen 3" processor designed for the AM4 platform.
March 2, 2026 — Source

AMD Ryzen AI 400 chips will bring newer CPUs, GPUs, and NPUs to AM5 desktops
First wave of Ryzen AI desktop CPUs targets business PCs rather than DIYers.
March 2, 2026 — Source

AMD Ryzen AI 400 Expands AI Powered Desktop Performance with XDNA 2 NPU
AMD has launched its Ryzen AI 400 desktop APUs on the AM5 platform. The series combines Zen 5 CPU cores, RDNA 3.5 graphics, and XDNA 2 NPU acceleration. Initially limited to OEM systems, broader availability is expected later.
March 2, 2026 — Source

AMD Ryzen AI 400G Series Desktop APUs Based on 4 nm "Gorgon Point" with 4P+4C Configuration
AMD earlier today announced the Ryzen AI 400 series desktop APUs in the Socket AM5 package. These are the company's second desktop APU generation on Socket AM5 following the Ryzen 8000G series "Phoenix Point." While "Phoenix Point" is based on "Zen 4," the newer Ryzen AI 400 series is built on the "Gorgon Point" silicon powered by the "Zen 5" microarchitecture. A key difference between the two APU generations is the emphasis on AI performance.
March 2, 2026 — Source

AMD Unveils Ryzen AI 400 Desktop APUs: 8 CPU & GPU Cores, 50 TOPS, AM5 Socket Support
AMD Finally Brings Strix Point To AM5 Desktops With Ryzen AI 400 APUs, Currently Limited To OEMs
March 2, 2026 — Source

Intel Arc Pro B70 Pro-Viz GPU Tested with BMG-G31 Die
Intel has confirmed the existence of its larger Arc Pro B70 "Battlemage" graphics card, designed for professional visualization and AI workloads, through its LLM Scaler software with a small performance testing done in non-ideal scenario. The company plans to release this GPU within the current quarter, which means we could see the official launch and availability in about a month.
March 2, 2026 — Source

Intel Confirms Arc Pro B70 Workstation GPU Via LLM-Scaler vLLM AI Release Notes
The most powerful discrete GPU for the workstation segment, the Battlemage, will be available this quarter.
March 2, 2026 — Source

Intel Core Ultra 9 290HX Plus Benchmark Leak Shows Slightly Higher Single And MT Performance versus Ultra 9 285HX
The flagship Arrow Lake CPU isn't going to deliver any significant performance uplifts over its predecessor, but here's what you can expect.
March 2, 2026 — Source

Intel Launches Xeon 6+ "Clearwater Forest" Xeon with 288 E-Cores on 18A Process
Intel used its MWC conference in Barcelona to showcase its most core-dense Xeon 6+ processor, codenamed "Clearwater Forest." As one of Intel's most complex chiplet designs, the package combines 12 compute chiplets manufactured on an Intel 18A node with three active base tiles on Intel 3 and two I/O tiles on Intel 7. In this configuration, each compute tile contains six modules of four "Darkmont" efficiency cores, providing 24 E-cores per tile and a maximum of 288 "Darkmont" E-cores on a single socket. A two-socket system, therefore, approaches 576 cores.
March 2, 2026 — Source

Intel previews Xeon 6+ CPUs that pave the way for 6G
Intel is introducing the next step in its Xeon 6 CPU roadmap with previews of its Xeon 6+ CPU, which the company says will help pave the way for 6G network infrastructure.
March 2, 2026 — Source

Intel Unveils Clearwater Forest "18A" Xeon+ CPU Performance: Designed For 6G & Edge AI
Intel Clearwater Forest "Xeon 6+" CPUs All Set To Power Next-Gen Edge AI & 6G Platforms With Leading-Edge 18A Tech
March 2, 2026 — Source

Intel's new Xeon 600 processors confirmed to clock up to 4.9GHz
Intel has pulled back the curtain on the frequency behaviour of its new Granite Rapids-WS Xeon 600 workstation series. While marketing materials highlight a peak of 4.9 GHz via Turbo Boost Max 3.0, newly published documentation confirms that sustained speeds are heavily dependent on the instruction set being utilised.
March 2, 2026 — Source

NanoIC Launches Advanced Interconnect PDKs for Chip-to-Chip Designs
Today, the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2 nm, releases two first-of-a-kind advanced interconnect process design kits (PDKs): a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced packaging capabilities within reach of universities, start‑ups, and industry innovators and mark an important step in enabling high‑density, energy‑efficient chip‑to‑chip connectivity.
March 2, 2026 — Source

Phison is now demanding customers pre-pay with shorter timelines — NAND squeeze affecting everyone in the SSD supply chain
The squeeze on NAND suppliers has come for Phison.
March 2, 2026 — Source

Computer — Processors — February 24th, 2026

Apple to produce Mac Minis in Houston for the first time — US chip sourcing tops 20 billion units
Apple says it feels "more confident" than ever about the product's long-term demand.
February 24, 2026 — Source

Intel Misses Another 'AI Opportunity' With SambaNova as Acquisition Talks Die Down, Settling for Xeon CPU Collaboration Instead
Intel's SambaNova acquisition was seen as a way to spearhead the company's AI strategy in inference, but it appears Team Blue has settled for much less.
February 24, 2026 — Source

Intel's "Unified Core" CPU architecture is one step closer to reality — a new job listing suggests hybrid chips are being phased out
Rumors of a switch to a Unified Core design just got more credible as Intel searches for a senior CPU verification engineer to join its Unified Core design team.
February 24, 2026 — Source or Source

Levelplay Combat Liquid 360 HUD AIO CPU Cooler Review
The most exciting part of reviewing PC hardware is looking at brand new products from a fresh new company. Levelplay debuted its cooling line at Computex 2024, so its products are very new to the market. Today we get our first look at one of the company's AIO coolers, the Combat Liquid 360 HUD, equipped with a 360mm radiator, RGB fans, and an LCD screen, or you could say... a Heads-Up Display!
February 24, 2026 — Source

Montech NX600 ARGB CPU Cooler Review
Montech makes tons of solid thermal performance with pricing from the 2010s a thing again with its new NX600 series of CPU air coolers.
February 24, 2026 — Source

Nvidia's N1/N1X chips leak once again, this time tipped for release in first half of 2026 — hotly-anticipated chips to reportedly debut on Dell and Lenovo laptops
N1 silicon is finally right around the corner.
February 24, 2026 — Source

Computer — Processors — February 17th, 2026

Apple Eyeing A Partnership With Chinese Memory Makers YMTC And CXMT As The Big Three Adopt Hardball Tactics
Apple is apparently considering the pitfalls of turning to Chinese memory makers, YMTC and CXMT, to satiate its thirst for memory resources. While details are scarce at the moment, the gambit might simply be Apple's way of countering the hardball negotiation tactics employed by the so-called big three - SK hynix, Samsung, and Micron - as well as KIOXIA.
February 17, 2026 — Source

This is the Ampere AmpereOne M A192-32M 192 Core 12-Channel DDR5 Arm CPU
This is the Ampere AmpereOne M A192-32M 192 Core 12-Channel DDR5 Arm CPU
February 17, 2026 — Source

Computer — Processors — February 15th, 2026

Chinese scientists 3D print tiny items in half a second using holographic light fields — scientists precision fabricate complex millimeter-scale objects in record time
Spinning the light source, instead of the material, has some benefits, too.
February 15, 2026 — Source

Intel Nova Lake Tile Die Size Is Reportedly Under 100 mm2; bLLC Variant To Measure Nearly 153 mm2
The previous rumors about Intel's upcoming Nova Lake tile die are mostly correct, and we are seeing die sizes of nearly 100 mm² for these chips.
February 15, 2026 — Source

Computer — Processors — February 14th, 2026

AMD Ryzen 7 9800X3D Reportedly Dies At Less Than 10% Usage On ASUS X870 Motherboard
Another case of CPU failure, but the user reports minimal CPU usage when it died. This time, it was the ASUS motherboard.
February 14, 2026 — Source

Intel "Core X" HEDT Nova Lake-S rumor: 52-core full-power mode could push motherboard requirements higher
Power requirements will push motherboards manufacturers to innovate.
February 14, 2026 — Source

Intel expands XeSS multi-frame generation to Battlemage, Alchemist GPUs and more
Intel's latest graphics driver brings XeSS Multi-Frame Generation support to even more of its graphics lineup, including Arc discrete GPUs.
February 14, 2026 — Source or Source

Intel fined $3 million by India's antitrust regulator over discriminatory CPU warranty policy — says Intel abused its dominant position in the boxed processor market.
The Competition Commission of India alleges Intel abused its dominant position in the boxed processor market.
February 14, 2026 — Source

Radeon Vega lives on, Acemagic N3A NAS launches with Ryzen 7 3750H "Picasso" APU
Acemagic N3A combines Ryzen 7 3750H with four SATA bays and dual M.2 slots
February 14, 2026 — Source

Computer — Processors — February 13th, 2026

AMD Desktop CPU Share Surges to 36.4% as Intel Slips
New CPU shipment estimates from Mercury Research suggest AMD is continuing to narrow Intel's long-held lead across the x86 market, with desktop showing the sharpest movement. In Q4 2025, AMD captured 36.4% of desktop CPU shipments, while Intel accounted for 63.6%. The year-over-year comparison is where it gets spicy: AMD was at 27.1% in Q4 2024, while Intel stood at 72.9%. That puts AMD's desktop gain at roughly ten percentage points in a year, and it pulls Intel down by a similar magnitude.
February 13, 2026 — Source

Arctic Brings Us Our First Thermal Paste Showdown In Quite Some Time
The thermal paste you use may not reduce the running temperature of your CPU temperature by a huge amount, but it can mean the difference between a stable overclock and one that crashes under heavy load. Many people have their favourite thermal paste brand and everyone knows that only they have the one true method to properly apply that paste.
February 13, 2026 — Source

Congatec Panther Lake embedded modules add LPCAMM2 and up to 96GB LPDDR5X options
Congatec puts Panther Lake on small embedded module boards
February 13, 2026 — Source

Intel Nova Lake "Dual Compute Tile" CPU Power Limits: 150W PL1, PL2 Almost 500W, 800W+ PL4
The preliminary power limits of Intel's Nova Lake "Dual Compute Tile" CPUs have been revealed, with up to 150W PL1 & 500W PL2.
February 13, 2026 — Source

Computer — Processors — February 12th, 2026

Arctic Announces Freezer 4U-OneX CPU Cooler
The Freezer 4U Series delivers cooling performance for modern data centers with diverse processor architectures and high-performance server CPUs. With its newest addition, the Freezer 4U-OneX, the series is now also fully compatible with AmpereOne processors on the LGA5964 socket. The Freezer 4U-OneX not only includes MX-7 thermal paste which will be applied to the die, but also thermal pads that are placed on the IHS to ensure full thermal coverage.
February 12, 2026 — Source or Source

Computer — Processors — February 11th, 2026

AMD Medusa Halo With Up To 24 Cores May Use LPDDR6 For Huge Bandwidth Gains
If you read this site regularly, you probably know about AMD's Ryzen AI Max series. Codenamed Strix Halo, this is AMD's massive mega-chip with up to 16 CPU cores and Radeon RX 7600 XT-level integrated graphics. The next-generation version is thought to be codenamed Medusa Halo, and while we've heard some wild rumors about these parts in the past, this one is entirely plausible: it will support LPDDR6 memory.
February 11, 2026 — Source

AMD Ryzen 7 5800X/XT Outsells Nearly Every CPU, Becoming Even More Popular Than Ryzen 7 7800X3D
AMD's Zen 3 is going strong, but the rise of the 8-core/16-thread Ryzen 5800X/XT is surprising, as it is closest to the Ryzen 7 9800X3D in sales figures.
February 11, 2026 — Source

ASRock Phantom Gaming 360 LCD 360mm AIO Liquid Cooler Review: Great Cooling With VRM Fan & Halo-ARGB Fan Frame
The PC cooler industry remains vibrant with several options for users to select from. There are several well-known and go-to brands for cooling enthusiasts, but every once in a while, we get an opportunity to review products from companies that are unheard of. ASRock is the latest entrant in this market who have been steadily expanding its PC hardware and component reach into various segments. At CES, we got to see their full-fledged lineup, ranging from entry-level to mainstream and high-end designs.
February 11, 2026 — Source

Chipmaker Patch Tuesday: Over 80 Vulnerabilities Addressed by Intel and AMD
More than two dozen advisories have been published by the chip giants for vulnerabilities found recently in their products.
February 11, 2026 — Source

Our testing shows the Ryzen 7 9800X3D can match the pricier Ryzen 7 9850X3D with simple PBO settings — AMD's latest CPU can't leverage extra clock speed in games
Turn your Ryzen 7 9800X3D into a Ryzen 7 9850X3D with a two-minute BIOS detour.
February 11, 2026 — Source

Samsung starts mass production of next-gen AI memory chip
Samsung Electronics announced Thursday it had started mass production of next-generation memory chips to power artificial intelligence, touting an "industry-leading" breakthrough.
February 12, 2026 — Source

Computer — Processors — February 6th, 2026

AMD Ryzen 7 9800X3D Has Reportedly One Of The Lowest RMA Rates In Ryzen 9000/7000 Series
Despite numerous CPU failures, the Ryzen 7 9800X3D RMA rate is roughly on par with other Ryzen 9000 CPUs.
February 6, 2026 — Source

AMD Ryzen Threadripper Pro 9995WX OC Draws 1,300 W Under Direct-Die Watercooling
AMD Ryzen Threadripper Pro 9995WX HEDT processor with 96 cores and 192 threads comes with a default TDP of 350 W. However, heavy overclocking can bring the CPU to 1,300 W and requires a custom integrated heat spreader (IHS) that serves as a direct-die waterblock. In the latest endeavor by Geekerwan, the enthusiast created a custom fin structure inside the Ryzen Threadripper Pro 9995WX IHS that serves as a direct-die waterblock to achieve an impressive overclock of 5.325 GHz, drawing an astonishing 1,340 W during load, with the entire system drawing around 1,700 W.
February 6, 2026 — Source or Watch Video

AMD's 96-core beast with watercooling engraved into CPU joins car and industrial parts in a 2,000W direct die cooling setup — $12,000 CPU runs at 5.3 GHz, devours 1,300W, and still runs cooler than your gaming PC
Who in their right mind turns a $12,000 chip's IHS into a water block?
February 6, 2026 — Source

CPU scaling with DLSS — investigating CPU performance in the age of upscaling
In a time of ubiquitous upscaling, your CPU can quickly become a performance bottleneck.
February 6, 2026 — Source

Intel Arc A380 Hack Runs XeSS 3 Multi-Frame Generation For A Big FPS Boost
The Intel Arc A380 is a meager GPU by modern measures. It has just 8 Xe-cores, giving it a smaller GPU than the Core Ultra X9 388H's integrated part. It's based on the original Alchemist architecture, which is considerably less capable than the second-generation Battlemage designs that we're so fond of.
February 6, 2026 — Source

Intel reportedly 'cancels' Core Ultra 9 290K Plus, but keeps 270K/250K Arrow Lake Refresh SKUs
Intel has reportedly canceled its Core Ultra 9 290K Plus desktop CPU. This is based on information we received from two sources. Intel has not publicly announced a Core Ultra 200S Plus desktop lineup, and it has not issued an official cancellation notice. This means that technically it was never canceled, because it was never announced.
February 6, 2026 — Source

M5 Pro Didn't Show Up In The Latest iOS 26.3 Beta Because It Is A Rebranded M5 Max Using A Single Chip Design, Thanks To TSMC's 2.5D Technology
Apple continues to keep us in suspense as the M5 Pro and M5 Max launches remain in limbo, with the only concrete details available to us being that these chipsets will arrive in the first half of 2026. Recently, evidence of only the M5 Max and M5 Ultra was referenced in iOS 26.3 Beta, with the M5 Pro strangely missing.
February 6, 2026 — Source

MSI GeForce RTX 5090 Lightning Z GPU Listed at $5,200 in Taiwan
MSI's most powerful GPU—the GeForce RTX 5090 Lightning Z—will come with an extreme price tag to match, as the company has listed its GPU for NT$165,000, which works out to about $5,200. The company noted this pricing in a 24-hour giveaway scheduled to begin on Monday, February 9, at 10:00 AM Taiwanese time, lasting until Tuesday, February 10. The listing has revealed that the card we previewed at the 2026 International CES show is not only a premium design but also a premium-priced product, as the supply is limited to only 1,300 samples.
February 6, 2026 — Source

Noctua surpasses 500K upgrade mounting kits shipped
Noctua has achieved a major logistical and environmental milestone, announcing that it has now shipped its 500,000th mounting upgrade kit to customers globally.
February 6, 2026 — Source

Report: Intel Cancels Flagship Core Ultra 9 290K Plus "Arrow Lake Refresh," But Keeps Other SKUs
Two sources close to the media note that Intel's flagship Core Ultra 9 290K Plus might not roll out at all, despite the massive hype and leaked benchmarks indicating that Intel is releasing this CPU SKU as part of the "Arrow Lake Refresh" generation expected to arrive in March or April. Reportedly, Intel will instead focus on delivering value with its Core Ultra 7 270K Plus SKU, which carries 8 P-Cores and 16 E-Cores and a 5.5 GHz maximum turbo boost. For individual boosting frequency, P-Cores top out at 5.4 GHz, while the base runs at 3.7 GHz. For E-Cores, the boost frequency is set to a maximum of 4.7 GHz, while the base is set at 3.2 GHz.
February 6, 2026 — Source

World's Largest AI Chip with 4 Trillion Transistors
The United Arab Emirates has revealed what it describes as the world's largest AI processor, featuring 4 trillion transistors integrated onto a single wafer-sized chip. The announcement was made by Lt. General Sheikh Saif bin Zayed Al Nahyan, Deputy Prime Minister and Minister of Interior, during a keynote at the World Governments Summit in Dubai.
February 6, 2026 — Source

Computer — Processors — February 4th, 2026

Intel CPUs Record First Period of Growth on Steam Survey After Months of Decline
As February has just started, Valve finished processing data for the January edition of the Steam Hardware and Software Survey. One of the few interesting takeaways is that for the first time in months, Intel's share of consumer CPU usage has seen an uptick, instead of the slow decline it has been experiencing. According to the January update, Intel's CPU share among Steam platform users has grown to 56.64%, representing a small but pleasant increase of 0.25% over the December data. On the other hand, AMD recorded a slight decrease of 0.19%, now standing at 43.34% of the market.
February 4, 2026 — Source

Intel Xeon 600 CPUs Arrive for Workstations
Intel's Xeon 600 series is here, providing new competition for AMD's Ryzen Threadripper 9000 series of workstation CPUs. The new processors, which were codenamed Granite Rapids-WS, are aimed at businesses involved in AI development, 3D rendering, data analysis, and other compute-intensive tasks. Intel is releasing 11 models with processor core counts ranging from 86 at the high end to 12 for the base model.
February 4, 2026 — Source

Intel's Arc B390 iGPU is close match to Xbox Series S in Alan Wake 2, test shows
Panther Lake iGPU matches Xbox Series S in Digital Foundry's Alan Wake 2 test
February 4, 2026 — Source

Levelplay Launches Combat Liquid HUD and Combat Liquid SE AIO CPU Coolers
Levelplay Launches Combat Liquid HUD and Combat Liquid SE AIO CPU Coolers
February 4, 2026 — Source

Computer — Processors — February 2nd, 2026

AMD adopts FRED together with Intel for Zen 6 architecture — replacement for decades-old IDT can improve performance and stability
Good riddance, IDT. You won't be missed.
February 2, 2026 — Source

Arm Flexible Access Helps Startups Build Chips Faster
Arm Flexible Access is evolving, unlocking broader startup eligibility, expanded edge AI capabilities, and a more flexible way to design, test, and bring silicon to market. Innovation in silicon design thrives on iteration. For startups and established design teams alike, the ability to explore, test, and refine without financial friction is essential. That's why Arm Flexible Access is evolving to make that journey even easier.
February 2, 2026 — Source

Binning results from 13 Ryzen 7 9850X3Ds prove that the CPU is purely an overclocked 9800X3D from the factory — 9850X3D looks similar to 9800X3D, just with higher voltages
The worst sample of the 13 required 1.355v to achieve its maximum single-core boost clock.
February 2, 2026 — Source

Core UItra 9 290K Plus "Arrow Lake Refresh" CPU leaks again, now 10% faster than 285K
The entry shows a system running on an ASUS ROG STRIX Z890-E GAMING WIFI board and upcoming Intel Arrow Lake Refresh SKU known as 290K Plus, the new flagship desktop CPU. Memory is listed as 64 GB of DDR5-6800 Geekbench reports a 24-core setup split into two clusters (8 and 16), with a listed maximum frequency of 5.6 GHz.
February 2, 2026 — Source

Intel Core Ultra 9 290K Plus Ends Up 10% Faster In ST & 11% Faster In MT Versus 285K In Latest Leak
Intel's Core Ultra 9 290K Plus CPU has leaked out once again, and delivers up to a 11% performance boost over the 285K.
February 2, 2026 — Source

Intel Core Ultra 200 And AMD Ryzen 9000 CPUs Reportedly Have Similar Failure Rates, Reveals Puget Systems Analysis
Puget Systems Tracking Reveals Nearly 2.5% Failure Rates for Latest AMD and Intel CPUs; Non-X3D Chips Reportedly Die More Often Than X3D Counterparts
February 2, 2026 — Source

Intel XeSS 3 Runs on Arc B580 Before Official Support Lands
Intel XeSS 3 with multi-frame generation (MFG) is expected to be available this month for the Arc B580 "Battlemage" graphics cards. However, some Redditors suggest there's a workaround to enable XeSS 3 and gain the FPS boost from MFG through a simple file swap.
February 2, 2026 — Source

Intel's upcoming Core Ultra 9 290K Plus appears on Geekbench with chart-topping scores — Arrow Lake refresh beats the 285K by ~10% across single- and multithreaded tests
Intel's latest desktop chips are coming along nicely.
February 2, 2026 — Source

Intel's Core Ultra 9 290K Plus Shows 10% Performance Boost Over Core Ultra 9 285K
Intel's next desktop "Arrow Lake Refresh" CPU upgrade is inching closer to reality. The Core Ultra 9 290K Plus has been spotted in a new Geekbench run, adding to the evidence that the "Arrow Lake Refresh" will indeed offer a meaningful performance improvements over its predecessors. The test system used an ASUS ROG Strix Z890-E Gaming Wi-Fi board with 64 GB of DDR5-6800 memory. The processor achieved scores of 3,535 in the single-core test and 25,106 in the multicore test.
February 2, 2026 — Source

Overclocker shares Ryzen 7 9850X3D binning results featuring 13 CPUs
A new set of Ryzen 7 9850X3D binning were shared by overclockers sugi0lover and chunmu82, who have been logging early samples.
February 2, 2026 — Source

Puget Systems reliability data shows Core Ultra 200 and Ryzen 9000 X3D with near-identical failure rates
Puget: Core Ultra 7 265K has only 0.77% reported failures
February 2, 2026 — Source

Puget 2025 Reliability Report: Intel, AMD CPUs Tie, RTX 50 Leads
Puget Systems has published its annual "Most Reliable Hardware" summary for 2025, based on the company's own build volume and support records. While the report reflects Puget's curated parts list rather than the entire DIY market, it provides a grounded look at which components most often triggered replacements in real workstation deployments—where stability tends to matter more than chasing peak benchmark numbers.
February 2, 2026 — Source

Puget Systems Reveals 2025's Most Reliable PC Hardware, Do The Results Surprise You?
Puget Systems has released its 2025 Hardware Reliability Report: if you're familiar with the company's annual reports, they offer an invaluable look at which components in your build actually survive the rigors of professional use.
February 2, 2026 — Source

Computer — Processors — February 1st, 2026

Intel sets a 7467 MT/s+ memory requirement for Panther Lake Arc B-series iGPU branding, slower configs show up as "Intel Graphics"
Intel Arc Xe3 B-Series won't appear with its full marketing name, unless laptop has memory meeting the standard
February 1, 2026 — Source

Computer — Processors — January 31st, 2026

AMD Zen 6 'leak' suggests compact 12-Core CCDs with 48MB L3 cache
AMD's next‑generation "Zen 6" microarchitecture may bring some notable changes, according to a new rumour shared by leaker HXL (via VideoCardz). The post claims AMD is considering increasing the core density of its standard CPU Complex Die (CCD) for the first time, moving from the long‑standing 8‑core layout to a 12‑core configuration. The same rumour also mentions a shift to TSMC's latest process node and a larger L3 cache per CCD.
January 31, 2026 — Source

NVIDIA CEO Jensen Huang Tips Hand On N1 AI PC Chip Plans
When you think NVIDIA, you think "GPUs." It's easy to forget that NVIDIA's been making system-on-a-chip products for nearly 20 years; the first Tegra SoC came out in early 2008. The company's chips haven't really found their way into mainstream laptops, but that's about to change with the release of the N1/N1X processors.
January 31, 2026 — Source

The entry-level CPU we believe is "masterclass of performance-per-watt efficiency" is now under $200 — it has CPU Speeds of 3.9 GHz, 6 Cores, and more
If you're a beginner PC builder and you're looking for an affordable CPU to start developing your skills and rig with, the AMD Ryzen 5 9600X is a good place to start now that it's 34% off
January 31, 2026 — Source

Computer — Processors — January 30th, 2026

AMD replaced user's Ryzen 9 7950X3D with 9950X3D during RMA
A Redditor "Space_swag" says an AMD warranty RMA for a Ryzen 9 7950X3D ended with a Ryzen 9 9950X3D arriving as the replacement. The user also said the confirmation email listed the new OPN before delivery, so the swap was not a surprise at the doorstep.
January 30, 2026 — Source

AMD Surprises User With Ryzen 9 9950X3D As A Replacement For Ryzen 9 7950X3D RMA
Not everyone is lucky enough to get a newer and faster piece of hardware in RMA, but this user couldn't hide his excitement after receiving the upgrade.
January 30, 2026 — Source

AMD "Zen 6" CCD Packs 12 Cores, 48 MB L3 Cache
The standard CPU complex die (CCD) chiplet based on AMD's next-generation "Zen 6" microarchitecture is poised to feature a 50% increase in CPU core counts. This would be the first time that AMD has increased core-counts of its CCDs containing full-sized CPU cores capable of sustaining high clock speeds. It had developed CCDs with high core counts using compacted cores with lower clock speed limits until now.
January 30, 2026 — Source

AMD Zen 6 CCD Reportedly Measures 76mm2: Slightly Bigger Than Zen 5 But With 50% More Cores & Cache, Based on TSMC N2 Node
AMD's Zen 6 CCD is going to be similar in size to the last-gen Zen offerings but features 50% more cores on the TSMC N2 process node.
January 30, 2026 — Source

Asus Accidentally Confirms 9950X3Dv2 CPU in 9850X3D Overclock Video
AMD has yet to announced the chip, but it's expected to come with twin 3D V-Cache chips stacked on two Zen 5 chiplets.
January 30, 2026 — Source

Intel shows off leading-edge tech with massive AI processor test vehicle — huge chip features four logic tiles, 12 HBM4 stacks, and 8X reticle size
But will products on its base ever be mass produced?
January 30, 2026 — Source

Leaker claims AMD Zen 6 will feature 48MB of L3 cache — keeping L3 cache-to-core ratio the same as Zen 5 with Zen 6's 12-core CCD
Increasing Zen 6 to 48MB of L3 cache per CCD will keep the core to L3 cache ratio the same as Zen 5.
January 30, 2026 — Source

Zen 6 CCD leak claims size similar to Zen 5 but with 12 cores and 48MB L3
For context, Zen 5 desktop Ryzen 9000 chips already show how AMD kept CCD area tight on a newer node. AMD's Ryzen 9000 uses a TSMC N4 process for CPU cores, and mainstream parts like Ryzen 7 9700X carry 32MB of L3. Coverage of the Zen 5 CCD has also put the compute die at about 70.6 mm², staying close to Zen 4's CCD size.
January 30, 2026 — Source

Zen 6 rumor: AMD shifts to 12-core CCD with bigger L3
Fresh chatter around AMD's next-generation Zen 6 design suggests the company is preparing a major upgrade to its standard chiplet building block: the CPU complex die, better known as the CCD. The headline claim is straightforward but significant: Zen 6 CCDs may move from 8 cores to 12 cores. That's a 50% jump in core count per chiplet, and it would be the first time AMD raises the core count of its mainstream, high-clock "full" CCD in this way. In the past, higher-density approaches were often associated with compacted cores or designs that didn't necessarily target the same frequency envelope as AMD's desktop-focused parts.
January 30, 2026 — Source

Computer — Processors — January 19th, 2026

AMD Ryzen 7 9850X3D CPU Sample Reaches 5.75 GHz on All Cores
AMD hyped up its forthcoming Ryzen 7 9850X3D model as succeeding the world's current fastest gaming desktop processor. Ahead of a rumored January 29 launch, benchmark and diagnostic leaks continue to flow out. Allegedly impressive boost numbers have turned up via the Overclock.net forum; likely resulting from experiments conducted on another pre-release sample. In a Gigabyte X870 AORUS TACHYON ICE motherboard-centric thread, the leaker—OC_Beer—claims that their screenshot was supplied by an unnamed acquaintance.
January 19, 2026 — Source

AMD Ryzen 7 9850X3D reportedly hits 5.75 GHz with all cores
Luckily for us, not many reviewers and overclockers follow NDAs. Wherever the source came from, the new screenshot and test results featured the soon-to-be-released Ryzen 7 9850X3D. This is the same 8-core CPU with 3D V-Cache as the 9800X3D, AMD's top-selling and best-performing gaming CPU for the AM5 platform.
January 19, 2026 — Source

Tesla Completes AI5 Chip, Revives Dojo 3 with Intel Packaging Deal
Tesla has finalized the development of its AI5 automotive processor, allowing for production at TSMC and Samsung facilities. This advancement also revives the previously halted Dojo 3 supercomputer project. CEO Elon Musk announced that the AI5 chip will offer performance on par with NVIDIA's "Hopper" architecture, with two AI5 units equaling the power of a single "Blackwell" processor.
January 19, 2026 — Source

Tesla Goes "All In" on Chipmaking as Elon Musk Confirms Dojo3 Is Back on Track; AI5 Chip to Rival NVIDIA's Blackwell with Much Better Perf/$
Well, it seems Tesla's plans to go all-in with its custom silicon have become much more aggressive, as Musk says the automaker intends to compete with NVIDIA's leading offerings.
January 19, 2026 — Source

Computer — Processors — January 15th, 2026

AMD's 3D V-Cache Is Such A Hit For L3 It May Stack L2 Cache On CPUs Next
AMD's extant "X3D" processors include a feature called 3D V-Cache, which involves bonding a slab of SRAM cache to the logic die in such a way that it physically extends the L3 cache of the CPU to triple its original capacity. What if we could do the same thing for L2 cache? AMD may actually be investigating that, as one of its employees filed a patent back in 2024 about doing exactly that.
January 15, 2026 — Source

New 'StackWarp' Attack Threatens Confidential VMs on AMD Processors
Researchers have disclosed technical details on a new AMD processor attack that allows remote code execution inside confidential VMs.
January 15, 2026 — Source

Computer — Processors — January 9th, 2026

CPS PCCooler at 2026 CES: First Air CPU Cooler with True-Color Display
CPS PCCooler brought a large selection of new cases, PSUs, AIO and air type CPU coolers, to the 2026 International CES. Starting things off, we've come across their KN-series, YS-series, and YT-series premium ATX 3.1 PSU series, each with modern 12V-2x6 connectors, and differentiated by features such as idle fan-stop, Cybenetics acoustics ratings, body depth, and fan sizes. The SU1650 is a Cybenetics Titanium-rated 1650 W PSU (probably the most efficient PSU in its wattage-class), and puts out two 600 W 12V-2x6 connectors.
January 9, 2026 — Source

CPU-Z 2.18 released with 290K+, 9850X3D and Medusa Point (Zen6) support
CPU-Z adds support for new unreleased CPUs
January 9, 2026 — Source

CPUID Adds Support For Ryzen 9850X3D, Medusa Point, And Arrow Lake Refresh CPUs To CPU-Z
CPU-Z Version 2.18 Adds Support for Many Newly Released and Un-Released Processors; Also Adds Improved Support For LPDDR5X CAMM2
January 9, 2026 — Source

HWiNFO update brings enhanced support for Core Ultra 200K Plus, Ultra 300 and next-gen Core Ultra 400 series
HWiNFO 8.40 expands platform detection for Intel's next wave of mobile and desktop parts. The update adds new IDs for Nova Lake-H/HX (400H/HX), Arrow Lake Refresh (200K+), and Panther Lake SKUs (300), so early systems show up with the right names and sensor mappings.
January 9, 2026 — Source

Intel Panther Lake press Q&A transcript — EVO is still alive, and the company ditches prior-generation naming scheme
We sat down at CES 2026 with a panel of Intel staff to ask questions about Core Ultra Series 3.
January 9, 2026 — Source

Intel showed up for consumers at the 'Consumer Electronics Show;' AMD didn't
AI everywhere is starting to feel like it comes at a cost.
January 9, 2026 — Source

Computer — Processors — January 8th, 2026

AMD claims Panther Lake has 'too much baggage' for handheld PC use — fights back after Intel jabs AMD for using 'ancient silicon' in its Z2 series APUs
Calling Z2 ancient is comedic when the flagship model comes with AMD's latest Zen 5 architecture.
January 8, 2026 — Source

AMD introduces Ryzen AI Embedded P100 (Strix Point/Krackan) and X100 (Strix Halo) series
AMD has introduced Ryzen AI Embedded as a new embedded x86 processor portfolio with two branches. P100 targets in vehicle systems and industrial automation, while X100 is the follow up aimed at heavier "physical ai" and autonomous designs.
January 8, 2026 — Source

AMD Ryzen 7 9850X3D OEM CPU Already Delidded
AMD officially unveiled its new 8-core Ryzen 7 9850X3D desktop gaming processor earlier in the week; in virtual and specification form. A day later, select members of the press have inspected physical examples at CES 2026. Lately, PCGamesHardware Germany and Club386 have presented photos of OEM hardware—as evidenced by a visible OPN code, reading as "100-000001973." A few e-tailers have started listing the retail version—web searches of the related "100-100001973WOF" designation bring up Team Red's boxed product.
January 8, 2026 — Source

AMD teases heavily-rumored Ryzen 9 9950X3D2, continues to leak despite CES no-show — Alienware Area 51 may not be a beneficiary after all
Along with a British system integrator who's putting it inside a workstation.
January 8, 2026 — Source

ASUS TUF Gaming TM500 Desktop To be Fitted With AMD Hawk Point CPUs
During CES 2026, ASUS quietly showcased a new prebuilt system under its TUF Gaming brand, the TUF Gaming TM500. At first glance, it appeared to be a fairly conventional compact gaming desktop, and it initially drew little attention on the show floor. A closer inspection, however, revealed an unusual design choice that sets the TM500 apart from most mainstream gaming PCs. Instead of using a standard desktop processor, the TUF Gaming TM500 is powered by mobile CPUs from AMD's Hawk Point family. ASUS confirmed configurations based on either the AMD Ryzen 5 220 or the AMD Ryzen 7 260, both derived from AMD's Zen 4 architecture.
January 8, 2026 — Source

Carbice Shows Off Ice Pad, a High-Performance Carbon Nanotube Thermal Pad
Carbice is a new entrant at CES, and we caught their revolutionary new product, called simply Ice Pad. This is a high-performance, sold-state thermal pad based on carbon nanotubes, a technology more advanced than graphite-based thermal pads from, say, Hitachi. Graphite based pads tend to offer much higher thermal conductivity than regular polymer-based ones, but carbon nanotube (CNT) based ones tend to offer even higher axial thermal conductivity. The Ice Pad offers in-plane thermal conductivity of 200 W/mK, and outlasts a conventional TIM application by years.
January 8, 2026 — Source

Entry-level Intel Core Series 3 "Wildcat Lake" Mobile Processor Spotted at CES
Entry-level Intel Core Series 3 "Wildcat Lake" Mobile Processor Spotted at CES
January 8, 2026 — Source

First Close-Up Photos of AMD Ryzen 7 9850X3D Emerge
The first close-up images of AMD Ryzen 7 9850X3D have surfaced, offering an early look at AMD's next-generation X3D desktop CPU ahead of its official availability. The photos provide a detailed view of the processor package, confirming that AMD continues to refine its 3D V-Cache implementation within the AM5 ecosystem. From the images, the Ryzen 7 9850X3D retains the familiar AM5 heatspreader design, closely resembling other Ryzen 7000- and 9000-series processors.
January 8, 2026 — Source

Inno3D iChill GeForce RTX 5080 Frostbite and RTX 5090 Frostbite PRO Hands On
Here are some of the first pictures of Inno3D's new flagship custom-design graphics cards targeting enthusiasts with DIY liquid cooling setups. The Inno3D iChill GeForce RTX 5090 Frostbite PRO comes with a factory-fitted full-coverage water block sourced from Alphacool. This block has its coolant ports toward the tail-end of the card instead of the top (fittings not included). These come with standard G 1/4" threads. The block is nickel-plated copper with a metal alloy top that has a carbon fiber pattern decal. The card surprisingly lacks any factory overclock, so you can go to town yourself.
January 8, 2026 — Source

Intel Debuts Core Ultra Series 3 CPUs From Its 18A Node
Laptops with the processors will be ready before the end of the month.
January 8, 2026 — Source

Intel Jabs AMD With New Panther Lake Chips, Claiming Team Red Is Selling 'Ancient Silicon' in the Handheld Market
Intel appears confident in its new Panther Lake chips, especially for the handheld segment, as the company refers to chips from AMD as "ancient silicon."
January 8, 2026 — Source

Intel Launches Core Ultra Series 3 Mobile Processors -- Panther Lake Roars to Life
For the PC hardware space, the marquee announcement coming out of CES 2026 this year is without a doubt the launch of Intel's Core Ultra Series 3 of chips. Going by the codename of Panther Lake, the latest of Intel's lakes marks two very important milestones for the company. Besides being the launch of a new generation of hardware -- with new architectures and new features all around -- the Core Ultra Series 3 also marks the debut of Intel's highly anticipated Intel 18A process node, which itself incorporates several major changes in how chips are built. As a result, the launch of the Core Ultra Series 3 has become a critical moment for both halves of the house of Intel -- chip design and chip manufacturing -- to show off what they can do.
January 8, 2026 — Source

Intel shows off Arc B390 graphics in games: "playable at 1080p with XeSS"
Intel's Panther Lake laptops are starting to show up in controlled CES 2026 hands-on sessions. Tom's Hardware tested a Lenovo reference system with the Core Ultra X9 388H and Arc B390 iGPU, which is the 12 Xe3-core configuration reserved for X-series parts. Reveiwers at the scene were closely monitored and were not allowed to just tinker with the reference system how they liked. So naturally these are just early hands-on videos with some general understanding where Intel Arc B390 will sit.
January 8, 2026 — Source

Intel Wildcat Lake 6-core chips for budget devices will replace Alder Lake-N and Twin Lake (eventually)
Intel's Alder Lake-N and Twin Lake chips are cheap, low-power chips that have been popular options for entry-level mini PCs, laptops, and other devices like tablets and single-board PCs. But while these chips offer much better CPU and graphics performance than the Intel Celeron and Atom-branded chips they replaced, they're based on architecture that's several years old at this point.
January 8, 2026 — Source

Musk Says Tesla Will Build A 2nm Dirty Fab Where He Can Smoke Cigars And Eat Burgers
Semiconductor engineers everywhere are clutching their lint-free jumpsuits in horror as Elon Musk has announced his latest disruption: the "dirty fab," a chip lab so chill in its standards that you could smoke and eat a double fat cheeseburger inside.
January 8, 2026 — Source

Panther Lake is officially Intel Core Ultra Series 3 — here's how to understand all the new model names
Intel Core Ultra Series 3 was made official at CES 2026, so here's what you need to know about the new family.
January 8, 2026 — Source

Ryzen 9 9950X3D2: Alienware & Sytronix Feature it in Pre-built Systems
Not long after AMD's alleged confirmation of the "Granite Ridge" flagship 16-core Ryzen 9 9950X3D2 CPU's existence, web sleuths noticed that the not-yet-launched SKU being included in marketing material and new product descriptions. Most tellingly, Alienware China's Weibo account inadvertently mentioned a new Area-51 desktop system powered by Team Red's Ryzen 9 9950X3D2 processor.
January 8, 2026 — Source

Thermaltake Shows New AIO CPU Coolers, Dual Infinity Mirror Fan Series, and V75 Max Keyboards
Thermaltake used CES 2026 to showcase several new cooling and peripheral products. The first of them is the ST360 Ultra ARGB Sync, a 360 mm AIO liquid cooler with a layout designed to reduce visible tubing by placing it on the side of the block. Its main feature is a detachable 7-inch magnetic IPS display, which can show system stats or custom visuals and can be repositioned elsewhere in the case. The cooler uses a single-frame 360 mm ARGB fan to reduce cable clutter and is available in Black and Snow, with standard motherboard ARGB sync support.
January 8, 2026 — Source

Computer — Processors — January 7th, 2026

Acer Introduces AMD Ryzen AI 400 Series Processors Across Copilot+ PC Portfolio
Acer today announced new models across its laptop portfolio with the latest AMD Ryzen™ AI 400 Series processors, including the thin-and-light Acer Swift Go 16 AI, the mainstream Acer Aspire 14 AI and Acer Aspire 16 AI, and the Acer Nitro V 16 AI for gaming, all featuring Copilot+ PC experiences on Windows 11. Built on the advanced "Zen 5" architecture, the new AMD Ryzen™ AI 400 Series processors enhance productivity and creative capabilities across the board.
January 7, 2026 — Source

Alienware hints that AMD actually planned Ryzen 9 9950X3D2 launch at CES
AMD's CES 2026 desktop CPU announcements raised eyebrows by their simplicity. Despite widespread expectations of a broader 3D V-Cache refresh, the company introduced only a single new X3D processor, the Ryzen 7 9850X3D. New information from Dell Alienware now suggests that this limited rollout may not reflect AMD's original plan. An official promotional video published by Alienware on its Weibo account references a "2026 CES AREA-51 Gaming Desktop with the latest AMD Ryzen processor."
January 7, 2026 — Source or Source

AMD hints you could buy a mobile Ryzen and drop it into a desktop PC
AMD isn't saying that you'll be able to, but it isn't denying that you won't, either.
January 7, 2026 — Source

AMD Reportedly Hints About Later Launch of Ryzen 9 9950X3D2 CPU
According to a fairly fresh ComputerBase social media post, AMD has confirmed the existence—reportedly to a select group of journalists—of their unreleased 16-core Ryzen 9 9950X3D2 SKU. During CES 2026 proceedings, the German computer hardware news outlet was seemingly briefed about an upcoming second quarter launch of Ryzen AI 400 series desktop APUs, and were told to "stay tuned" for future updates regarding the rollout of Team Red's dual 3D V-Cache flagship gaming chip.
January 7, 2026 — Source

AMD Ryzen Chief Confirms The Return Of AM4 As AMD Is Doing "Everything" To Bring More Supply Of Older Ryzen Processors
With DDR5 prices rising rapidly, AMD is now looking to bring back the prominent AM4 platform-compatible processors.
January 7, 2026 — Source

AMD signals possible AM4 Ryzen 5000 comeback to soften DDR5 upgrade costs
AMD signals possible AM4 Ryzen 5000 comeback to soften DDR5 upgrade costs
January 7, 2026 — Source

AMD suggests it may open-source FSR 4 after all following 'accidental' release last year
AMD hints FSR 4 could go open-source after the GitHub slip, but even if that's true, it does not mean RDNA3 will support it officially
January 7, 2026 — Source

AMD teases heavily-rumored Ryzen 9 9950X3D2, continues to leak despite CES no-show — Alienware Area 51 may not be a beneficiary after all
Along with a British system integrator who's putting it inside a workstation.
January 7, 2026 — Source

AMD unveils Ryzen AI 400 "Gorgon Point" and Ryzen AI Max+ "Strix Halo" processors
Coming soon to an AI PC near you
January 7, 2026 — Source

AMD's EPYC Venice, Instinct MI455X, & Helios Hardware On Display for First Time at CES 2026
Alongside AMD's numerous client-focused hardware announcements during their CES 2026 keynote, the company also devoted a bit of attention to their data center/server products. Though the company is essentially mid-cycle on its major data center products right now -- and thus is not launching anything in the immediate timeframe -- AMD still opted to use the attention garnered by hosting the official opening keynote for CES to outline the status of its 2026 server products.
January 7, 2026 — Source

ASRock Dips Into AIO Watercooling At CES 2026
ASRock made a splash at CES 2026 by introducing their first line of AIO watercoolers, marking a new venture for the company that has long served PC enthusiasts. The standout models are the flagship Taichi AQUA series, featuring swappable magnetic tops that allow users to choose between a 3.4-inch LCD screen or a clear panel to view the coolant flow. Designed for heavy-duty systems, these models boast dual pumps capable of handling over 500 watts and come with thick 38 mm radiators. The other four series cater to gamers and general PC builders. The Phantom Gaming series offers RGB lighting and additional cooling for VRM components, while the Steel Legend series emphasizes durability with industrial-grade bearings.
January 7, 2026 — Source

ASUS NUC 16 Pro Debuts With Core Ultra X9 Panther Lake CPU
ASUS has expanded its mini PC lineup at CES 2026 with the announcement of four new compact systems based on Intel and AMD platforms. The new range includes the NUC 16 Pro featuring Intel's Panther Lake processors, as well as updated ExpertCenter and ROG GR70 models powered by AMD CPUs. The ASUS NUC 16 Pro is built around Intel's Panther Lake architecture and can be configured with up to a Core Ultra X9 processor. This chip combines a 16-core CPU, an Arc B390 integrated GPU with twelve Xe3 graphics cores, and an NPU delivering up to 50 TOPS of AI performance.
January 7, 2026 — Source

be quiet! Showcases New Coolers, Previews Upcoming Lineup at CES 2026
be quiet! CES 2026 showcase is led by the Light Loop IO LCD, a new AIO liquid cooler aimed at high-end systems. It features a 2.1-inch IPS display (500 nits) for system stats or custom visuals, paired with RGB lighting. Cooling hardware includes three Light Wings LX PWM fans, a redesigned cold plate and jet plate, and a new pump design. The cooler is managed through be quiet!'s IO Center software and will be available in 240 mm and 360 mm sizes, in black or white.
January 7, 2026 — Source

CES 2026: Intel launches 18A 'Panther Lake' Core Ultra 3 CPUs
Intel has officially launched its third-generation Core Ultra mobile processors at CES 2026, marking the long-awaited debut of its Intel 18A process technology. Also known as Panther Lake, the Core Ultra Series 3 is the first compute platform designed and manufactured entirely in the US using 18A silicon. With a focus on mobile efficiency and integrated graphics, Intel is claiming a 76% uplift in gaming performance and a 60% improvement in multithreaded performance over the previous generation.
January 7, 2026 — Source

CES 2026: Sudokoo launches full line-up of CPU coolers
Sudokoo is making its first CES appearance this year, bringing along a host of new CPU coolers, covering both air and AIO units. We stopped by their booth to get a first-hand look at the new range.
January 7, 2026 — Source or Watch Video

First close-up photos of AMD Ryzen 7 9850X3D emerge
PC Games Hardware and Club386 have published close-up photos of AMD's Ryzen 7 9850X3D, including shots of the AM5 package with and without the heat spreader. PC Games Hardware did not say where the CPU was photographed, but the sample appears to be an OEM unit that likely came from an AMD briefing or a system integrator channel.
January 7, 2026 — Source

Frore Systems' LiquidJet and AirJet Pak cooling systems in the flesh — live demo with production hardware display impressive cooling capacity
I need these for my desktop, stat.
January 7, 2026 — Source

iBuyPower Presents New AW5 & AC5 CPU Coolers at CES 2026
iBuyPower has debuted two sets of brand-new CPU coolers on the show floor at CES 2026. TechPowerUp staff on the ground first inspected the pre-built system specialist's AW5 AIO model; available in black or white. Naturally, this new-gen all-in-one liquid cooler succeeds last year's AW4 cooler. Instead of utilizing the predecessor's RGB Vortex water block design, iBuyPower engineers have deployed a new circular segmented display on the AW5. In collaboration with HYTE, a software control system can—by default—send temperature, fan speed, and other diagnostic information to the water block's display.
January 7, 2026 — Source

Intel Panther Lake pre-release testing delivers over 80 fps in Cyberpunk, 100 fps in F1 — Arc B390 offers playable 1080p frame rates with XeSS quirks in our hands-on tests
Panther Lake's 12 Xe3 cores can deliver some serious gaming horsepower, but the software still needs work
January 7, 2026 — Source

Intel quietly launches Wildcat Lake third-generation Core processors with six cores
Intel has quietly expanded its processor lineup with the introduction of Wildcat Lake, a third-generation Core processor family that arrived alongside the company's CES 2026 announcements. While Panther Lake dominated the spotlight as Intel's next major Core Ultra platform, Wildcat Lake represents a more compact and efficiency-oriented alternative built on the same modern IP foundations. Wildcat Lake shares its core architectural elements with Intel's other contemporary designs. It integrates Cougar Cove performance CPU cores, Darkmont efficiency-focused cores, graphics based on the Xe 3 architecture, and Intel's fifth-generation NPU for AI workloads.
January 7, 2026 — Source

MSI's new MPG CoreFrozr CPU air coolers feature a 6-inch LCD display — plus customizable readouts, copper base, and Ryzen X3D support
MSI's new premium dual-fan MPG CoreFrozr coolers feature removable LCDs
January 7, 2026 — Source

New Ryzen CPUs for AM4 may be back on the menu as AMD considers reintroducing select SKUs
AMD may be looking at bringing back older AM4 desktop parts based on Zen 3. At a CES 2026 roundtable attended by Tom's Hardware, AMD's David McAfee said the company is exploring ways to "reintroduce products" into the AM4 platform so gamers can upgrade without replacing the whole system.
January 7, 2026 — Source

Qualcomm Finally Moving To A Dual-Foundry Strategy, As Samsung Will Reportedly Mass Produce The Snapdragon 8 Elite Gen 5 On Its 2nm GAA Process, With Design Work Completed
Samsung's efforts to secure 2nm GAA chip orders from Qualcomm for its Snapdragon 8 Elite Gen 5 have been well-documented. The Korean giant had previously been reported to have sent a sample to the company for evaluation purposes on its cutting-edge lithography, the same one used to mass produce the Exynos 2600. Now, Samsung appears to have caught a break because the latter has seemingly entered into talks with Qualcomm to manufacture the Snapdragon 8 Elite Gen 5, a move that's expected to benefit both firms.
January 7, 2026 — Source

Ryzen 9 9950X3D2 Not Cancelled as AMD Says Stay Tuned
AMD's CES 2026 announcements delivered an update for the X3D lineup with the Ryzen 7 9850X3D, but the company did not publish any formal details for the rumored Ryzen 9 9950X3D2. That absence immediately triggered speculation that AMD had cancelled its alleged next flagship, especially given how much attention the "dual 3D V-Cache" concept has received in leaks and pre-show chatter. A post-event exchange suggests the situation is more "not ready to disclose" than "not happening."
January 7, 2026 — Source

Senior AMD executive suggests consumers buy cheap CPUs to combat memory pricing squeeze — says 'consumers have a wide assortment of choice available for all kinds of price points'
'Consumers have a wide assortment of choice available for all kinds of price points that they can buy for this coming year. So yeah, I'm not not too concerned about that.'
January 7, 2026 — Source

TSMC's 2nm Process is Reportedly Recording 1.5 Times More Tape-Outs Compared To The 3nm Node, Apple, Qualcomm & MediaTek To Make Up A Large Percentage
A bevy of chips mass produced on TSMC's 2nm process is expected to launch later this year, with MediaTek already having announced the tape-out of its first SoC on the next-generation lithography in 2025. Like the Taiwanese fabless semiconductor firm, several other customers are lined up to place orders on the next-generation process, with fresh details stating that TSMC's 2nm node has witnessed 1.5 times the number of tape-outs compared to the 3nm technology, indicating just how ravenous the demand is.
January 7, 2026 — Source

Computer — Processors — January 6th, 2026

AeroCool at 2026 CES: New Cases, Coolers, PSUs, and Fans
AeroCool brought a slick new lineup of cooling, casing, and power hardware to the 2026 International CES. We begin our tour with the Smart G1, a mainstream PSU with fixed cabling that meets ATX 3.1 standards and offers 80 Plus Gold switching efficiency. It comes in capacities up to 1000 W, and offers a 12V-2x6 (600 W) connector. It uses a low-noise 135 mm fluid dynamic bearing fan to keep cool. All its cables are individually sleeved and black. Next up, is the Premier G1, which is essentially the same PSU as the Smart G1, but with full modular cabling, and the addition of Cybenetics Platinum certification, and a zero-RPM mode for its 135 mm fan.
January 6, 2026 — Source

AMD announces Ryzen 7 9850X3D, a faster-binned flagship gaming CPU for Q1 2026
A KS-style play for enthusiasts chasing peak numbers
January 6, 2026 — Source

AMD Announces Ryzen AI 400 Series "Gorgon Point" Mobile Processors
AMD at the 2026 International CES announced the new Ryzen AI 400 series "Gorgon Point" mobile processors powering the company's client processor lineup through 2026. These chips are based on the new 4 nm "Gorgon Point" silicon that is a refresh of the current "Strix Point" monolithic processor supporting higher clock speeds across its various compute components, and updates to its power management. The processor implements the "Zen 5" microarchitecture, and uses a dual-CCX CPU with four full-sized "Zen 5" cores sharing a 16 MB L3 cache, and eight compact "Zen 5c" cores sharing an 8 MB L3 cache.
January 6, 2026 — Source

AMD Expands Ryzen AI MAX "Strix Halo" Processor Lineup
AMD today expanded its Ryzen AI MAX "Strix Halo" line of super-APUs with two new processor models, the Ryzen AI Max+ 392 and Ryzen AI Max+ 388. Both are based on the existing "Strix Halo" package, which combines a 16-core/32-thread "Zen 5" CPU based on standard "Zen 5" CCDs, with a large I/O die featuring a powerful iGPU based on RDNA 3.5 graphics architecture that has 40 compute units (2,560 stream processors), a Copilot+ ready NPU with 50 TOPS on tap, and a unified 256-bit LPDDR5X memory interface.
January 6, 2026 — Source

AMD Introduces Ryzen AI Embedded Processor Portfolio
Today, AMD introduced the AMD Ryzen AI Embedded processors, a new portfolio of embedded x86 processors designed to power AI-driven applications at the edge. From automotive digital cockpits and smart healthcare to physical AI for autonomous systems, including humanoid robotics, the new P100 and X100 Series processors provide OEMs, tier-1 suppliers and system and software developers in automotive and industrial markets with high performance, efficient AI compute in a compact BGA (ball grid array) package for the most constrained embedded systems.
January 6, 2026 — Source

AMD is launching an upgraded version of one of its best desktop CPUs, but I'm more excited about what this means for the other X3D models
Say hello to the AMD Ryzen 7 9850X3D... What's wrong? Is that too many numbers to keep track of?
January 6, 2026 — Source

AMD Launches Ryzen 7 9850X3D, The World's Fastest Gaming CPU Gets Even Faster
AMD today launched the Ryzen 7 9850X3D desktop processor. This 8-core/16-thread processor is powered by the "Zen 5" microarchitecture supercharged with 3D V-Cache technology, and is essentially a speed-increase over the current 9800X3D. The chip comes with a base frequency of 4.70 GHz, and maximum boost frequency of 5.60 GHz, a significant increase over the 4.70 GHz base and 5.20 GHz maximum boost of the 9800X3D. This 400 MHz increase in maximum boost frequency should increase boost frequency residency across thread counts.
January 6, 2026 — Source

AMD Q&A at CES 2026: We talk Ryzen and more
AMD talks us through the year ahead, and about the competitive landscape in the PC CPU market.
January 6, 2026 — Source

AMD may bring back AM4 processors to help users fight ongoing RAM crisis
The PC industry is currently experiencing a massive shock due to AI eating up all the resources and causing massive price increases on different components, particularly memory. Manufacturers are trying to adjust by trying different tactics. Some just give up on regular customers, while others try to adapt. NVIDIA, for one, is reportedly bringing back a five-year-old GPU from its grave, and AMD may be considering a similar strategy.
January 6, 2026 — Source

AMD Ryzen chief teases return of older Zen 3 chips to fight soaring RAM prices — 'That's something we're actively working on right now'
Bring out your salt shaker for this one, but it's one tasty morsel.
January 6, 2026 — Source

AMD unveils 256-core EPYC Venice for Helios MI455X AI racks platform
AMD used its CES 2026 stage time to connect two major data center themes: next-generation EPYC server CPUs and rack-scale AI infrastructure built around Instinct accelerators. During the event, CEO Dr. Lisa Su held up the upcoming EPYC "Venice" processor and framed it as the host CPU for the company's 2026 "Helios" AI rack design, which is described as being powered by Instinct MI455X GPUs. The configuration outlined for each compute node is a familiar AI-server formula: multiple accelerators per node, with a single high-throughput CPU responsible for memory, I/O, and system-level orchestration.
January 6, 2026 — Source

AMD Unveils Ryzen 7, Ryzen AI 400 Series, & Halo Developer Platform at CES 2026
AMD is expanding its computing portfolio at CES 2026. The announcements include Ryzen AI 400 Series processors, its fastest Ryzen 7 9850X3D processor, and Ryzen AI Max+ Series processors for ultra-thin notebooks. The company is also unveiling the Ryzen AI Halo developer platform.
January 6, 2026 — Source

AMD unwraps Instinct MI500 boasting 1,000X more performance versus MI300X — setting the stage for the era of YottaFLOPS data centers
Next-generation CDNA 6 architecture on-track for 2027.
January 6, 2026 — Source

AMD Zen 6 EPYC "Venice" Introduces a Radical Package Redesign
AMD CEO Dr Lisa Su at the company's 2026 International CES event held up the next generation EPYC "Venice" enterprise processor driving the company's 2026 "Helios" AI racks powered by AMD MI455X AI GPUs. Each node in the rack features four MI455X GPUs, and one EPYC "Venice" processor with a 256-core/512-thread configuration. The package features a significantly different layout of chiplets compared to current EPYC chips.
January 6, 2026 — Source

AMD's AI Chips Are Coming for Your Laptop, Desktop, and Car
AMD unveiled Ryzen AI 400 and Embedded processors at CES 2026, touting up to 60 TOPS NPUs and new chips for laptops, desktops, and edge devices.
January 6, 2026 — Source

AMD's Ryzen 7 9850X3D promises 7% uplift over Ryzen 7 9800X3D -- AMD fights itself with 'new fastest gaming processor'
AMD says the Ryzen 7 9850X3D and Ryzen 7 9800X3D will live side-by-side, but the gap between them looks very small.
January 6, 2026 — Source

AMD: Ryzen AI Max+ that wrecks Nvidia RTX 5070, Apple M5 & Intel get two new 5GHz APUs
At CES 2026, AMD today unveiled its new Ryzen AI 400 series APUs and explained how the new parts are often much better for gaming, content creation and work than Intel. Speaking of work, alongside the new 400 series APUs, AMD today also released some new Ryzen AI Max+ APUs.
January 6, 2026 — Source

APNX Introduces LC2 AIO Cooler, Shows V2 Cases and Max G1 PSUs at CES 2026
APNX presented its LC2 AIO liquid cooler at CES 2026, a follow-up of its LC1-D cooler featuring an aluminium water block with a customizable pump head that supports 3D-printed or interchangeable top covers. The cooler uses 28 mm thick fans and handles up to 300 W TDP. The company also displayed its V2 Mid-Tower cases (launched last year at Computex) and MAX G1 PSU series. The MAX G1 power supplies feature a fully modular design with debossed cables, ATX 3.1 compliance with 12V-2x6 connectors, and is both 80 Plus Gold and Cybenetics Platinum certified. The power supplies use a 135 mm FDB fan with Zero RPM mode and come in 1200 W, 1000 W, and 850 W models. APNX also showcased pre-built systems built in collaboration with Starforge Systems and based on its V2-F cases.
January 6, 2026 — Source

ASRock Expands Its AIO Liquid Cooler Range at CES 2026
Spanning the flagship Taichi series, professional-grade WS series, hardcore gaming-dedicated Phantom Gaming series, the durable Steel Legend series, and the mainstream-focused Challenger and Pro series, each lineup is purpose-built for its intended audience while remaining unified by ASRock's core DNA of performance, stability, and long-term reliability.
January 6, 2026 — Source

ASRock Expands Its Next-Gen AIO Liquid Cooler Range at CES 2026
ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, today officially unveiled its complete next-generation AIO liquid cooling lineup, marking a major step forward in the company's evolution into a comprehensive PC hardware solutions provider. Building on decades of proven engineering expertise in motherboards and graphics cards, ASRock now extends its design philosophy and thermal know-how into a full-spectrum AIO liquid cooler portfolio designed to support extreme enthusiast systems, professional workstations, gaming rigs, and mainstream PC builds alike.
January 6, 2026 — Source

Asus unveils the ROG Cronox, its first panoramic PC case with a 9.2" screen and rotating fan bracket — chassis supports up to 14x 120mm fans & dual 360mm radiators
The company's most ambitious case yet.
January 6, 2026 — Source

be quiet! @ CES 2026 -- New Coolers, PSUs & Mice
be quiet!, the German manufacturer for premium PC components and peripherals, is showcasing its upcoming products in Las Vegas. This line-up includes the company's first products with an LCD screen, the Light Loop IO LCD AiO water cooler and the Dark Rock Pro 6 IO LCD air cooler -- the latter is part of the company's flagship Dark Rock 6 series, which will also include Dark Rock Pro 6 and Dark Rock 6. Last but not least, be quiet! will display two new high-wattage power supplies, as well as the upcoming ultra-light Dark Perk Ergo and Dark Perk Sym gaming mice.
January 6, 2026 — Source

Bitspower Shows Off CPU Cooler Prototype with Multiple Mounted LCD Screens
Bitspower has a curious demo setup tucked in a corner of its Las Vegas suite. A cuboid CPU cooler—featuring three LCD screens—sits atop a dummy ATX-shaped motherboard. PC builders have become accustomed to the presence of single screens on various types of modern central processor cooling solutions. In stark contrast, Bitspower has opted into prepping an unusual triple-panel array that is hooked up to a nearby tablet. A proprietary application allows users to select picture, GIF or video content and adjust displayed diagnostic information.
January 6, 2026 — Source

CES 2026: AMD Client and Graphics Update Includes Ryzen 9850X3D CPU
While CES 2026 is expectedly an AI fest, AMD has offered some new consumer hardware, as evidenced by portions of their official client news summary:
January 6, 2026 — Source

CES 2026: ASRock debuts full line-up of AIO liquid coolers
At CES this week, ASRock has introduced a complete next‑generation AIO liquid cooling lineup, expanding its hardware portfolio beyond motherboards and graphics cards. The new range covers high‑end enthusiast systems, workstation platforms, gaming PCs and mainstream builds, with each series targeting a different segment.
January 6, 2026 — Source

CES 2026: be quiet! announces its first LCD-equipped AIO cooler, Dark Rock 6 and more
be quiet! is kicking off CES 2026 with a major refresh across its cooling, PSU, and peripheral lines — including its first products to feature integrated LCD displays. The company's showcase spans new AIO and air coolers, high‑wattage power supplies, and a pair of ultra‑light gaming mice.
January 6, 2026 — Source

CES 2026: Cooler Master launches new cases, PSUs and cooling solutions
Cooler Master is using CES 2026 to show the new entries to its enthusiast stack, bringing back some of its most iconic sub‑brands. The manufacturer's showcase in Las Vegas this week focuses on the "FreeForm 2.0" design philosophy, a modular approach that spans everything from the massive new Cosmos Alpha flagship to PSUs equipped with proactive GPU protection.
January 6, 2026 — Source

CES 2026: Intel Unveils 18A-Based Core Ultra Series 3 Chips Amid Rumors of Future Apple Partnership
Intel introduced its latest processors at CES 2026, debuting the "Panther Lake" Intel Core Ultra Series 3. The chips are the most advanced manufactured in the U.S., according to Intel, and they are built on Intel's 18A process.
January 6, 2026 — Source

CES 2026: Qualcomm Shows Off Snapdragon X2 Plus
It's a tamer version of the X2 Elite, but a solid step up from the previous generation.
January 6, 2026 — Source

Cooler Master @ CES 2026
At CES this week, Cooler Master unveiled a batch of new PC hardware centered on better cooling, system safety, and flexible design. The highlights are two new high-end cases and a power supply with built-in GPU protection.
January 6, 2026 — Source

Cooler Master @ CES 2026 Demo Previews Revived Hyper 812 and Slew of New Air Cooling Hardware
Cooler Master has shown off a number of interesting products during CES 2026, including new PC cases and accessories and new PSU tech that might help gamers avoid the dreaded 12v-2x6 cable meltdowns that have plagued both NVIDIA and AMD's modern GPUs of late. Aside from the other products we've already covered, Cooler Master is introducing a number of updates to its CPU air coolers at CES 2026. The Cooler Master Hyper 812 is a revival of one of Cooler Master's older CPU cooler designs, and judging by what the TechPowerup team has seen on the CES 2026 showroom floor, the single-tower CPU air cooler promises to deliver impressive performance in a minimalist package.
January 6, 2026 — Source

Did AMD just make the Ryzen 7 9800X3D obsolete? — A new CPU threatening its supremacy is on the way
Also announced at CES 2026 are new Ryzen AI 400 and Ryzen AI Max+ chips for laptops and desktops.
January 6, 2026 — Source

If you thought AIO cooler displays were neat, the latest gaming PC from Asus has holographic fans
The Asus ROG G1000 looks like an absolute monster, but its holographic fans will likely be the main draw
January 6, 2026 — Source

Intel launches Core Ultra Series 3 "Panther Lake" chips on its 2nm 18A process
Core Ultra Series 3 brings Xe3 graphics and a new NPU to laptops and small PCs
January 6, 2026 — Source or Source or Source or Source

LYNK+ at CES: Company Brings its Much Awaited LYNK+ CPU Block and 240 mm Radiator
LYNK with its LYNK+ modular AIO liquid cooling solution needs little introduction. It made a splash last year at Computex, promising to "unclutter" the tangled web of aftermarket cooling for high-end graphics cards, particularly RTX 5080 and RTX 5090 cards where the price difference between the cheapest and priciest custom designs can be as wide as $1000, if not more. Then in December 2025, we reviewed the LYNK+ with an RTX 5090, but at the time we could only grab the VGA cooler to go with an Inno3D iChill RTX 5090 X3, and a 360 mm radiator, so we could taste the pudding ourselves, particularly its quick-disconnect fittings.
January 6, 2026 — Source

New Adata XPG CPU Coolers with Wrap-Around LCDs and Infinity Mirrors at CES 2026
Adata has shown off the latest series of CPU coolers boasting LCDs and other fancy visual effects. The new Infinity, Levante, and Maestro CPU coolers offer something for just about anyone looking to spice up their PC build with a flashy CPU cooler, whether that be an air cooler or a liquid cooler. The most unique cooler of the lot is the Levante View Pro 360, which is an AIO CPU liquid cooler with a 6.7-inch waterfall LCD that covers both the top and side of the CPU water block. The display contents are customizable in the XPG Prime software. That water block is attached to a 360 mm radiator with pre-installed 120 mm ARGB fluid dynamic bearing fans.
January 6, 2026 — Source

No CPU is faster than Ryzen 9850X3D says AMD as it shares Windows 11 performance benchmarks
At CES 2026 today, AMD made a couple of major mobile processor announcements as it revealed its new 400 series lineup as well as a couple of new additional powerful Max+ APUs. While the latter was mostly productivity-focused with a lot of emphasis on AI performance, the company also unveiled a new Ryzen desktop processor, which the company claims is now "the world's fastest gaming processor."
January 6, 2026 — Source

Nvidia's new Vera Rubin chips: 4 things to know
Here's the info you need.
January 6, 2026 — Source

Patch Notes Reveal Separated CBB & IMH Tiles on "Diamond Rapids" Xeon 7 CPUs
Interesting details regarding Intel's upcoming "Diamond Rapids" Xeon 7 processor family have turned up in mid-to-late December patch notes. At the time, Team Blue's Linux team discussed the nature of the chipmaker's next-gen server-grade CPU series. When comparing the "Diamond Rapids" (DMR) design to a predecessor—"Sapphire Rapids" (SPR)—the engineers outlined several key differences and new additions. On a basic level, the two generations depend on discovery tables for uncore enumeration, but the plucky newcomer could feature: "two Integrated I/O and Memory Hub (IMH) dies, which are separate from the compute tile (CBB) dies. Each 'Core Building Block' (CBB) die and each IMH die has its own dedicated discovery table."
January 6, 2026 — Source

SAMA A60B & A60L CPU Cooler Review
SAMA delivers economic relief with its A60 air cooler series, offering impressive performance, strong thermals, and excellent value for PC builders.
January 6, 2026 — Source

Sudokoo at CES 2026: New Quick-Dock Fans, Mach CPU coolers, a 750W Air Cooler
Sudokoo brought a fascinating new lineup of CPU coolers, AIO CLCs, and fans to the 2026 International CES. We begin our coverage with fans, and the new Sudokoo Astra, a 120 mm fan designed for radiators, with a quick-connect magnetic daisy-chaining mechanism that lets you shed cables for the 2nd and 3rd fans. This 7-pin connector shares both 4-pin PWM and 3-pin ARGB connections to the neighboring fans. The fan features a 3-phase, 6-slot, 4-pole DC motor, with a fluid dynamic bearing, and a liquid crystal polymer impeller. It will come in white and black color variants based on frame color, and various variants based on impeller pattern.
January 6, 2026 — Source

Computer — Processors — January 5th, 2026

AMD launches Ryzen AI 400: 12 Zen5 cores with up to 3.1 GHz RDNA3.5 and 60 TOPS NPU
AMD has announced the Ryzen AI 400 Series at CES 2026, positioning the new chips for laptops and compact desktop systems. The lineup spans 15W to 54W configurable TDP.
January 5, 2026 — Source

AMD launches Ryzen AI MAX+ 392 and MAX+ 388 "Strix Halo" APUs with Radeon 8060S graphics
AMD has expanded its Ryzen AI Max+ "Strix Halo" lineup with two new SKUs: Ryzen AI Max+ 392 and Ryzen AI Max+ 388. Both chips first showed up in leaks and benchmark entries in early November 2025.
January 5, 2026 — Source

AMD Ryzen 7 9850X3D set to launch on January 29, French retailer claims
We received a tip from one of our readers suggesting that AMD will lift the sales embargo for its yet-unannounced CPU later this month. Expectations were that it would launch sooner, but it now looks like we will have to wait until the end of the month. A French retailer suggests it is coming on January 29.
January 5, 2026 — Source

Best Value X3D: AMD Ryzen 5 7500X3D Review
It's time for yet another "new" AMD processor review, and we swear AMD is now binning CPUs faster than Intel can sell them. This time we have the Ryzen 5 7500X3D, a new binned 3D V-Cache chip derived from another binned 3D V-Cache chip, the 7600X3D, which itself is a cut-down version of the 7800X3D.
January 5, 2026 — Source

French Store Lists AMD Ryzen 7 9850X3D SKUs with January 29 Release Date
Late last month, AMD's speculated Ryzen 9 9950X3D2 and Ryzen 7 9850X3D gaming CPUs reportedly moved closer to becoming a reality. A series of late 2025 leaks have pointed to an eventual introduction of expanded Ryzen 9000 series "Zen 5" desktop product range; possibly at this week's CES trade show. The Ryzen 7 9850X3D SKU has broken cover on numerous occasions, even emerging very briefly from an official source last November.
January 5, 2026 — Source

Intel doubles down on gaming with Panther Lake, claims 76% faster gaming performance — new X-series chips can match discrete RTX 4050
A bigger GPU on the first Intel 18A chips.
January 5, 2026 — Source

Intel unleashes Panther Lake CPUs, first built on 18A process
Company claims its Ultra Series 3 processors will offer the best battery life yet
January 5, 2026 — Source

Qualcomm Brings Its Cheaper Snapdragon X2 PC Chips to CES
The Snapdragon X2 Plus offers much of what's in the higher-end X2 Elite, but the Plus versions are destined for more affordable, everyday AI-focused Windows laptops.
January 5, 2026 — Source

Qualcomm Dragonwing To Power Next-Gen Autonomous Warehouses and Smart Kiosks
Today at CES, Qualcomm signaled its dominance in the burgeoning world of Physical AI by unveiling a massive expansion of its industrial and robotics portfolios. This expansion ought to put the company in position to be a comprehensive provider of edge computing technology for everything from tiny smart cameras to full-size humanoid robots.
January 5, 2026 — Source

Qualcomm expands Snapdragon on Windows with X2 Plus -- 10-core ARM CPU boasts 35% single-core jump
A 10-core replacement and a new 6-core variant, both bringing big single-threaded improvements.
January 5, 2026 — Source

Qualcomm introduces Snapdragon X2 Plus chips for cheaper Windows on Arm PCs
Qualcomm introduced its Snapdragon X2 Elite and Elite Extreme processors in September, and the first laptops powered by the next-gen chips are debuting at CES this week, with some set to hit the streets in the coming months.
January 5, 2026 — Source

Qualcomm is determined to cut a slice out of Intel's PC pie with latest Snapdragon chips
Enterprises have been slow to adopt Arm laptops so far
January 5, 2026 — Source

Qualcomm's Next PC Chip Promises Even Better Battery Life Than Before
Rounding out the Snapdragon X2 lineup is a mid-range chip that hopes to outperform Intel and AMD.
January 5, 2026 — Source

Snapdragon X2 Plus is now official: 6 and 10 cores and new Adreno GPU
Qualcomm has revealed the Snapdragon X2 Plus series at CES 2026 as a step below its Snapdragon X2 Elite parts, aimed at thinner Windows laptops that do not need the top-tier SKU.
January 5, 2026 — Source

Startup FuriosaAI moves toward mass production with an AI chip aimed at Nvidia
The Seoul-based startup's NPU promises high performance with lower electricity draw
January 5, 2026 — Source

The chip that actually matters — Snapdragon X2 Plus brings real disruption to the mainstream Windows PC market
After seeing early X2 Plus hardware and live benchmarks in New York, Qualcomm's numbers look real — and the mainstream Windows PC market is about to feel it.
January 5, 2026 — Source

Thermaltake TH-S V3 ARGB Sync AIOs Add CPU Monitoring Display
Thermaltake has introduced the TH-S V3 ARGB Sync series, a new lineup of mid-range all-in-one liquid CPU coolers that combine standard AIO cooling hardware with integrated system monitoring. The series is available in black and white color options and comes in both 240 mm and 360 mm radiator configurations. A key feature of the TH-S V3 ARGB Sync is the segmented LED display built into the pump block. This display shows real-time CPU data, including temperature, average utilization, clock speed, and power draw. The cooler connects to the system via USB, while the displayed metrics are sourced through ACPI. This allows the display to provide useful system feedback without relying on additional sensors or platform-specific components.
January 5, 2026 — Source

Computer — Processors — January 2nd, 2026

AMD CPUs surge to 47% user share as Intel continues to slip in Steam survey
AMD looks set to overtake Intel this year
January 2, 2026 — Source

Chip wars: What to expect from Intel, AMD, Nvidia, and Snapdragon at CES 2026
An early glimpse at the CPUs and GPUs powering the PCs of tomorrow.
January 2, 2026 — Source

Thermaltake Intros TH-S V3 ARGB Sync AIO CPU Coolers
Thermaltake today introduced the TH-S V3 ARGB Sync, a line of mid-range all-in-one, liquid CPU coolers. The cooler comes in black and white color trims, and in radiator size-based variants of 240 mm and 360 mm for each. These coolers are characterized by a simple segment LED display that puts out CPU temperature, usage average, clock speed, and power draw values. It pulls these values by interfacing with software over USB, which in turn gets them from ACPI.
January 2, 2026 — Source

Computer — Processors — January 1st, 2026

AMD's Ryzen 7 9850X3D tipped for modest price hike — early listings point to $500 list for refreshed Zen 5 CPU
Similar price, but what about performance?
January 1, 2026 — Source

Chinese enthusiast overclocks AMD's Ryzen 7 9800X3D to 7.33GHz on Colorful X870E Vulcan motherboard — New world record achieved using liquid nitrogen cooling
Breaking the previous record by just a few megahertz.
January 1, 2026 — Source

Gorgon Point Ryzen AI 5 430 Benchmarked In PassMark For The First Time; 8-9% Faster Vs Predecessor
According to the benchmarks, one shouldn't expect any drastic improvements in the CPU performance vs the predecessor, but the new processor does appear faster.
January 1, 2026 — Source

The Worst CPUs Ever Made
The Worst CPUs Ever Made
January 1, 2026 — Source

Two years after launch Intel Meteor Lake offers 93% of original performance on Linux, tests show
Intel Meteor Lake on Linux: benchmarks show 93% of launch day performance two years later
January 1, 2026 — Source

Computer — Processors — December 26th, 2025

AMD Ryzen 9 9950X3D2 16-core CPU with 192MB L3 cache finally leaks out
The AMD Ryzen 9 9950X3D2, the supposed dual 3D V-Cache CPU, has finally appeared in a leak. Previously, it was only mentioned in a tweet that also revealed the 9850X3D CPU. Now it has been spotted on Geekbench and PassMark pages. AMD has either sent out review samples, or the CPUs are already being tested by board partners.
December 26, 2025 — Source or Source or Source

No Ryzen Killer: Intel Core Ultra 5 225F Review
Testing Intel's $160 Core Ultra CPU, Because Why Not
December 26, 2025 — Source

This tiny chip could change the future of quantum computing
A new microchip-sized device could dramatically accelerate the future of quantum computing. It controls laser frequencies with extreme precision while using far less power than today's bulky systems. Crucially, it's made with standard chip manufacturing, meaning it can be mass-produced instead of custom-built. This opens the door to quantum machines far larger and more powerful than anything possible today.
December 26, 2025 — Source

Computer — Processors — December 25th, 2025

Core Ultra 7 270K Plus Delivers 9.5% Higher Multi-Core Score In PassMark vs2 Ultra 7 265K; Almost On Par With 285K
It's expected that adding more cores to the chip will increase the multi-threaded performance of the CPU, and this is what you should expect when going from the Core Ultra 7 265K to Ultra 7 270K Plus. We have posted a few leaks on the processor, but it's probably the first time it appeared on PassMark. Unlike Geekbench, PassMark is much more reliable in showing true performance capabilities, and here we see the 270K Plus going head-to-head with the bigger chip.
December 25, 2025 — Source

Intel Core Ultra 200K Plus series reportedly aiming at "more for the same price" approach
Board Channel sources claim Intel will leverage a more mature manufacturing process for its upcoming Core Ultra 200K Plus series to improve yields and fix potential driver or firmware issues seen in earlier versions. Allegedly, the goal is to fully unleash Arrow Lake's design performance. Intel is also said to be aiming for "more for the same price" to improve value and defend its position against rivals.
December 25, 2025 — Source

Intel's Granite Rapids Xeon CPUs spotted with up to 86 cores, 336MB cache, and $9,300 pricing
Intel's Granite Rapids Xeon CPUs spotted with up to 86 cores, 336MB cache, and $9,300 pricing
December 25, 2025 — Source

Computer — Processors — December 21st, 2025

Intel Core Ultra 5 335 And 325 Spotted On Geekbench; 8-Core Budget Panther Lake CPUs With Up To 4.6 GHz
Two new Panther Lake CPUs have surfaced online, but we can't yet compare them with their predecessors due to the nature of the tests.
December 21, 2025 — Source

Intel's Arrow Lake "Refresh" CPU Lineup
Here's Everything We Know About Team Blue's Next Desktop CPUs
December 21, 2025 — Source

Computer — Processors — December 20th, 2025

World's First Commercial High-NA EUV Tool
Intel has installed the world's first commercial High-NA EUV lithography machine, ASML's TWINSCAN EXE:5200B, marking a major milestone for advanced chip manufacturing. The system will be used to develop Intel's upcoming 14A process node, which is expected to enter volume production in 2027.
December 20, 2025 — Source

Computer — Processors — December 19th, 2025

AMD Reveals New Zen 6 Details In First Official Document
This past Wednesday, AMD quietly published what appears to be the first official technical documentation for its upcoming Zen 6 CPU architecture, codenamed Morpheus. This document offers early insight into several notable architectural changes. While the company has not formally announced Zen 6 products yet, the document provides strong hints about where AMD's next-generation cores are headed.
December 19, 2025 — Source

AMD Ryzen AI 7 445 Samples Get Geekbenched, Feature 2x "Zen 5" & 4x "Zen 5c" Cores
A fairly unique "Gorgon Point" mobile processor has turned up multiple times within the Geekbench Browser database. Instead of discovering the usual Geekbench 6.x-based entries, Olrak29 put a spotlight on scores and diagnostic data produced by Geekbench AI 1.5 benchmark sessions. Six Fujitsu Client Computing test systems posted results on December 9, all featuring an unreleased Ryzen AI 7 445 APU. So far, leaks of slightly refreshed "Strix Point" and "Krackan Point" designs have been compared to direct predecessors, but the leaked Ryzen AI 7 445 SKU seems to be an outlier—in terms of nomenclature and core configuration.
December 19, 2025 — Source

AMD Zen6 support has been added to GCC 16, preparing for next-gen EPYC and Ryzen CPUs
AMD has started enabling Zen 6 in GCC, a compiler used by many Linux developers. It means software can be built with Zen 6 in mind before the CPUs are on shelves.
December 19, 2025 — Source

How to choose a CPU -- A guide to picking the right processor for your PC
Everything you need to know when shopping for a processor
December 19, 2025 — Source

Intel Core Ultra 400K "Nova Lake-S" CPUs with Big Cache (bLLC) to have four configurations up to 52 cores
Latest Nova Lake-S rumors: up to 52 cores and 288MB bLLC cache on Core Ultra 400 K chips
December 19, 2025 — Source

Thermal Grizzly Introduces New DeltaMate Matt Nickel-Plated Fittings
With the matt nickel-plated fittings, Thermal Grizzly expands its product range and offers more options for building a custom water-cooling system. In addition to the new color variant, two new fittings are now available, each with two G1/4-inch female threads. The DeltaMate Rotary - FF90° and the DeltaMate Extender - FF14 are primarily intended for combining two fittings. For example, two short hard tubes can be combined into one long hard tube using two DeltaMate Fittings - HT16 and a DeltaMate Extender - FF14, or routed at a 90-degree angle using the DeltaMate Rotary - FF90° and two HT16 fittings, without the need to bend the tubes themselves.
December 19, 2025 — Source

Computer — Processors — December 15th, 2025

AMD and Samsung Said to Discuss 2 nm Foundry Deal for Future EPYC CPUs
According to a report from Sedaily, cited by TrendForce, Samsung Electronics' Device Solutions (DS) Division is in discussions with AMD over manufacturing its chips on Samsung Foundry's second-generation 2 nm process known as SF2P. Samsung's 2 nm technology is competing directly with TSMC's N2 and Intel's 18A, both using the Gate-All-Around (GAA) transistor architectures. Industry sources say a decision on moving forward with a formal agreement could come as early as January next year, with actual production being more a matter of "when" rather than "if".
December 15, 2025 — Source

First Truly 3D Chip Made in U.S.
A team of U.S. researchers has built the first monolithic 3D computer chip manufactured in a commercial American foundry, a breakthrough that could significantly boost AI performance while cutting energy use.
December 15, 2025 — Source

Google's TPUs Are Commanding the ASIC Market Right Now, as the Firm "Doubles" Next-Gen TPU v7e Orders at MediaTek Amid Gigantic Demand
Google TPUs are pushing themselves to be the dominant ASIC on the market, which is one of the reasons why both MediaTek and Broadcom are seeing massive orders.
December 15, 2025 — Source

India Launches DHRUV64, Its First 1 GHz, 64-bit Dual-Core RISC-V CPU
India has achieved a significant milestone in its semiconductor journey with the launch of DHRUV64. It is a fully indigenous microprocessor developed by the Centre for Development of Advanced Computing (C-DAC) under the Microprocessor Development Program (MDP). DHRUV64 provides the nation a reliable, homegrown processor technology. It is capable of supporting strategic and commercial applications. It marks a major advancement in India's pursuit of self-reliance in advanced chip design.
December 15, 2025 — Source

Computer — Processors — December 12th, 2025

Intel Core Ultra 7 270K Plus and Core Ultra 9 290K Plus spotted at Indian retailer — listings appear to corroborate prior leaks but don't reveal pricing or new info for upcoming Arrow Lake refresh
First retail appearance of the Arrow Lake refresh.
December 12, 2025 — Source

Intel's AI Strategy Will Favor a "Broadcom-Like" ASIC Model Over the Training Hype, Offering Customers Foundry & Packaging Services
Intel's AI plans have been under uncertainity for several quarters now, but it appears that the firm is expected to target two main segments: ASICs and edge AI.
December 12, 2025 — Source

Computer — Processors — December 11th, 2025

AMD Ryzen 9 9950X3D2 & Ryzen 7 9850X3D CPUs
Here's Everything We Know About The 'Soft Refresh' of Zen 5 3D V-Cache Series
December 11, 2025 — Source

Another "Xeon 696X" Sample Gets Benched, PassMark Incorrectly Identifies 32-core Config
Late last month, an unreleased "Xeon 696X" processor was spotted in the SiSoftware Official Benchmark Ranker database. A recent uptick in "Granite Rapids-WS" leaks—including a long SKU stack—hints at an imminent launch. The latest leak, found within the PassMark CPU benchmark archive, seemingly reaffirms the Xeon 696X model's existence. Unfortunately, today's diagnostic points to a lower than anticipated core count: 32 instead 64.
December 11, 2025 — Source

Intel Core Ultra X9 Panther Lake Outguns AMD's Strix Halo In New Leak
It's really important to keep things in context when you're looking at hardware benchmarks. Desktop CPUs often operate with essentially unlimited power and thermal budgets, so it's simply not fair to compare them against laptop chips that must constantly keep power draw in check to deal with thermal constraints and to avoid draining batteries too quickly.
December 11, 2025 — Source

StorageReview Sets New Pi Record: 314 Trillion Digits on a Dell PowerEdge R7725
The action then shifted into the lab. In early 2024, we upgraded our record to 105 trillion digits on a system supported by nearly a petabyte of Solidigm QLC SSDs. This achievement set a new benchmark for scale and demonstrated how efficiently a single on-premises machine could operate. A few months later, we did it again, this time reaching 202 trillion digits. This validated that high-density flash and careful tuning could outperform hyperscale infrastructure for this specific, demanding workload.
December 11, 2025 — Source

Transistor 'design limitation' actually improves performance, scientists find
What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, according to new research from the University of Surrey and Joanneum Research Materials.
December 11, 2025 — Source

Computer — Processors — December 5th, 2025

Alphabet Emerges as Nvidia's Biggest Threat in a $900B AI-Chip Race
Alphabet's TPUs are gaining investor hype as analysts say the company could capture a share of the $900 billion AI-chip market.
December 5, 2025 — Source

Amazon launches Trainium3 AI accelerator, competing directly against Blackwell Ultra in FP8 performance — new Trn3 Gen2 UltraServer takes vertical scaling notes from Nvidia's playbook
Amazon's Trn3 Gen2 UltraServer beats Nvidia's GB300 NVL72 in FP8.
December 5, 2025 — Source

ARM To Establish A Semiconductor Design School In South Korea To Train 1,400 "World-Class" Chip Design Professionals
ARM, a prolific designer of CPU cores and owned by Japan's SoftBank, is embarking on a major skill-building initiative in South Korea, one that would bolster the chip design expertise of the Asian powerhouse via a dedicated school that would train 1,400 individuals by 2030.
December 5, 2025 — Source

Analysts Heap Praise on Intel's 14A Node, But 18A Has Yet to Impress
Intel's future may be bright, but in the here and now, it needs customers for its latest nodes.
December 5, 2025 — Source

Exynos 2600 Has Yet To Enter Mass Production, With Latest Report Downplaying Previous Updates Regarding Samsung's First 2nm GAA Chipset's Progress
Samsung was previously reported to have a head start in mass producing its first 2nm GAA chipset, the Exynos 2600, back in late September, where the company's yields were estimated at 50 percent. Given that the Korean giant recently unveiled its upcoming SoC by showcasing its first trailer, it was immediately assumed that the full-scale manufacturing was already underway. Unfortunately, that doesn't appear to be the case, with an update mentioning that the Exynos 2600 is expected to enter the production block soon.
December 5, 2025 — Source

Intel admits it needs more Core Ultra 200-series wafers — 'If we had more Lunar Lake wafers, we would be selling more Lunar Lake'
Intel this week reiterated that it cannot meet demand for all of its client and data center processors due to insufficient supply, and specifically mentioned that it could use more Core Ultra 200-series Arrow Lake and Lunar Lake wafers to increase shipments of appropriate processors. Logic tiles of both CPUs are made by TSMC, whereas packaging is performed by Intel in-house, so when placing orders with the foundry, Intel was more conservative than it should have been.
December 5, 2025 — Source

Intel Claims "Lunar Lake" and "Arrow Lake" Demand Outpaces Wafer Supply
Intel was presenting at 2025 UBS Global Technology and AI Conference, revealing interesting details about the demand for its "Lunar Lake" and "Arrow Lake" processors. On the question from one of the analysts that some assume Intel isn't selling its new products and there is no demand, Intel's John Pitzer answered "Quite frankly, if we had more Granite wafers, we'd be selling more Granite. If we had more Lunar Lake wafers, we'd be selling more Lunar Lake. If we had more Arrow Lake wafers, we'd be selling more Arrow Lake. And so I think we feel pretty good about where we are in the AI PC transition.
December 5, 2025 — Source

Intel's Panther Lake & Nova Lake CPUs Are Expected To Bring the Company 'Back in the Game' as Team Blue Shows Renewed Confidence in Its PC Roadmap
Intel's VP, John Pitzer, provided us with a rundown of what to expect from the firm on the consumer side moving into next year, with the 'spotlight' products being Panther Lake and Nova Lake SKUs.
December 5, 2025 — Source

Computer — Processors — December 3rd, 2025

AMD EPYC "9006" Embedded Venice CPUs Rock Up To 96 "Zen 6" Cores & PCIe Gen6, EPYC Embedded 2005 "Fire Range" & Annapurna Families Confirmed Too
AMD is preparing a range of EPYC Embedded family, such as Venice "Zen 6" series, Fire Range "Zen 5" series & Annapurna lineups.
December 3, 2025 — Source or Source or Source

Building a budget gaming PC? Why Intel CPUs are the best value right now
Thanks to a few different factors, Intel CPUs offer incredible value in 2025—if you know what to look for.
December 3, 2025 — Source

Check out Intel's official overclocking lab
Adam got a chance to talk with Dan Ragland, Intel's big cheese when it comes to overclocking CPUs and other components to make them even better.
December 3, 2025 — Source

Computer — Processors — November 30th, 2025

AMD Lists Ryzen 7 9850X3D CPU with 5.6 GHz Boost Frequency
AMD has launched an official website placeholder for the Ryzen 7 9850X3D processor, which was leaked in October. As a part of the "Granite Ridge" Ryzen 9000 X3D series, AMD is reportedly developing two additional updates to the lineup. One is a flagship model, the Ryzen 9 9950X3D2, and the other is a refined eight-core, 16-thread X3D design. Today, AMD's website confirms the Ryzen 7 9850X3D, featuring 8 cores and 16 threads, 96 MB of L3 cache, and a boost clock up to 5.6 GHz, with a 120 W power envelope.
November 30, 2025 — Source or Source

Intel Core Ultra 9 285K gains 9% performance and cuts power use on Linux one year later
Phoronix has revisited Intel's Core Ultra 9 285K "Arrow Lake" desktop CPU on Linux, one year after launch. In more than 240 tests, the chip now delivers about 9% higher performance compared to October 2024, while average CPU power usage fell from 136W to 116W, roughly 85% of the original level.
November 30, 2025 — Source

Intel moves closer to building Apple's entry-level M-series chips on 18A from 2027 — insider claims chipmaking deal could be close at hand
Apple has taken Intel's 18AP PDK and is preparing for a potential second-source shift.
November 30, 2025 — Source

Computer — Processors — November 29th, 2025

Intel Could Power Google's Next AI Chips
Intel is quietly becoming a key player in the AI race again, not with GPUs, but with packaging technology that could sit at the heart of Google's future AI chips.
November 29, 2025 — Source

Computer — Processors — November 26th, 2025

AEWIN Introduces BIS-5132 Series 2U High-Performance General-Purpose Servers Powered by Intel Xeon 6 Processors
AEWIN unveils the BIS-5132-2U, a versatile 2U general-purpose server powered by Intel's latest Xeon 6 processors built on Intel 3 process technology. Featuring a single Intel Xeon 6700/6500-series CPU, the BIS-5132 delivers exceptional compute density with up to 86 P-cores or 144 E-cores for demanding workloads. Designed for scalability, the platform accommodates 12 large form factor (3.5") drive bays and up to 8 PCIe expansion slots address a wide range of deployment scenarios.
November 23, 2025 — Source

AIO liquid cooler pioneer Asetek receives buyout offer
Asetek, the company best known for pioneering the All-In-One liquid cooler for PCs, may soon have new ownership. The company has issued an update to shareholders that it has received a buyout offer, and the board of directors intends to recommend the sale.
November 23, 2025 — Source

Google TPUs garner attention as AI chip alternative, but are only a minor threat to Nvidia's dominance — Alphabet's biggest challenge is widespread adoption
Meta's reported deal with Google shows a growing interest in alternative AI hardware, but Nvidia says its platform remains unmatched.
November 23, 2025 — Source

Intel Core Ultra 400K Nova Lake-S To Challenge X3D With Massive 144MB Cache
Those up-to-date with the best gaming CPUs know that AMD has stolen the crown from Intel with Ryzen X3D chips wielding massively increasing cache allotments. However, Intel's upcoming Nova Lake-S CPUs are rumored to have a massive cache configurations of their own. According to leakers on Twitter, unlocked Intel Nova Lake-S CPUs will feature bLLC (Big/Base Last Level Cache) with a cache size of 144MB, which dwarfs the 96MB cache size of even AMD's Ryzen 9 9800X3D.
November 23, 2025 — Source

Intel's Core Ultra 9 386H CPU may have leaked
Intel has not yet officially announced its next generation Core Ultra 300 series processors, but a recent benchmark database entry may have given us our first look at the performance for the high-end Core Ultra 9 386H CPU.
November 23, 2025 — Source

Intel's next-gen Nova Lake will finally tackle AMD's Ryzen X3D, but only with pricey 'K' models — 144MB Big Last Level Cache response to 3D V-Cache will only come on unlocked desktop parts
The bLLC is allegedly part of the compute tile.
November 23, 2025 — Source

Japan's Rapidus To Begin Construction Of Its 1.4nm Facility In 2027, With A Report Stating That Plans To Manufacturer 1nm Wafers Are Also In The Pipeline
TSMC's push towards breaking the 2nm ceiling and jumping towards 1.4nm wafer production is scheduled to happen during the second half of 2028, with the Taiwanese semiconductor titan reportedly forking an initial investment of $49 billion that will go towards the construction of four plants. In close pursuit is Japan's Rapidus, which reportedly aims to begin work on a facility for manufacturing wafers on the exact same lithography in 2027. However, there are also plans to research and develop 1nm chips at the same site, but that will happen at a later time.
November 23, 2025 — Source

Noctua's LGA1851 & LGA1700-compatible Coolers Ready to Support "Nova Lake" Socket
Throughout the 2020s, a segment of Intel Core CPU enthusiasts have fretted over socket format changes. Implementing next-gen upgrades can result in the discarding of incompatible cooling solutions—all the more painful when it involves parting ways with a pricey Noctua product. Loyal customers will be relieved to find out that the Austrian PC hardware manufacturer has quietly declared that many of its existing tower air coolers are ready to mesh with Intel's upcoming LGA1954 socket. Team Blue's "Nova Lake-S" desktop processor family is still some distance away; a late 2026 launch is planned.
November 23, 2025 — Source or Source

Nova Lake-S CPUs may hold Intel's answer to AMD's 3D V-Cache
AMD has dominated CPU gaming performance benchmarks in recent years with its 3D V-Cache equipped models. We've been waiting for Intel's answer to this technology for quite some time and according to new reports, we will see it first in the next-generation Nova Lake-S desktop CPUs.
November 23, 2025 — Source

Computer — Processors — November 23rd, 2025

Intel Johnson City Platform Supports 650W Next-Gen Diamond Rapids "Xeon" CPUs
Intel's next-generation Xeon family, codenamed "Diamond Rapids", will be supported on the Johnson City reference platform.
November 23, 2025 — Source

Intel Nova Lake may use mix of Xe3 and Xe3P GPU cores
The integrated GPU architecture for Intel's upcoming Nova Lake processors has been subject to conflicting leaks. While initial Linux kernel patches suggested the CPUs would feature Xe3P graphics, an architecture also used by the Crescent Island datacenter GPU, a new report claims otherwise.
November 23, 2025 — Source

Intel W890 Platform Details Leak: Granite Rapids Workstation CPUs With Up To 350W TDP, Up To 2 TB Quad-Channel DDR5 RDIMM Memory, 112 PCIe Lanes
Full details of Intel's W890 platform, designed for the upcoming Granite Rapids Workstation CPUs, have leaked out.
November 23, 2025 — Source

Supersized chip family gathers for the 54th anniversary of the Intel 4004 CPU — 4001 ROM, 4002 RAM, and 4003 shift registers feature in a reconstructed Busicom calculator build
Modern technology means the 130x scale discrete transistor 4004 CPU runs at twice the speed of the real thing.
November 23, 2025 — Source

Computer — Processors — November 22nd, 2025

5 Popular CPUs That Became Outdated In 2025
While it would be nice to have a computer that would last forever, the unfortunate truth is that everything becomes old and outdated. This is particularly true with CPUs, especially as technological advancements mean that once powerful processors lose support and updates from their manufacturer and major software providers.
November 22, 2025 — Source

HP OmniBook 5 14 Review: You Won't Believe How Long This Snapdragon X Laptop Runs
Record-setting battery life is only part of its charm. It also has a pleasing design, OLED display and ample RAM and storage -- all at an affordable price.
November 22, 2025 — Source

Intel Arc B390 "Panther Lake" iGPU shows promising results in alleged 3DMark tests
First, let's recap what Intel has already said about Xe3 performance. Officially not much, but we did learn that Xe3 should be above 50% faster than Lunar Lake (using Xe2) and at least 40% more power efficient than Arrow Lake-H (Xe with XMX). Anything above those numbers would be even better to hear, but we are used to seeing official slides usually exceeding expectations.
November 22, 2025 — Source

Intel Arc B390 Reportedly Delivers 7,000 Points In Time Spy Graphics, Crushing Radeon 890M And Arc 140T With Ease
More benchmarks are surfacing online, revealing a big jump in performance by Xe3-based iGPUs on Panther Lake CPUs.
November 22, 2025 — Source

Intel deepens commitment to 14A node, develops custom Xeon CPU for Nvidia
Intel accelerates next-gen node development despite industry competition
November 22, 2025 — Source

Intel Panther Lake-H Benchmarks And Engineering Sample Sneak Peek
Benchmarks of an Intel Panther Lake-H engineering sample have leaked on X/Twitter, and the results have spurred some interesting debate. Before proceeding, though, it's important to clarify the nature of engineering sample hardware and how it usually does not reflect the performance of final hardware. This is especially apparent with the ES board being benchmarked and leaked here, which features relatively slow RAM versus what we've been told to expect from this launch. The slower RAM will not only impact some CPU scores, but massively impact iGPU performance, since they are heavily reliant on memory bandwidth and capacity to achieve the best performance.
November 22, 2025 — Source

Intel Core Ultra 300 "Panther Lake" engineering samples tested and listed for sale
Some people have access to unreleased hardware, and they are either testing it or offering it for sale.
November 22, 2025 — Source

Intel's "Panther Lake-H" Engineering Samples Surface in Early Testing
Newly surfaced images have revealed pre-release validation hardware for Intel's upcoming "Panther Lake-H" mobile processor line, giving us some of the first concrete looks at the company's newest CPU. The photographs show a development system running on Intel's internal reference board, featuring a ten-core processor sample from what we assume is the Core Ultra 3 family paired with 16 GB of LPDDR5X memory. These qualification units, marked as early A0-stepping silicon, confirm Intel continues to target a public launch around CES 2026 and Q1 2026 release, while offering rare insight into how the chipmaker refines its architectures before production begins.
November 22, 2025 — Source

Intel's upcoming Panther Lake CPUs tested ahead of launch — alleged Core Ultra 3 SKU with 10 cores and 16GB RAM surfaces in leaks
Panther Lake tested, barely.
November 22, 2025 — Source

Computer — Processors — November 21st, 2025

China's Desktop EUV Breakthrough And Ultra-Fast Photonic Chip
China is attacking the semiconductor race on two fronts at once: by shrinking today's chipmaking tools and leapfrogging tomorrow's chip designs.
November 21, 2025 — Source

Intel confirms Core Ultra Series 3 "Panther Lake" CPUs will debut at CES on January 5th
"Arrow Lake performance with Lunar Lake efficiency"
November 21, 2025 — Source

Computer — Processors — November 20th, 2025

6 reasons to choose a Snapdragon CPU in your next PC
The benefits of Qualcomm's CPUs!
November 20, 2025 — Source

AMD Ryzen AI 7 450, Ryzen AI 9 465 leak confirm Gorgon Point as Strix/Krackan refresh
AMD Ryzen 400 Series starts to appear on Bapco benchmark page
November 20, 2025 — Source

Gorgon Point Ryzen AI 9 465 And Ryzen AI 7 450 Specs Leaked In CrossMark
Now we have two more SKUs in the upcoming AMD Gorgon Point leaked on a CPU benchmarking platform, confirming the naming convention and some specifications.
November 20, 2025 — Source

Intel Core Ultra 300 "Panther Lake" officially launches at CES 2026 on January 5th
Panther Lake is the third generation of Intel's Core Ultra family and the first client SoC built on the Intel 18A process, using a multi tile design that combines new CPU cores, updated integrated graphics and an AI accelerator in one package. Intel positions Core Ultra Series 3 as a single platform for consumer and commercial AI PCs, gaming devices and edge deployments, with retail availability set for January 2026.
November 20, 2025 — Source

Intel's First 18A-Based Product, the Panther Lake CPU Lineup, Set To Officially Debut on January 5th at Team Blue's CES 2026 Event
Intel has formally announced the unveiling of the Panther Lake CPU lineup, which is now scheduled for the first week of January, coinciding with the CES 2026 show floor.
November 20, 2025 — Source

Microsoft unveils Azure Cobalt 200 CPU, in-house chip targets higher performance and deeper integration — Arm-based chip is equipped with 132 cores and manufactured using TSMC's 3nm process
New in-house processor targets higher performance, lower power, and deeper integration across Azure's cloud stack.
November 20, 2025 — Source

Computer — Processors — November 14th, 2025

After six years of promises and no shipping silicon, Tachyum revises Prodigy processor specs to 1,024 cores with 1,600W of power consumption — likely another 5-year delay, company claims its chip is 20 times faster than Nvidia's Rubin NVL576 rack
Final specifications after six years of waiting may set the stage for another major delay
November 14, 2025 — Source

AMD Desktop CPU Share Growth Challenges Intel's Dominance
Intel remains the dominant player in the x86 space when it comes to market share, both overall and in individual segments such as desktop, server, and mobile. However, AMD continues to chip away at its rival's big lead, as we had been seeing. According to the latest data by Mercury Research, AMD now accounts for almost a third of all x86 CPUs, with its share increasing 5.9% year-over-year and 1.5% sequentially to 30.9%.
November 14, 2025 — Source

AMD continues to chip away at Intel's X86 market share — company now sells over 25% of all x86 chips and powers 33% of all desktop systems
Slowly but surely, AMD is eating Intel's lunch.
November 14, 2025 — Source

Intel Core Ultra X7 358H Comes Out Noticeably Slower Than Ultra 7 265H On PassMark
Once again, the Core Ultra X7 358H was benchmarked, but this time we have a much more reliable benchmark platform than Geekbench.
November 14, 2025 — Source

Computer — Processors — November 13th, 2025

AMD makes 3D V-Cache more accessible with £240 Ryzen 5 7500X3D
The AMD Ryzen 5 7500X3D is no longer just a rumour. AMD has officially announced its new "budget-focused" gaming CPU, aiming to bring 3D V-Cache to a wider market with a launch price of £239.99. This chip packs the same 64MB slice of L3 cache as its more expensive siblings.
November 13, 2025 — Source

AMD Zen 6 "EPYC Venice" CPUs Offer Over 70% Performance & Efficiency Improvement, 30% In Thread Density
AMD Promises Big Gains With Next-Gen Zen 6 CPUs: Over 70% Performance & Efficiency Uplift With EPYC Venice Lineup
November 13, 2025 — Source

Intel Confirms AVX10 Support For Nova Lake, Including Both Desktop And Mobile Lineups
Intel has just published a new ISA reference manual where it has explicitly confirmed that the upcoming Nova Lake will support both AVX10.2 and APX extensions. As spotted in the documents, both AVX10.1 and AVX10.2 variants are included alongside the Advanced Performance Extensions in the reference doc. This is a significant update in Intel's CPU feature roadmap as Intel's specification describes AVX10 as a "converged vector ISA" that aims to unify 128, 256, and 512-bit vector lengths under a single framework.
November 13, 2025 — Source or Source

Computer — Processors — November 8th, 2025

AMD Zen 6 CPU Core ISA Revealed: AVX512 FP16, VNNI INT8 & More
AMD's next-gen Zen 6 CPU ISA has been revealed in the latest support added to the GCC compiler, alongside the initial family.
November 8, 2025 — Source

AMD Ryzen 7 9700X3D Appears in Leaked PassMark Benchmark
A new leaked PassMark benchmark has revealed what appears to be AMD's next 3D V-Cache processor, the Ryzen 7 9700X3D, a new CPU to refresh the company's mid-range gaming lineup. The listing shows it is an eight-core, 16-thread Zen 5 CPU with 96 MB of L3 cache and a boost clock of up to 5.8 GHz, however, that figure is likely from early testing or overclocked conditions. The 9700X3D scored 4,687 points in single-threaded and 40,438 points in multithreaded benchmarks.
November 8, 2025 — Source

CPU collector peels the lid off a Soviet-era 'fish can' chip to peer inside with multiple microscopes — K565RU3 was a Cold War-era clone of Western chips that powered Apple II, Commodore PET, and original IBM PC
The K565RU3 is a 16KB DRAM IC that was cloned from Western chips found in classic machines like the Apple II, Commodore PET, and original IBM PC.
November 8, 2025 — Source

Computer — Processors — November 7th, 2025

3D chip encrypts image data as soon as it is captured
A stacked chip captures, encrypts, and searches image data directly on hardware, combining photodetection, memory, and key generation for secure real-time processing in connected devices.
November 7, 2025 — Source

AMD Ryzen X3D CPUs Outsell Intel's Entire CPU Lineup on Amazon in October
Amazon US sales data for October, courtesy of @TechEpiphanyYT, reveal a huge disparity between AMD and Intel CPU sales. The combined shipments of AMD's Ryzen 9800X3D and 7800X3D reached roughly 16,000 units, while Intel's entire CPU lineup on the platform did not surpass 10,000 units. This gives AMD about 83.80% of the market share in terms of units sold, meaning that for every ten CPUs sold, more than eight were AMD models. The two X3D models sold roughly 8,000 units each, indicating a strong demand for AMD's high-end gaming processors, even at premium prices.
November 7, 2025 — Source

Google Unveils Ironwood, Its 'Most Powerful' and 'Energy-Efficient' AI Chip to Date
Google unveils Ironwood, its most powerful TPU, for the age of inference, and Axion Arm VMs promising up to 2× better price-performance for AI workloads.
November 7, 2025 — Source

Substrate's claims about revolutionary ASML-beating chipmaking technology scrutinized, analyst likens the venture to a fraud — report pokes holes in the startup's technology, messaging, and leaders
Does anyone else smell vaporware?
November 7, 2025 — Source

Computer — Processors — November 6th, 2025

AMD's budget Ryzen 5 7500X3D leaks out in early benchmarks, scores hint at performance on par with existing 7600X3D — budget offering could pack a punch in both single and multi-core tests
The cheapest X3D chip on the AM5 platform.
November 6, 2025 — Source

Google deploys new Axion CPUs and seventh-gen Ironwood TPU — training and inferencing pods beat Nvidia GB300 and shape 'AI Hypercomputer' model
Chips complete Google's portfolio of custom silicon.
November 6, 2025 — Source

Ryzen AI Max+ 388 and 392 may feature full 40-CU Strix Halo integrated GPU
A new AMD APU has been spotted in the PassMark database, the Ryzen AI Max+ 388. Moreover, mentions of a Ryzen AI Max+ 392 have also been brought up. These SKUs are pretty interesting, as they appear to fill a gap in the "Strix Halo" lineup, offering 40-CU integrated graphics in lower CPU core count configurations.
November 6, 2025 — Source

Samsung and ASUS Geekbench scores reveal Intel's Panther Lake CPUs | Early benchmarks hint at a generational leap in laptop performance
Leaked Geekbench scores from Samsung and ASUS laptops reveal Intel's Panther Lake CPUs could deliver up to 70% faster integrated graphics performance.
November 6, 2025 — Source

Texas Instruments Opens Its Second Assembly and Test Factory in Melaka, Malaysia
Texas Instruments (TI), a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips, today announced the opening of its newest state-of-the-art assembly and test factory in Melaka, Malaysia, TIEM2. This new factory features advanced factory automation to bump, probe, assemble and test billions of analog and embedded chips annually that are vital for nearly every type of electronic system - from vehicles to smartphones to data centers.
November 6, 2025 — Source

Computer — Processors — November 5th, 2025

AMD prepares Ryzen 7 9700X3D as budget-friendly 3D V-Cache CPU, AI Max+ 388 also appears on PassMark
No word yet on pricing or launch date
November 5, 2025 — Source

AMD reportedly prepping new X3D chip with higher clock speeds -- Ryzen 7 9700X3D spotted in benchmarks that rival Ryzen 7 9800X3D, new Strix Halo chip also unearthed
New X3D chip surfaces in fresh benchmark leak
November 5, 2025 — Source

AMD's New CPUs Might Just Kill Low-End GPUs Soon
AMD's New CPUs Might Just Kill Low-End GPUs Soon
November 5, 2025 — Source

Best CPU Deals for November 2025
Setting up a new machine for work or play? We've found deep discounts on top-performing processors from Intel and AMD this month.
November 5, 2025 — Source

Intel Panther Lake "Core Ultra Series 3" CPU Final Clocks & SKUs Leaked: Maxes Out at 5.1 GHz on Top SKU
The final clock speeds of Intel's entire Panther Lake "Core Ultra Series 3" CPUs have been leaked, pointing at up to 5.1 GHz frequencies.
November 5, 2025 — Source

Intel "Panther Lake" Frequencies Leak, 16-Core SKU Hits 5.1 GHz
Early last month, Intel introduced its "Panther Lake" series of mobile processors, featuring up to 16 CPU cores distributed across four P-Cores, eight E-Cores, and an additional four-core LPE cluster. Thanks to reliable Intel leaker @jaykihn0, we have details on the clock speeds of these mobile CPUs. The top-tier Core Ultra X9 388H processor is expected to have a CPU turbo boost of up to 5.1 GHz. This is impressive given that these SoCs include 16 CPU cores and 12 Xe3 GPU cores, whose frequency remains undisclosed. The top SKUs can be pushed up to 65 W or up 80 W TDP, depending on OEM's desire.
November 5, 2025 — Source

Computer — Processors — October 31st, 2025

Samsung Galaxy Book6 Pro With Intel Core Ultra Series 3 "Panther Lake" CPU Leaks Out
Samsung Preps Next-Gen Galaxy Book6 Pro Laptops With Intel's Core Ultra Series 3 "Panther Lake" CPUs
October 31, 2025 — Source

Computer — Processors — October 30th, 2025

Alleged Intel Core Ultra X7 358H & Ultra 5 338H "Panther Lake" Leak Points To Similar Multi-Thread Performance As Arrow Lake-H CPUs
Intel Panther Lake Might Offer Similar Performance As Arrow Lake In Multi-Threaded Tests If These "Alleged" ES Tests For Core Ultra X7 358H & Ultra 5 338H Are To Be Believed
October 30, 2025 — Source or Source

AMD confirms Zen6 Ryzen "Medusa" CPUs during OCP Global Summit
AMD engineers have officially confirmed the long-rumored codenames Medusa and Venice for upcoming Zen 6 processors during their session at the OCP Global Summit 2025. The confirmation appeared on an openSIL roadmap slide presented by Raj Kapoor, AMD Fellow and Chief Firmware Architect, and Srini Narayana, AMI Vice President of Boot Firmware.
October 30, 2025 — Source

AMD kills Windows 10 support in its latest Adrenalin update — Battlefield 6 picks up bug fixes and optimizations
Also on the killing floor are new game and Vulkan extension support for RDNA 1 and RDNA 2 GPUs.
October 30, 2025 — Source

AMD openSIL Targets "Zen 6" Support in the First Half of 2027
AMD used the Open Compute Project Global Summit in San Jose to provide an update on openSIL, its initiative to replace the legacy AGESA firmware with an open silicon-initialization stack, with timelines for CPUs based on the "Zen 6" IP. Chief Firmware Architect Raj Kapoor presented the latest developments and confirmed that slides and a video of the talk are now available to the public.
October 30, 2025 — Source

Computer — Processors — October 26th, 2025

AMD Expected To Launch New Zen 5 Ryzen 3D V-Cache CPUs As Well As APUs At CES 2026
The recently leaked new SKUs in the Ryzen 9000 lineup are expected to launch at CES 2026, which will include both X3D and Zen 5 APUs.
October 26, 2025 — Source

AMD Ryzen 5 7500X3D Reportedly In The Making; Another Budget 6-Core Zen 4 X3D Chip
Looks like AMD won't discontinue the Zen 4 lineup any time soon and is keen to bring more X3D chips for the budget segment.
October 26, 2025 — Source

AMD set to launch Ryzen 5 7500X3D, another 6-core Zen4 CPU with 3D V-Cache
AMD clearly sees the advantage of X3D technology, and so do gamers. The company is reportedly preparing two high-end Ryzen 9000X3D CPUs with either 16 or 8 cores, higher clocks, and possibly dual 3D V-Cache variants. That is as far as current rumors go.
October 26, 2025 — Source

AMD X3D Turbo versus Intel 200S Boost One-Click Overclocking
Is It Any Good on the Ryzen 9800X3D and Core Ultra 9 285K?
October 26, 2025 — Source or Source

Gaming-optimized Ryzen 5 7500X3D spotted at UK retailer, new six-core budget CPU apparently readied for launch — AMD might be prepping the cheapest Zen 4-based 3D V-Cache chip to date
You get 3D V-Cache, you get 3D V-Cache, and you get 3D V-Cache!
October 26, 2025 — Source

Computer — Processors — October 24th, 2025

Intel Core Ultra 5 338H appears in Geekbench listing, confirming new "Arc B370" Xe3 iGPU — No "X" branding in sight as Panther Lake's naming scheme becomes clear
Decent graphics performance, depsite the lack of "X" branding.
October 24, 2025 — Source

Intel's pivotal 18A process is making steady progress, but still lags behind — yields only set to reach industry standard levels in 2027
Intel's management revealed during the company's Q3 2025 earnings call that while its 18A fabrication process is progressing predictably, with usable yields, enabling the company to begin ramping production of the Core Ultra 300-series processors, codenamed Panther Lake. However, the ramp-up of 18A processors will be slow due to relatively low yields, and Intel will not expand available 18A capacity at a rapid pace. Currently, 18A's yields are not yet comfortable from a commercial point of view.
October 24, 2025 — Source

Virtualized Windows 11 test shows Apple's M5 destroying Intel and AMD's best in single-core benchmark — Chinese enthusiast pits Ryzen 9 9950X3D and Core i9 14900KS against Apple's latest SoC
But the M5 fails to offer competitive performance in multi-threaded CPU-Z test.
October 24, 2025 — Source

Computer — Processors — October 20th, 2025

AMD Krackan Point Is Reportedly Coming To AM5; New AGESA BIOS Adds Support For Zen 5 APUs
We may finally see the Zen 5-based AMD APUs on the mainstreak desktop AM5 platform very soon as the upcoming AGESA BIOS has reportedly added support for the APU series.
October 20, 2025 — Source

NVIDIA "Vera Rubin" NVL144 Servers Set for 2026 Volume Production
Foxconn is preparing for mass production of NVIDIA's high-density "Vera Rubin" liquid-cooled racks in 2026, expanding facilities to meet demand.
October 20, 2025 — Source

Computer — Processors — October 15th, 2025

AMD and Intel are working together to standardize the future of x86 processors
The chipmakers are rolling out unified improvements for performance, safety, and compatibility
October 15, 2025 — Source

How Panther Lake is made: We went inside Intel's most advanced chip fab
The brand new fabrication plant at Intel's Arizona location is one of the most complex facilities on the planet.
October 15, 2025 — Source

MIPS I8500 Processor Orchestrates Data Movement for the AI Era
MIPS, a GlobalFoundries company, announced today the MIPS I8500 processor is now sampling to lead customers. Featured at GlobalFoundries' Technology Summit in Munich, Germany today, the I8500 represents a class of intelligent data movement processor IP designed for real-time, event-driven computing platforms.
October 15, 2025 — Source

Synaptics Launches the Next Generation of Astra Multimodal GenAI Edge Processors
Synaptics Incorporated, announces the new Astra SL2600 Series of multimodal Edge AI processors designed to deliver exceptional power and performance. The Astra SL2600 series enables a new generation of cost-effective intelligent devices that make the cognitive Internet of Things possible.
October 15, 2025 — Source

Computer — Processors — October 13th, 2025

AMD "Sound Wave" APU with 32x27mm package appears in shipping manifests
According to the listing, Sound Wave uses a BGA-1074 package measuring 32 × 27 mm, so a small chip, matching mobile SoC standards and indicating a design aimed at compact or handheld devices. It also adopts the FF5 interface with a 0.8 mm pitch, replacing the older FF3 connector used in devices such as the Valve Steam Deck.
October 13, 2025 — Source

Cutting-edge imaging and faster algorithms for finding minuscule defects in semiconductor chips
High-resolution X-ray imaging and advanced algorithms are being developed to detect and analyze minuscule defects in semiconductor chips more efficiently. This approach enables nondestructive, rapid identification of critical defects during manufacturing, improving reliability and potentially predicting device failure timelines. Integration of artificial intelligence further accelerates and automates defect detection.
October 13, 2025 — Source

Intel 18A Gets Head Start on TSMC N2 with Fab 52 Ramp
Intel announced this week that its Panther Lake processors have entered volume production at Fab 52 using the company's 18A node, which is touted as the first 2 nm-class process to achieve high-volume manufacturing. This milestone gives Intel a slight timing advantage over rival foundries like TSMC, with its N2 node, and Samsung with its SF2 node. However, being first does not guarantee a lasting lead. Customers, partners, and investors will focus on Intel's ability to maintain parametric yields, control manufacturing costs per unit, and expand 18A beyond limited compute tiles.
October 13, 2025 — Source

Lattice MachXO5-NX TDQ prepares organizations for quantum-era security threats
Lattice Semiconductor introduced the Lattice MachXO5-NX TDQ family, a secure control FPGAs with full Commercial National Security Algorithm (CNSA) 2.0-compliant post-quantum cryptography (PQC) support.
October 13, 2025 — Source

Computer — Processors — October 10th, 2025

AMD taps TSMC's 2nm node to challenge Nvidia in next-gen AI compute
2nm leap with MI450 chip could reshape competition
October 10, 2025 — Source

Have DIY PCs peaked? Why Intel's Panther Lake reveal gave me existential dread
I want desktop PCs and PC building to thrive.
October 10, 2025 — Source

Intel 13th And 14th Gen SKUs See A Noticeable Price Hike In Japan, Making Popular CPUs Like Core i5 14400F 20% Expensive
The best-selling Intel 13th and 14th-gen CPUs are already seeing a price increase since Intel announced a price hike for the Japanese market.
October 10, 2025 — Source

Intel Debuts 18A Chips With Panther Lake CPUs for Laptops
The new processors will also land in servers for data centers.
October 10, 2025 — Source

Computer — Processors — October 8th, 2025

Intel Panther Lake SKUs Appear in Apparent Leak
The 18A-based Core Ultra 300 chips will give laptops a boost.
October 8, 2025 — Source

Programmable optical chip merges photons to change color
Cornell researchers have built a programmable optical chip that can change the color of light by merging photons, without requiring a new chip for new colors.
October 8, 2025 — Source

Thermaltake Launches AW360/420 AIO Liquid Cooler and WAir CPU Cooler for Workstations
Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly announces the availability of the AW360/420 AIO Liquid Coolers and the WAir CPU Cooler, two high-performance cooling solutions designed specifically for modern workstations. Built for professionals tackling demanding workloads such as 3D rendering, AI computing, CAD design, and big data analytics, these coolers are engineered to deliver exceptional thermal performance, stability, and low noise under continuous high-load conditions.
October 8, 2025 — Source

TSMC's 2nm Customers Can Take A Breather; Wafers Reportedly Only 10-20 Percent More Expensive Than 3nm But There Is A Catch
TSMC's 2nm wafers will reportedly cost 10-20 percent more than 3nm, but this is due to TSMC also increasing 3nm prices, maintaining a $30,000 per unit cost.
October 8, 2025 — Source

Computer — Processors — October 3rd, 2025

Intel's next-gen Nova Lake and Diamond Rapids microarchitectures get official confirmation — Latest ISA reference doc details the P-Cores and E-Cores upcoming CPUs will use
Intel officially confirmed Nova Lake and Diamond Rapids microarchitectures, detailing new Coyote Cove and Arctic Wolf cores. Nova Lake will use TSMC's 18A process.
October 3, 2025 — Source

Qualcomm's big win over Arm could reverberate throughout the industry — ALA licensees could potentially develop custom designs without renegotiating terms
Qualcomm won a legal victory against Arm, affirming its right to use Nuvia technology and potentially allowing licensees to develop custom CPUs without renegotiating terms.
October 3, 2025 — Source

SiPearl unveils Europe's first dual-use sovereign processor with 80 cores — expected in 2027 for government, aerospace, and defense applications
SiPearl unveiled Athena1, Europe's first dual-use processor with up to 80 cores, designed for government, aerospace, and defense applications, expected in 2027.
October 3, 2025 — Source

Snapdragon X2 Elite hype is real. So why am I so wary?
I don't like what I see in the mirror.
October 3, 2025 — Source

Thermal Grizzly Introduces Minus Pad extreme 2 & Minus Pad High Compression Thermal Pads
Thermal Grizzly released Minus Pad extreme 2 thermal pads, offering improved thermal conductivity and a new material composition. They also introduced Minus Pad High Compression pads for versatile cooling.
October 3, 2025 — Source

Trusted enclaves from Intel and AMD shown vulnerable to physical attacks
Academic teams bypass chip-level enclave protections with low-cost hardware
October 3, 2025 — Source